Renesas 71V65903S85PFGI8
- Part No.:
- 71V65903S85PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65903S85PFGI8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65903S85PFGI8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM organized as 512K × 18 (9,437,184-bit), supporting 100 MHz operation with 7.5 ns clock-to-data access. It implements zero bus turnaround (ZBT), burst counter logic, flow-through outputs, and individual byte write control - deployed in high-speed packet buffering, network switch fabric, and real-time DSP memory subsystems.
For engineers reviewing the 71V65903S85PFGI8 datasheet, 71V65903S85PFGI8 pinout, 71V65903S85PFGI8 application, or 71V65903S85PFGI8 equivalent, key selection criteria include ZBT timing compliance, 3.3V I/O compatibility, industrial temperature support (–40°C to +85°C), TQFP-100 packaging, and burst mode configuration via ADV/LD and LBO.
Technical Context
The 71V65903S85PFGI8 uses a synchronous CMOS architecture with registered address/control inputs and flow-through data outputs - eliminating output registers to minimize read latency. Its internal burst counter advances on ADV/LD = HIGH, supporting linear or interleaved 4-word bursts selected by the static LBO pin.
Three chip enables (CE1, CE2 active-low; CE2 active-high) enable depth expansion without external logic. Clock Enable (CEN) suspends all synchronous operations while preserving register state, and asynchronous ZZ input places the device in low-power sleep mode with guaranteed data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18 (9.4 Mbit); supports x18 interface with 19 address pins (A0–A18) |
| Max Clock Frequency | 100 MHz; enables 10 ns cycle time for high-throughput streaming applications |
| Access Time | 7.5 ns clock-to-data; defines minimum latency from CLK rising edge to valid Q output |
| Supply Voltage | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); decoupling required per JEDEC TQFP layout |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for extended thermal cycling in telecom infrastructure |
| Burst Capability | 4-word linear/interleaved burst; reduces address bus traffic by 75% per burst sequence |
| Byte Write Control | BW1–BW2 (x18 config); enables selective 9-bit word writes without masking logic |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout conforms to PKG100 footprint for 512K × 18 configuration (per datasheet drawing 5298 drw 02a).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CE1, CE2, CE2 | Chip Enables | CE1/CE2 active-low, CE2 active-high; any false CE initiates one-cycle deselect (tri-state on next CLK) |
| R/W | Read/Write Control | Synchronous; determines cycle type at burst initiation; ignored during counter advancement |
| ADV/LD | Address Load / Burst Advance | LOW loads new external address; HIGH increments internal burst counter |
| LBO | Burst Order Select | Static input; LOW = linear burst, HIGH = interleaved burst (no runtime reconfiguration) |
| BW1, BW2 | Byte Write Enables | Active-low; controls 9-bit words I/O[0:8]/I/OP1 and I/O[9:17]/I/OP2 respectively (x18 config) |
| CLK | System Clock | Rising-edge triggered; all synchronous timing referenced to this edge (except OE, ZZ) |
| OE | Output Enable | Asynchronous; tri-states outputs when HIGH; may be tied LOW for continuous read operation |
| ZZ | Sleep Mode | Asynchronous HIGH; gates internal CLK and reduces power; data retained |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O | Bi-directional; input path registered, output path flow-through (no output register delay) |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates dead cycles between read/write transitions - enables back-to-back memory accesses without bus turnaround overhead |
| Internally Synchronized OE | Removes need for external OE timing control; output buffer enable derived from internal clock domain |
| Single R/W Pin | Reduces control signal count vs. separate RD/WR lines - simplifies FPGA/CPLD interface logic |
| 4-Word Burst Counter | Generates sequential addresses internally - cuts external address generation logic and routing congestion |
| Individual Byte Write | Enables partial-word updates without read-modify-write; BW1/BW2 support 9-bit granularity in x18 mode |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing variable-length Ethernet frames in ingress/egress queues of Layer 2 switches. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with deterministic 7.5 ns read access. Use Value: ZBT architecture enables immediate read-after-write for header modification, avoiding pipeline stalls in cut-through forwarding. | Use Scenario: Frame assembly/disassembly in TDM-over-packet gateways operating across –40°C to +85°C ambient. IC Role / Device Role / Timing Role: Synchronous memory for time-slot interchange (TSI) buffers requiring burst-aligned data transfers. Use Value: Industrial temp rating and 100 MHz burst capability ensure jitter-free voice sample handling under thermal stress. |
| DSP Algorithm Scratchpad | FPGA Co-Processor Cache |
Use Scenario: Real-time FFT coefficient storage and butterfly-stage data exchange in radar signal processors. IC Role / Device Role / Timing Role: Low-latency scratchpad memory interfaced directly to dual-ported DSP core via x18 bus. Use Value: Flow-through outputs and 4-word burst reduce instruction stall cycles during vectorized memory access patterns. | Use Scenario: Off-chip cache for FPGA-based video encoder accelerating motion estimation and quantization. IC Role / Device Role / Timing Role: High-speed external memory providing parallel pixel block access to FPGA fabric. Use Value: TQFP-100 package enables dense PCB layout; CEN and ZZ support dynamic power gating during idle intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV33-100AXC | 512K × 18, 100 MHz, but uses QDR-II architecture with separate read/write ports and no ZBT mode | Requires dual-port controller logic; lacks zero-turnaround benefit for mixed R/W workloads | Select when simultaneous read/write bandwidth > 1.6 GB/s is required and system can manage dual-port protocol overhead |
| AS7C35128PFS-10BIN | 512K × 18, 100 MHz, standard sync SRAM (no ZBT, no burst counter, no ADV/LD) | Needs external address sequencer for burst; higher software/hardware overhead for sequential access | Select when ZBT complexity is unnecessary and legacy sync SRAM compatibility is prioritized over latency reduction |
Compared with CY7C1355BV33-100AXC and AS7C35128PFS-10BIN, the 71V65903S85PFGI8 uniquely delivers zero bus turnaround with integrated burst addressing - reducing control logic, improving effective bandwidth in mixed-access scenarios, and lowering system-level timing margin risk.
Availability
71V65903S85PFGI8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, DSP algorithm scratchpad, and FPGA co-processor cache applications requiring stable component supply, long-term industrial temperature support, and JEDEC-compliant TQFP packaging.
Supply support for 71V65903S85PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V65903S85PFGI8 belongs to IDT's ZBT™ SRAM product line, designed specifically for low-latency, high-throughput memory subsystems in networking, telecom, and real-time signal processing equipment where deterministic bus turnaround and burst efficiency are critical.
FAQ
What memory organization does the 71V65903S85PFGI8 support?
The 71V65903S85PFGI8 is organized as 512K × 18 (9,437,184 bits), using 19 address lines (A0–A18) and 18 data I/O lines plus two parity pins (I/OP1, I/OP2). This x18 configuration is distinct from the 256K × 36 variant and requires dedicated pin mapping per the PKG100 512K × 18 layout.
Does the 71V65903S85PFGI8 support zero bus turnaround (ZBT) in both read and write directions?
Yes, the 71V65903S85PFGI8 supports true ZBT operation: it eliminates dead cycles between any read-to-write or write-to-read transitions. This is achieved through internal synchronization of OE and burst control, enabling immediate bus direction reversal without external wait-state insertion - a core feature confirmed in the functional description and timing tables.
How is burst mode configured on the 71V65903S85PFGI8?
Burst mode on the 71V65903S85PFGI8 is controlled by ADV/LD and LBO. ADV/LD = HIGH advances the internal counter for 4-word bursts; LBO = LOW selects linear order, LBO = HIGH selects interleaved order. The burst sequence is fixed per LBO state and cannot be changed mid-burst - verified in Tables 10 and 11 of the datasheet.
What is the role of the three chip enable pins (CE1, CE2, CE2) on the 71V65903S85PFGI8?
The 71V65903S85PFGI8 uses CE1 and CE2 as active-low enables and CE2 as an active-high enable. The device is selected only when CE1 = LOW, CE2 = LOW, and CE2 = HIGH simultaneously. Any violation initiates a one-cycle deselect - tri-stating outputs on the next clock edge - enabling simple depth expansion without glue logic.
Can the 71V65903S85PFGI8 operate in low-power mode, and how is it activated?
Yes, the 71V65903S85PFGI8 supports low-power sleep mode via the asynchronous ZZ pin. When ZZ is driven HIGH, the internal clock is gated and power consumption drops to minimum while data retention is guaranteed. This mode is independent of CEN and remains active until ZZ returns LOW - confirmed in Pin Definitions and DC Characteristics sections.
71V65903S85PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V65903S85PFGI8 FAQ
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6.How does Aetrix verify that 71V65903S85PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V65903S85PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65903S85PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V65903S85PFGI8?
All 71V65903S85PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65903S85PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65903S85PFGI8 part is unused and in its original packaging.
Return procedure for 71V65903S85PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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