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Renesas 71V65903S85PFG

Part No.:
71V65903S85PFG
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V65903S85PFG.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,748

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Product details

Overview

71V65903S85PFG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 512K × 18 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access. It implements zero bus turnaround (ZBT) architecture to eliminate dead cycles between read/write transitions, features flow-through outputs, and uses a synchronous burst counter for 4-word interleaved or linear bursts. It serves as high-speed buffer memory in network packet processors and telecom line cards requiring deterministic latency.

For engineers reviewing the 71V65903S85PFG datasheet, 71V65903S85PFG pinout, 71V65903S85PFG application, or 71V65903S85PFG equivalent, key selection criteria include ZBT timing compliance, 3.3V I/O supply (VDDQ) tolerance, industrial temperature support (–40°C to +85°C), TQFP-100 package compatibility, and byte-write enable (BW1–BW2) control for x18 configuration.

Technical Context

The 71V65903S85PFG employs a synchronous dual-register architecture: address/control inputs are registered on the rising CLK edge with ADV/LD low for load operations, while data input is registered and output is flow-through (no output register). Its burst counter advances on ADV/LD high, enabling four-cycle data transfers per address with LBO selecting interleaved or linear order.

It supports three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, asynchronous OE and ZZ controls, and CEN-suspended operation. The device guarantees data retention in sleep mode (ZZ = HIGH) and tri-states its I/O bus one cycle after deselect - critical for multi-SRAM bus arbitration in high-throughput systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 18 (9.4 Mbit); supports x18 data width only in this variant
Clock Frequency 100 MHz maximum; enables 10 ns cycle time for sustained burst throughput
Access Time 7.5 ns clock-to-data (tCD); defines minimum latency from CLK rise to valid Q output
Supply Voltages VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate rails allow I/O voltage optimization
Operating Temperature –40°C to +85°C (industrial grade); validated for base station and industrial control environments
Burst Capability 4-word burst (interleaved or linear); reduces address bus traffic by 75% per burst sequence
Byte Write Control BW1, BW2 active-low enables; supports partial writes to upper/lower 9-bit bytes in x18 mode

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, lead-free and RoHS-compliant. Pinout optimized for signal integrity with distributed VDDQ/VSS pairs and dedicated ground planes.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs 19-bit synchronous address bus; A0–A17 used for 512K × 18 addressing (A18 selects bank in expanded configs)
CE1, CE2, CE2 Chip Enables Three independent enables: CE1/CE2 active-low, CE2 active-high; enable depth expansion without external logic
R/W Read/Write Control Synchronous command signal; sampled at CLK rise with ADV/LD low to initiate cycle type
ADV/LD Advance Burst / Load Address Low = load new external address; High = increment internal burst counter; defines burst boundary
BW1, BW2 Byte Write Enables Active-low controls for lower (I/O0–I/O8, I/OP1) and upper (I/O9–I/O17, I/OP2) 9-bit bytes in x18 mode
CLK System Clock Input Rising-edge-triggered master clock; all synchronous timing referenced to this edge
OE Output Enable Asynchronous; drives I/O pins to high-Z when HIGH - usable for bus sharing without timing constraints
ZZ Sleep Mode Input Asynchronous HIGH activates power-down mode; retains data while reducing ICC to ≤5 mA
I/O0–I/O17, I/OP1–I/OP2 Data I/O Bus 18-bit bidirectional data path (16 data + 2 parity pins); flow-through output eliminates output register delay
VDD, VDDQ, VSS Power/Ground VDD (core), VDDQ (I/O), and multiple VSS pins decoupled per JEDEC TQFP layout for noise suppression

Key Features

Feature Design Value
ZBTTM Architecture Eliminates bus turnaround dead cycles between reads and writes - enables back-to-back transactions at full clock rate
Internally Synchronized OE Removes need for external OE timing control; outputs remain valid across clock boundaries during read bursts
Single R/W Pin Reduces control bus complexity vs. separate RD/WR signals; simplifies FPGA/CPLD interface logic
Flow-Through Outputs Delivers data one clock cycle after address/control setup - no added output register latency
Four-Word Burst Supports both interleaved and linear sequences via LBO pin; cuts address strobes by 75% per memory access group
Industrial Temp Range Rated –40°C to +85°C; qualified for deployment in uncontrolled ambient environments like outdoor telecom cabinets

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in real-time switching fabric.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer SRAM interfacing directly with MAC or framer ASICs.

Use Value: ZBT architecture enables seamless read-after-write transitions required for cut-through packet forwarding at 10 Gbps line rates.

Use Scenario: Frame assembly/disassembly and header processing in DSLAM or OLT line cards.

IC Role / Device Role / Timing Role: Synchronous burst-access scratchpad for protocol engine microcode execution and payload buffering.

Use Value: 4-word burst mode reduces address bus overhead by 75%, increasing effective bandwidth to 1.8 GB/s at 100 MHz.

Industrial PLC Data Logging Radar Signal Processing Buffer

Use Scenario: Cyclic acquisition and timestamped storage of sensor data in programmable logic controllers.

IC Role / Device Role / Timing Role: Deterministic-access memory for cyclic data capture buffers synchronized to real-time OS tick.

Use Value: Guaranteed 7.5 ns tCD and industrial temp rating ensure consistent timing margins across thermal cycling in factory environments.

Use Scenario: Intermediate storage of digitized IF samples between ADC and FFT engine in phased-array radar systems.

IC Role / Device Role / Timing Role: Low-jitter, flow-through SRAM acting as ping-pong buffer for streaming ADC data at >60 MSPS.

Use Value: Asynchronous ZZ sleep mode allows dynamic power gating between chirps, cutting standby current to <5 mA without data loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1372KV18 512K × 18, 133 MHz max, 5.5 ns tCD; uses QDR-II+ interface with separate read/write clocks Requires dual-clock domain design; not ZBT-compatible; higher bandwidth but more complex timing closure Select when system demands >100 MHz sustained burst throughput and can accommodate QDR-II+ interface logic
AS7C35128P 512K × 18, 100 MHz, 8 ns tCD; standard sync SRAM (no ZBT or burst counter); single R/W pin Lacks zero turnaround and burst capability - requires full address reassertion every cycle Choose for cost-sensitive designs where ZBT timing and burst efficiency are non-critical

Compared with CY7C1372KV18 and AS7C35128P, the 71V65903S85PFG uniquely delivers ZBT timing and integrated burst counter in a pin-compatible TQFP-100 package - enabling drop-in replacement in legacy IDT-based systems while maintaining deterministic sub-10 ns latency.

Availability

71V65903S85PFG is available at Aetrix Electronics and suitable for network infrastructure, telecom line cards, and industrial control systems requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for 71V65903S85PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 71V65903S85PFG belongs to IDT's ZBT SRAM product line, engineered specifically for low-latency, high-throughput packet buffering and real-time signal processing in carrier-grade networking equipment.

FAQ

What is the memory organization of the 71V65903S85PFG?

The 71V65903S85PFG is organized as 512K × 18, delivering 9,437,184 bits of storage. This configuration uses 19 address lines (A0–A18), with A0–A17 selecting one of 512K locations and A18 reserved for future expansion or bank selection. It does not support the 256K × 36 mode - that is exclusive to the 71V65703 variant.

Does the 71V65903S85PFG support burst mode, and how is it configured?

Yes, the 71V65903S85PFG supports 4-word burst mode using an internal synchronous counter. Burst sequence order (interleaved or linear) is selected by the LBO pin: LBO = HIGH enables interleaved, LBO = LOW enables linear. Burst initiation occurs when ADV/LD is sampled HIGH at the rising CLK edge, and the counter wraps automatically after four words.

What are the voltage requirements for VDD and VDDQ on the 71V65903S85PFG?

The 71V65903S85PFG requires VDD = 3.3 V ±5% (3.135 V to 3.465 V) for core logic and VDDQ = 3.3 V ±5% (3.135 V to 3.465 V) for I/O drivers. These supplies may be derived from separate regulators to minimize noise coupling; VDDQ must not exceed VDD + 0.5 V per absolute maximum ratings.

How does the 71V65903S85PFG handle chip select and deselection?

The 71V65903S85PFG uses three chip enables: CE1 and CE2 (active-low) plus CE2 (active-high). The device is enabled only when CE1 = LOW, CE2 = LOW, and CE2 = HIGH. Deselection initiates on the rising CLK edge when any CE violates this condition, and the I/O bus tri-states exactly one clock cycle later - ensuring clean bus release without glitches.

Is the 71V65903S85PFG compatible with industrial temperature operation?

Yes, the 71V65903S85PFG is fully specified and tested for industrial temperature operation from –40°C to +85°C. This includes validation of AC timing parameters (e.g., 7.5 ns tCD), DC characteristics (leakage, VIH/VIL), and functional reliability across the full range - making it suitable for deployment in outdoor telecom enclosures and factory automation systems.

71V65903S85PFG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V65903S85PFG FAQ

1.How can I place an order for 71V65903S85PFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65903S85PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65903S85PFG reliable?

The price and inventory of 71V65903S85PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65903S85PFG is usually 5 days.

3.What payment methods are accepted for 71V65903S85PFG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65903S85PFG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65903S85PFG?

71V65903S85PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65903S85PFG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65903S85PFG?

For technical support, including 71V65903S85PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65903S85PFG requirements.

6.How does Aetrix verify that 71V65903S85PFG is sourced from the original manufacturer or authorized distributors?

All 71V65903S85PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65903S85PFG meets industry standards.

7.What is the process for return or replacement of 71V65903S85PFG?

All 71V65903S85PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65903S85PFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65903S85PFG part is unused and in its original packaging.

Return procedure for 71V65903S85PFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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