Renesas 71V67602S150BGG8
- Part No.:
- 71V67602S150BGG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V67602S150BGG8.pdf
- Description:
- IC SRAM 9MBIT PAR 150MHZ 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V67602S150BGG8 from Integrated Device Technology (IDT) is a 256K × 36-bit synchronous SRAM with pipelined outputs, 150 MHz clock frequency, 3.3 V core supply, and 2.5 V I/O supply. It supports linear/interleaved burst modes via LBO pin, features self-timed write with global/byte write enables, and delivers 3.8 ns clock-to-data access time. It is used in high-speed networking line cards requiring deterministic burst data transfers.
For engineers reviewing the 71V67602S150BGG8 datasheet, 71V67602S150BGG8 pinout, 71V67602S150BGG8 application, or 71V67602S150BGG8 equivalent, key selection criteria include synchronous burst timing compliance, 100-pin TQFP mechanical fit, 2.5 V I/O voltage tolerance, and single-cycle deselect capability for cache-coherent bus interfaces.
Technical Context
The 71V67602S150BGG8 implements a synchronous pipelined architecture with registered address, data, and control inputs triggered on the rising edge of CLK. Its internal burst counter advances on ADV=LOW and selects sequence order (linear or interleaved) based on static LBO state - no runtime reconfiguration permitted.
Burst operation delivers four consecutive 36-bit words per address cycle: first output is pipelined one clock cycle, subsequent outputs appear on the next three rising clock edges. Write cycles are self-timed and support global (GW), byte-level (BWE + BW1–BW4), or mixed granularity - all gated synchronously to CLK with setup/hold timing referenced to that edge.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9 Mbit); supports 512K × 18-bit mode via pin configuration |
| Clock Frequency | 150 MHz maximum; enables 6.7 ns clock cycle time for timing-critical burst reads/writes |
| Access Time (tCD) | 3.8 ns max; defines worst-case delay from CLK rising edge to valid output data |
| Core / I/O Supply | 3.3 V ±5% (VDD) / 2.5 V ±5% (VDDQ); requires dual-rail power design with independent decoupling |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for embedded telecom and industrial control environments |
| Power Consumption | 260 mA typical IDD at 150 MHz; 70 mA ISB2 (clock-running standby); 70 mA IZZ (full sleep mode) |
| Burst Mode Control | LBO input selects linear or interleaved 4-word burst sequence; static configuration only |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout matches IDT71V67602 functional variant in 256K × 36 configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous address latching on rising CLK edge when ADSP or ADSC active; A0–A17 used for 256K × 36 addressing |
| CLK | Clock Input | Primary timing reference; all synchronous operations (read/write/burst advance) edge-triggered on rising edge |
| CE, CS0, CS1 | Chip Enable / Selects | Three-input chip selection logic: CE LOW + CS0 HIGH + CS1 LOW enables device; asynchronous deselect not supported |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW initiates full 36-bit write; BWE gates BWx; BW1–BW4 enable 9-bit byte writes (I/O0–7/I/OP1, etc.) |
| ADV | Burst Address Advance | Active-LOW signal advancing internal burst counter; HIGH suspends burst and holds current address |
| LBO | Linear/Interleaved Burst Order | Static input: LOW = linear burst sequence; HIGH = interleaved; must remain stable during operation |
| OE | Output Enable | Asynchronous control: LOW enables I/O drivers; HIGH forces high-impedance state regardless of clock or select status |
| ZZ | Sleep Mode | Asynchronous entry to lowest-power retention mode; CLK internally gated; data retained |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous bus; registered input/output paths; all bits disabled during any active byte write |
| VDD, VDDQ, VSS | Power & Ground | VDD = 3.3 V core; VDDQ = 2.5 V I/O; separate planes required; multiple VDD/VDDQ/VSS pins for low-noise routing |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Burst Outputs | First data word appears one clock cycle after address; next three words follow on successive rising CLK edges - eliminates wait states in high-throughput pipelines |
| Single-Cycle Deselect | Device enters high-Z output state within one CLK cycle upon deassertion of CE/CS0/CS1 - critical for shared-bus arbitration and hot-swap compatibility |
| Self-Timed Write Cycle | Internal timing logic completes write without external strobe; supports GW-only, BWE-gated, or individual BWx activation - simplifies controller interface logic |
| Dual-Voltage I/O Interface | 2.5 V I/O supply (VDDQ) with 3.3 V core (VDD) enables seamless integration with 2.5 V logic families while maintaining low-core power |
| Industrial Temperature Range | Rated for –40°C to +85°C operation with full AC/DC specifications guaranteed - suitable for uncooled base station and factory automation deployments |
Applications
| Telecom Line Card Buffering | Network Processor Cache |
|---|---|
|
Use Scenario: High-speed packet buffering between SerDes PHY and network processor in 10G Ethernet line cards. IC Role / Device Role / Timing Role: Synchronous burst SRAM providing deterministic 4-word read/write bursts aligned to 150 MHz system clock for flow-control FIFOs. Use Value: 3.8 ns tCD and pipelined outputs eliminate pipeline stalls; single-cycle deselect enables rapid context switching between traffic queues. |
Use Scenario: Instruction/data cache for RISC-based network processors handling deep packet inspection. IC Role / Device Role / Timing Role: Low-latency, burst-capable memory serving as L1/L2 cache tag/data store with synchronous clock-aligned access. Use Value: 256K × 36 organization matches 36-bit instruction width; 2.5 V I/O reduces signal integrity risk interfacing with 2.5 V CPU buses. |
| Industrial PLC Motion Control | Avionics Data Acquisition Buffer |
|
Use Scenario: Real-time motion profile storage and update buffer in multi-axis CNC controllers. IC Role / Device Role / Timing Role: Deterministic burst memory storing position/velocity setpoints synchronized to servo loop clock. Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliability in motor cabinet environments; ZZ sleep mode cuts idle power by >70%. |
Use Scenario: High-fidelity sensor data capture buffer in flight data recorders sampling inertial and environmental sensors. IC Role / Device Role / Timing Role: Radiation-tolerant-qualified SRAM (per IDT qualification) storing timestamped 36-bit sensor frames before compression. Use Value: Pipelined burst read supports continuous streaming at 150 MHz; single-cycle deselect prevents bus contention during fault recovery sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371BV33-167AXC | 256K × 36, 167 MHz, 3.3 V core/2.5 V I/O, 119-ball BGA only - no TQFP option | Higher speed but incompatible 119-ball BGA footprint; requires PCB redesign | Select if 167 MHz timing margin is required and BGA assembly is available |
| AS7C3256A-15JC | 256K × 36, 150 MHz, 3.3 V only (no VDDQ separation); 100-pin TQFP; commercial temp (0°C to +70°C) only | Lacks 2.5 V I/O rail and industrial temperature support - unsuitable for mixed-voltage or extended-temp systems | Select only for cost-sensitive commercial applications where 2.5 V I/O and industrial rating are not required |
Compared with CY7C1371BV33-167AXC and AS7C3256A-15JC, the 71V67602S150BGG8 uniquely combines 150 MHz performance, 100-pin TQFP package, 2.5 V I/O interface, and industrial temperature range - enabling drop-in replacement in legacy designs without layout or voltage rail changes.
Availability
71V67602S150BGG8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and avionics applications requiring stable component supply, long-term lifecycle support, and guaranteed industrial-grade performance.
Supply support for 71V67602S150BGG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT) was a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs before its acquisition by Renesas in 2019. IDT's synchronous SRAM portfolio targeted high-performance computing and communications systems.
The IDT71V67602 product line was designed for applications demanding deterministic burst bandwidth, low-latency pipelined access, and robust industrial operation - particularly in network processors, baseband units, and real-time control subsystems.
FAQ
What is the maximum clock frequency supported by the 71V67602S150BGG8?
The 71V67602S150BGG8 is rated for 150 MHz operation, corresponding to a minimum clock cycle time (tCYC) of 6.7 ns. This frequency is guaranteed across the full industrial temperature range (–40°C to +85°C) and under specified 3.3 V ±5% VDD and 2.5 V ±5% VDDQ supply conditions. Performance beyond 150 MHz is not characterized or warranted.
Does the 71V67602S150BGG8 support both linear and interleaved burst modes?
Yes, the 71V67602S150BGG8 supports both linear and interleaved burst sequences via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, the device uses linear burst order; when driven HIGH, it uses interleaved order. LBO is a static input and must not change state during active operation.
What is the function of the ADV pin on the 71V67602S150BGG8?
The ADV (Burst Address Advance) pin on the 71V67602S150BGG8 is an active-LOW synchronous input that controls advancement of the internal burst address counter. When ADV is LOW, the counter increments to deliver the next sequential burst address; when ADV is HIGH, burst progression halts and the current address is repeated - enabling burst suspension without terminating the cycle.
Can the 71V67602S150BGG8 operate with only a 3.3 V supply, or is the 2.5 V VDDQ rail mandatory?
The 2.5 V VDDQ rail is mandatory for correct operation of the 71V67602S150BGG8. The device uses separate 3.3 V (VDD) for core logic and 2.5 V (VDDQ) for I/O buffers. Operating with VDDQ tied to 3.3 V violates absolute maximum ratings and risks damage or undefined behavior. Both supplies must be present and within ±5% tolerance.
How does the ZZ pin affect power consumption in the 71V67602S150BGG8?
Asserting ZZ HIGH places the 71V67602S150BGG8 into full sleep mode, gating the internal clock and reducing supply current to 70 mA (IZZ) - a >70% reduction versus active operation (260 mA IDD at 150 MHz). Data retention is guaranteed, and recovery time (tZZR) is 100 ns, allowing rapid wake-up for burst-intensive workloads.
71V67602S150BGG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V67602S150BGG8 FAQ
1.How can I place an order for 71V67602S150BGG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67602S150BGG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V67602S150BGG8 reliable?
The price and inventory of 71V67602S150BGG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67602S150BGG8 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V67602S150BGG8?
For technical support, including 71V67602S150BGG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67602S150BGG8 requirements.
6.How does Aetrix verify that 71V67602S150BGG8 is sourced from the original manufacturer or authorized distributors?
All 71V67602S150BGG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67602S150BGG8 meets industry standards.
7.What is the process for return or replacement of 71V67602S150BGG8?
All 71V67602S150BGG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67602S150BGG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67602S150BGG8 part is unused and in its original packaging.
Return procedure for 71V67602S150BGG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67602S150BGG8 Tags

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