Renesas 71V65903S85PFGI
- Part No.:
- 71V65903S85PFGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65903S85PFGI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,851
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Product details
Overview
71V65903S85PFGI from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 512K x 18 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access, zero bus turnaround (ZBT) architecture, flow-through outputs, and burst counter functionality - deployed in high-speed packet buffering, network switch fabric, and real-time DSP memory subsystems.
For engineers reviewing the 71V65903S85PFGI datasheet, 71V65903S85PFGI pinout, 71V65903S85PFGI application, or 71V65903S85PFGI equivalent, key selection criteria include its 100 MHz synchronous interface, 4-word interleaved/linear burst capability, individual byte write control (BW1–BW2), industrial temperature range (–40°C to +85°C), and JEDEC-standard 100-pin TQFP package with VDDQ-separated I/O supply.
Technical Context
The 71V65903S85PFGI implements a synchronous, clocked architecture where address/control registration occurs on the rising CLK edge, with data output appearing one cycle later via flow-through path (no output register). Its internal burst counter advances on ADV/LD = HIGH, enabling four consecutive accesses per address load.
ZBT operation eliminates dead cycles between read/write transitions by overlapping bus enable/disable with data transfer timing; OE is asynchronous but typically tied low, while ZZ enables low-power sleep mode with guaranteed data retention. The device uses three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion and supports both linear and interleaved burst sequences via static LBO pin configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18 (9.4 Mbit); supports depth expansion via CE pins |
| Max Clock Frequency | 100 MHz; enables 10 ns cycle time for high-throughput streaming |
| Clock-to-Data Access | 7.5 ns; defines minimum latency from CLK rise to valid Q output |
| Burst Capability | 4-word linear or interleaved burst; reduces address bus traffic by 75% per load |
| Supply Voltages | VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O); enables mixed-voltage system interfacing |
| Operating Temperature | –40°C to +85°C (industrial grade); qualified for embedded telecom and industrial control |
| Zero Bus Turnaround | Eliminates idle cycles between read/write transitions; sustains full bandwidth during mixed-access patterns |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, with exposed thermal pad (PFGI suffix denotes industrial-grade TQFP).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Synchronous timing reference; all registered inputs sampled on rising edge |
| ADV/LD | Address load / burst advance | LOW loads new external address; HIGH increments internal burst counter |
| R/W | Read/write control | Synchronous signal defining cycle type; determines D/Q direction one cycle later |
| BW1, BW2 | Byte write enables | Active-low controls write to lower/upper 9-bit bytes (I/O[0:8], I/O[9:17]); supports partial writes |
| CE1, CE2, CE2 | Chip enables | Three independent enables (CE1/CE2 active-low, CE2 active-high) allow flexible depth expansion |
| LBO | Burst order select | Static input: LOW = linear burst, HIGH = interleaved burst sequence |
| ZZ | Sleep mode | Asynchronous HIGH gates internal clock and reduces power; retains memory contents |
| OE | Output enable | Asynchronous LOW enables flow-through outputs; may be tied low for simplified interface |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Enables immediate read-after-write or write-after-read without bus idle cycles, maximizing sustained bandwidth |
| Flow-through output architecture | Eliminates output register delay; data appears one clock after address/control setup, reducing latency |
| Internally synchronized OE | Removes need for precise OE timing control; outputs remain stable across clock edges when OE is asserted |
| Single R/W pin with burst counter | Reduces control bus width vs. discrete RD/WR signals; burst counter automates sequential addressing |
| Separate VDDQ I/O supply | Allows independent I/O voltage scaling and noise isolation from core logic, improving signal integrity |
Applications
| Packet Buffering in Network Switches | Real-Time DSP Data Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switching ASICs with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfaced directly to switch fabric controller. Use Value: 100 MHz operation and ZBT architecture sustain >95% bus utilization during mixed read/write bursts, minimizing packet drop under congestion. | Use Scenario: Holding coefficient tables, filter states, and intermediate samples in multi-channel audio or radar processing systems. IC Role / Device Role / Timing Role: Synchronous scratchpad memory accessed by DSP core via parallel bus with deterministic 7.5 ns access. Use Value: Flow-through outputs and 4-word burst reduce instruction overhead and memory wait states, enabling real-time FFT and FIR execution. |
| Industrial PLC I/O Data Exchange | Medical Imaging Frame Buffer |
Use Scenario: Caching sensor input and actuator output data across multiple scan cycles in deterministic motion control systems. IC Role / Device Role / Timing Role: Dual-port accessible memory buffer synchronized to PLC scan clock for atomic read-modify-write operations. Use Value: Industrial temperature rating (–40°C to +85°C) and robust CE-based deselection ensure reliable operation in harsh factory environments. | Use Scenario: Temporary storage of uncompressed CT/MRI pixel frames during reconstruction pipeline preprocessing. IC Role / Device Role / Timing Role: High-speed frame buffer interfaced to image processor and DMA controller for burst-aligned pixel transfers. Use Value: 512K × 18 organization matches 16-bit grayscale pixel width; 7.5 ns access enables real-time line-rate buffering at 60+ fps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1375BV33-100AXC | 512K × 18, 100 MHz, 3.3V, but uses pipelined (not flow-through) outputs and lacks ZBT architecture | Higher latency (10 ns clock-to-data) and requires explicit bus turnaround management | Select when system design accommodates pipelined timing and does not require zero-cycle turnaround |
| AS7C35128P-10JCN | 512K × 18, 10 ns access, but asynchronous interface - no clock, no burst counter, no ZBT | Lower peak bandwidth, no burst capability, incompatible with synchronous fabric timing | Select only for legacy designs requiring simple async SRAM replacement without timing rework |
Compared with CY7C1375BV33-100AXC and AS7C35128P-10JCN, the 71V65903S85PFGI delivers deterministic 7.5 ns flow-through latency and hardware-accelerated ZBT operation - critical for sustaining full bandwidth in burst-intensive, mixed-access memory subsystems without software or logic overhead.
Availability
71V65903S85PFGI is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical imaging systems requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.
Supply support for 71V65903S85PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.
The 71V65903S85PFGI belongs to IDT's ZBT™ SRAM product line, designed specifically for zero-latency, high-throughput memory subsystems in networking, telecom, and real-time embedded systems demanding deterministic burst access and seamless read/write transitions.
FAQ
What is the memory organization and total capacity of the 71V65903S85PFGI?
The 71V65903S85PFGI is organized as 512K × 18, delivering 9,437,184 bits (9.4 Mbit) of synchronous SRAM. This configuration supports 18-bit data paths and is optimized for systems requiring balanced depth and width - such as network packet buffers and DSP data memory - with native compatibility for depth expansion using its three chip enable pins.
Does the 71V65903S85PFGI support burst read and write operations, and how is burst order controlled?
Yes, the 71V65903S85PFGI supports 4-word burst reads and writes using an internal counter. Burst order is selected via the LBO pin: LOW configures linear sequence (A0, A1, A2, A3), HIGH selects interleaved (A0, A2, A1, A3). The ADV/LD pin controls counter behavior - LOW loads a new address, HIGH advances the counter - enabling efficient sequential access without external address generation.
What is the role of the ZZ pin on the 71V65903S85PFGI, and does it retain data during sleep mode?
The ZZ pin is an asynchronous sleep mode input; when driven HIGH, it internally gates the clock and reduces power consumption to the lowest level while guaranteeing data retention. The 71V65903S85PFGI maintains stored memory contents in ZZ mode across its full industrial temperature range (–40°C to +85°C), making it suitable for power-sensitive applications with periodic activity bursts.
How does the 71V65903S85PFGI implement Zero Bus Turnaround (ZBT), and what benefit does it provide?
The 71V65903S85PFGI implements ZBT by eliminating idle bus cycles between read and write operations through synchronized control logic and flow-through outputs. This allows immediate transition from one access type to another without waiting for bus release/reacquisition - sustaining near-peak bandwidth in mixed-access workloads like packet forwarding or real-time filtering, where traditional SRAMs incur 1–2 cycle penalties per turnaround.
What package type and pin count does the 71V65903S85PFGI use, and is it RoHS-compliant?
The 71V65903S85PFGI uses a 100-pin plastic thin quad flatpack (TQFP) per JEDEC MO-145, with 14 mm × 20 mm body size and exposed thermal pad (PFGI suffix). It is RoHS-compliant and qualifies as a green part per IDT's environmental policy - verified by lead-free terminations and halogen-free molding compound, meeting IPC/JEDEC J-STD-609A Class 1 requirements.
71V65903S85PFGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V65903S85PFGI FAQ
1.How can I place an order for 71V65903S85PFGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65903S85PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65903S85PFGI reliable?
The price and inventory of 71V65903S85PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65903S85PFGI is usually 5 days.
3.What payment methods are accepted for 71V65903S85PFGI?
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71V65903S85PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65903S85PFGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65903S85PFGI?
For technical support, including 71V65903S85PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65903S85PFGI requirements.
6.How does Aetrix verify that 71V65903S85PFGI is sourced from the original manufacturer or authorized distributors?
All 71V65903S85PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65903S85PFGI meets industry standards.
7.What is the process for return or replacement of 71V65903S85PFGI?
All 71V65903S85PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65903S85PFGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65903S85PFGI part is unused and in its original packaging.
Return procedure for 71V65903S85PFGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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