Renesas 71V67602S133PFG8
- Part No.:
- 71V67602S133PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V67602S133PFG8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IDT71V67602S133PFG8 from Integrated Device Technology is a 256K × 36-bit (9-Mbit), 3.3V synchronous SRAM with 2.5V I/O, pipelined outputs, and single-cycle deselect. It supports 133MHz operation with 4.2ns clock access time, burst counter addressing, and linear/interleaved burst modes via LBO pin. Used in high-speed cache and buffer applications requiring deterministic timing and low-latency data access.
For engineers reviewing the IDT71V67602S133PFG8 datasheet, IDT71V67602S133PFG8 pinout, IDT71V67602S133PFG8 application, or IDT71V67602S133PFG8 equivalent, key selection criteria include synchronous burst read/write capability, 100-pin TQFP package compatibility, 3.3V core / 2.5V I/O supply separation, ZZ sleep mode support, and pipelined output timing compliance with 133MHz system clocks.
Technical Context
The IDT71V67602S133PFG8 implements a synchronous interface with registered address, control, and data paths triggered on the rising edge of CLK. Its internal burst address counter advances on ADV=LOW and selects sequence order (linear or interleaved) based on static LBO input state - no runtime reconfiguration permitted.
Burst writes are self-timed using GW (global write), BWE (byte write enable), and BW1–BW4 (individual byte enables), with asynchronous OE and ZZ inputs enabling output disable and full sleep mode respectively. The device features dual power domains (VDD=3.3V, VDDQ=2.5V) and supports commercial temperature range (0°C to +70°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9,175,040 bits); supports 512K × 18-bit configuration via address mapping |
| Clock Frequency | 133MHz maximum - defines minimum tCYC = 7.5ns for timing-critical synchronous bus design |
| Access Time | 4.2ns clock-to-data (tCD) - guarantees pipelined output validity at 133MHz without wait states |
| Supply Voltages | VDD = 3.3V ±5% (core logic), VDDQ = 2.5V ±5% (I/O drivers) - requires separate power rail filtering |
| Operating Temperature | 0°C to +70°C - validated for commercial-grade embedded systems and networking equipment |
| Package | 100-pin plastic thin quad flatpack (TQFP), 14mm × 20mm - JEDEC standard footprint with 0.5mm pitch |
| Power Modes | Active (IDD = 260mA max), CMOS standby (ISB1 = 50mA), full sleep (IZZ = 50mA) - enables dynamic power scaling |
Pinout & Package
Packaged in a JEDEC-standard 100-pin TQFP (14mm × 20mm, 0.5mm pitch), the IDT71V67602S133PFG8 features dedicated synchronous control inputs (CLK, CE, CS0, CS1, ADSP, ADSC, ADV, GW, BWE, BW1–BW4, OE), asynchronous sleep (ZZ) and burst order (LBO), 19 address lines (A0–A18), and 36 bidirectional data lines plus 4 parity pins (I/O0–I/O31, I/OP1–I/OP4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous inputs latched on rising CLK edge with ADSP/ADSC assertion; define 256K-word address space |
| CLK | Clock Input | Primary timing reference; all synchronous operations aligned to rising edge; no internal PLL |
| CE, CS0, CS1 | Chip Enable / Selects | Three-input chip select logic (CE=LOW, CS0=HIGH, CS1=LOW required for activation) |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE gates BWx; BW1–BW4 each control one 9-bit byte (including parity) |
| OE | Output Enable | Asynchronous - drives I/O pins to high-Z when HIGH, independent of CLK |
| ZZ | Sleep Mode Input | Asynchronous HIGH disables internal clock and reduces current to 50mA; retains data |
| LBO | Burst Order Selection | Static input - LOW = linear burst, HIGH = interleaved burst; must remain stable during operation |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | Synchronous bidirectional data bus; registered input/output paths; 36 data + 4 parity bits |
| VDD, VDDQ, VSS | Power/Ground | VDD (3.3V core), VDDQ (2.5V I/O), and multiple VSS pins - require local decoupling per JEDEC layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Burst Outputs | First data word available after one clock cycle; subsequent words delivered on next three rising edges - eliminates read turnaround delay |
| Single-Cycle Deselect | Device enters high-impedance state within one CLK cycle after CE/CS deassertion - prevents bus contention in multi-SRAM systems |
| Self-Timed Write Cycle | Internal timing generation eliminates external write pulse width constraints; supports GW-only or byte-selectable (BWx) writes |
| Dual-Voltage I/O Interface | 2.5V VDDQ enables direct interfacing with 2.5V logic families while maintaining 3.3V core performance and noise margin |
| Configurable Burst Mode | LBO pin selects linear or interleaved 4-word burst sequence - matches processor cache line ordering requirements |
Applications
| Cache Memory Subsystem | Network Packet Buffer |
|---|---|
Use Scenario: High-speed L2 cache between CPU and main memory in embedded RISC processors. IC Role / Device Role / Timing Role: Synchronous SRAM providing zero-wait-state burst reads/writes aligned to processor clock domain. Use Value: 133MHz operation and pipelined outputs reduce average memory latency by ≥30% versus asynchronous SRAMs in same footprint. | Use Scenario: Temporary storage for ingress/egress packet headers and metadata in Gigabit Ethernet switches. IC Role / Device Role / Timing Role: Dual-port-capable buffer supporting concurrent read (parser) and write (ingress engine) operations via burst addressing. Use Value: Single-cycle deselect and 4.2ns tCD ensure deterministic header forwarding latency under full line-rate traffic conditions. |
| Industrial PLC Data Logging | Medical Imaging Frame Buffer |
Use Scenario: Real-time acquisition and timestamped storage of sensor values in programmable logic controllers. IC Role / Device Role / Timing Role: Local high-speed scratchpad memory for cyclic data capture, buffered before transfer to flash or SD card. Use Value: ZZ sleep mode reduces idle power to 50mA, extending battery life in portable industrial diagnostics tools. | Use Scenario: Intermediate frame storage between image sensor interface and JPEG compression engine in ultrasound systems. IC Role / Device Role / Timing Role: Synchronous burst-access buffer synchronizing pixel clock (74.25MHz) with compression engine clock (133MHz). Use Value: 256K × 36 organization supports 1024×768 monochrome frames with parity protection; pipelined reads prevent pipeline stalls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-133AXC | Same 256K × 36 organization, 133MHz, 100-pin TQFP, but uses 3.3V-only I/O (no VDDQ separation) | Requires level-shifting for 2.5V logic interfaces; lacks dedicated ZZ sleep pin - uses power-down mode via control register | Select when existing 3.3V I/O infrastructure exists and sleep current <50mA is not required |
| AS7C36256PFSI-133 | 256K × 36, 133MHz, 100-pin TQFP, but rated for industrial temperature (−40°C to +85°C) and has higher ISB1 (70mA) | Validated for extended temperature environments; no LBO pin - fixed linear burst only | Select for automotive or outdoor industrial deployments where temperature range exceeds commercial spec |
Compared with CY7C1371DV33-133AXC and AS7C36256PFSI-133, the IDT71V67602S133PFG8 uniquely provides 2.5V I/O voltage separation and configurable burst ordering (LBO), enabling direct interface to 2.5V FPGAs and optimization for specific cache line layouts - critical for latency-sensitive real-time systems.
Availability
IDT71V67602S133PFG8 is available at Aetrix Electronics and suitable for high-speed cache subsystems, network packet buffering, industrial data logging, medical imaging frame storage, and real-time signal processing applications requiring stable component supply across long production lifecycles.
Supply support for IDT71V67602S133PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.
The IDT71V67602S133PFG8 belongs to IDT's 71V67xx family of synchronous SRAMs engineered for low-latency, burst-mode data buffering in bandwidth-constrained embedded systems operating at 133MHz and above.
FAQ
What is the maximum clock frequency supported by the IDT71V67602S133PFG8?
The IDT71V67602S133PFG8 is rated for 133MHz operation, corresponding to a minimum clock cycle time (tCYC) of 7.5ns. This rating is guaranteed across the commercial temperature range (0°C to +70°C) with VDD = 3.3V ±5% and VDDQ = 2.5V ±5%. Exceeding 133MHz violates AC timing specifications and may cause data corruption or metastability.
Does the IDT71V67602S133PFG8 support both linear and interleaved burst modes?
Yes, the IDT71V67602S133PFG8 supports both linear and interleaved burst sequences via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, the device executes linear burst addressing; when HIGH, it uses interleaved burst order. LBO is a static input and must remain stable during active operation - changing it mid-burst is undefined.
How does the ZZ pin function in the IDT71V67602S133PFG8?
The ZZ pin on the IDT71V67602S133PFG8 is an asynchronous sleep mode input. When pulled HIGH, it gates the internal clock and reduces supply current to 50mA (IZZ) while retaining memory contents. No sequencing is required - ZZ can be asserted at any time. To exit sleep mode, ZZ must be returned LOW and tZZR (100ns minimum) observed before initiating new accesses.
What is the role of the ADV pin in burst operation of the IDT71V67602S133PFG8?
The ADV (Burst Address Advance) pin controls burst counter progression in the IDT71V67602S133PFG8. When ADV is LOW during a valid read/write cycle, the internal burst counter increments to generate the next sequential address. When ADV is HIGH, the counter holds - suspending burst mode and repeating the current address for subsequent cycles. ADV is sampled synchronously on the rising CLK edge.
Can the IDT71V67602S133PFG8 operate with different supply voltages for core and I/O?
Yes, the IDT71V67602S133PFG8 requires two independent supplies: VDD = 3.3V ±5% for core logic and VDDQ = 2.5V ±5% for I/O buffers. This separation allows direct interfacing with 2.5V FPGAs, ASICs, or processors while maintaining 3.3V core speed and noise immunity. Mixing voltages or omitting either supply violates Absolute Maximum Ratings and will damage the device.
71V67602S133PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V67602S133PFG8 FAQ
1.How can I place an order for 71V67602S133PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67602S133PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V67602S133PFG8 reliable?
The price and inventory of 71V67602S133PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67602S133PFG8 is usually 5 days.
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6.How does Aetrix verify that 71V67602S133PFG8 is sourced from the original manufacturer or authorized distributors?
All 71V67602S133PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67602S133PFG8 meets industry standards.
7.What is the process for return or replacement of 71V67602S133PFG8?
All 71V67602S133PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67602S133PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67602S133PFG8 part is unused and in its original packaging.
Return procedure for 71V67602S133PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67602S133PFG8 Tags

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