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Renesas 71V67603S133BGGI

Part No.:
71V67603S133BGGI
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V67603S133BGGI.pdf
Description:
IC SRAM 9MBIT PARALLEL 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,733

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Product details

Overview

71V67603S133BGGI from IDT (now Renesas) is a 256K × 36-bit or 512K × 18-bit 3.3V synchronous SRAM with pipelined outputs, single-cycle deselect, and burst counter logic. It supports 133MHz operation with 4.2ns clock access time, operates at 3.3V core and I/O supplies, and features global/byte write control and linear/interleaved burst modes for high-bandwidth memory subsystems in networking and telecom line cards.

For engineers reviewing the 71V67603S133BGGI datasheet, 71V67603S133BGGI pinout, 71V67603S133BGGI application, or 71V67603S133BGGI equivalent, key selection criteria include burst mode timing compliance, ZZ sleep current (≤70µA), pipelined read latency, 100-pin TQFP or BGA package compatibility, and support for synchronous CE/CS0/CS1 chip select decoding in high-speed cache interfaces.

Technical Context

This SRAM implements a synchronous interface with registered address, data, and control inputs triggered on the rising edge of CLK. Its internal architecture includes an address register, burst address counter, four independent byte-write registers, and pipelined output buffers that deliver first data one clock cycle after address latch.

The device supports two memory configurations-256K × 36 (address range A0–A17) or 512K × 18 (A0–A18)-selected by external wiring and package variant. Burst sequencing is controlled by ADV, ADSP/ADSC, and LBO, with self-timed writes enabled via GW, BWE, and BW1–BW4, ensuring deterministic write completion without external wait-state generation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36-bit (or 512K × 18-bit); defines usable address space and data bus width for system interconnect
Max Clock Frequency 133MHz; enables 7.5ns minimum clock cycle time for sustained burst throughput in backplane controllers
Access Time (tCD) 4.2ns at 133MHz; determines pipelined read latency from CLK rise to valid DOUT, critical for timing closure
VDD / VDDQ 3.3V ±5%; requires dual-rail 3.3V supply design with separate core and I/O power domains
Sleep Current (IZZ) 70µA max (industrial temp); enables low-power standby in carrier-grade systems with thermal constraints
Burst Modes Linear or interleaved (via LBO pin); selects address increment pattern for cache-line-aligned sequential accesses
Write Control Global (GW) or per-byte (BW1–BW4 + BWE); allows partial-word updates without read-modify-write overhead

Pinout & Package

Packaged in a JEDEC-standard 119-ball fine-pitch BGA (BGG119), the 71V67603S133BGGI uses a 12 × 10 ball array with VDDQ/VSS power/ground pairs distributed across the perimeter for low-impedance I/O supply routing and signal integrity.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Input 256K × 36 mode: 18-bit address bus; latched synchronously on rising CLK with ADSP/ADSC assertion
CLK System Clock Input Primary timing reference; all synchronous operations (read/write/burst advance) are edge-triggered on rising edge
GW, BWE, BW1–BW4 Write Control Inputs GW enables full 36-bit write; BWE gates BWx; BW1–BW4 each enable one 9-bit byte (I/O0–7/I/OP1, etc.)
ADV, ADSP, ADSC Burst Address Control ADV advances internal counter; ADSP (processor) or ADSC (cache) loads initial address into register
LBO Burst Order Select Asynchronous input: LOW = linear burst (00→01→10→11), HIGH = interleaved (00→01→11→10)
ZZ Sleep Mode Enable Asynchronous HIGH disables internal clock and reduces ICC to ≤70µA; no sequencing required on entry/exit
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional bus; registered input/output paths ensure setup/hold compliance at 133MHz

Key Features

Feature Design Value
Pipelined Outputs First read data appears one clock cycle after address latch, enabling continuous burst reads without pipeline stalls
Single-Cycle Deselect Chip deactivation completes within one CLK period, eliminating bus turnaround delays in multi-SRAM systems
Self-Timed Write Cycle Internal timing logic guarantees write completion before next CLK edge-no external wait-state generator needed
Byte-Write Capability Four independent 9-bit write enables allow granular 1–4 byte updates, reducing bus contention in shared-memory architectures
Low-Power Sleep Mode ZZ-driven sleep draws ≤70µA at +85°C, supporting thermal-aware power management in dense line-card designs

Applications

Telecom Line Cards Network Packet Buffers

Use Scenario: High-speed packet buffering in OC-192/STM-64 line interface units requiring burst-aligned memory access.

IC Role / Device Role / Timing Role: Primary data buffer SRAM interfacing directly to SerDes PHYs and traffic manager ASICs via 36-bit synchronous bus.

Use Value: 133MHz burst throughput and pipelined reads reduce packet latency by up to 3.5ns per word versus non-pipelined alternatives.

Use Scenario: Temporary storage for fragmented IP packets undergoing classification and QoS tagging in enterprise switches.

IC Role / Device Role / Timing Role: Dual-port-capable buffer (via CE/CS partitioning) supporting concurrent ingress/egress DMA channels.

Use Value: Single-cycle deselect allows rapid context switching between packet queues without bus arbitration overhead.

Baseband Processing Units Radar Signal Processors

Use Scenario: Real-time FFT coefficient storage in 3G/4G LTE baseband processors where deterministic access latency is mandatory.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as ping-pong buffer for FFT engines, clocked from same domain as DSP core.

Use Value: Linear burst mode (LBO = LOW) delivers contiguous 128-bit words matching FFT butterfly dataflow patterns.

Use Scenario: Chirp sample buffering in phased-array radar front-ends operating in harsh industrial temperature ranges.

IC Role / Device Role / Timing Role: Industrial-grade (−40°C to +85°C) memory providing reliable burst reads under thermal cycling stress.

Use Value: Guaranteed 70µA sleep current at +85°C enables passive cooling in sealed radar enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-133BZXI 256K × 36, 133MHz, 3.3V; identical tCD (4.2ns) but lacks LBO-selectable burst order Fixed linear burst only; unsuitable where interleaved addressing is required by legacy controller firmware Select when burst sequence is fixed and footprint compatibility with Cypress-based designs is prioritized
AS7C3256B-133JCIN 256K × 36, 133MHz, 3.3V; supports pipelined reads but no ADV/ADSP/ADSC burst control interface Relies on external counter logic for burst generation; increases PCB complexity and timing risk Choose only if system already implements discrete burst address generation and requires lower unit cost

Compared with CY7C1362BV33-133BZXI and AS7C3256B-133JCIN, the 71V67603S133BGGI uniquely integrates programmable burst sequencing (LBO), processor/cache address status inputs (ADSP/ADSC), and true self-timed writes-enabling direct connection to complex SoCs without glue logic.

Availability

71V67603S133BGGI is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, and radar signal processors requiring stable component supply across extended product lifecycles and industrial temperature operation.

Supply support for 71V67603S133BGGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface ICs for communications and computing infrastructure.

The 71V67603S133BGGI belongs to IDT's high-speed synchronous SRAM product line, engineered for deterministic low-latency memory access in carrier-class networking and real-time signal processing systems.

FAQ

What memory configuration does the 71V67603S133BGGI support?

71V67603S133BGGI supports both 256K × 36-bit and 512K × 18-bit organizations. The configuration is determined by external address wiring and package-specific pin mapping-not user-programmable. In 256K × 36 mode, A0–A17 are used; in 512K × 18 mode, A0–A18 are active. The 71V67603S133BGGI datasheet specifies pin functions for both modes in its configuration tables.

Does the 71V67603S133BGGI require power supply sequencing?

No, the 71V67603S133BGGI does not require strict power supply sequencing. Both VDD (3.3V core) and VDDQ (3.3V I/O) may ramp simultaneously. However, no input or I/O pin voltage may exceed VDDQ during power-up, and the device must be deselected when exiting sleep mode (ZZ HIGH → LOW transition).

How does burst mode operate on the 71V67603S133BGGI?

Burst mode on the 71V67603S133BGGI delivers four consecutive data words per address using an internal binary counter. Initiated by ADV = LOW and ADSP/ADSC assertion, it sequences through addresses defined by LBO state (linear or interleaved). Each word appears on successive CLK edges, with pipelined output ensuring first word latency of one cycle.

What is the function of the ZZ pin on the 71V67603S133BGGI?

The ZZ pin on the 71V67603S133BGGI enables full-sleep mode. When driven HIGH asynchronously, it gates the internal clock and reduces supply current to ≤70µA (industrial grade). Data retention is guaranteed. ZZ requires no setup/hold timing relative to CLK and has an internal pull-down, so it may be left unconnected for active-only operation.

Can the 71V67603S133BGGI perform partial-word writes?

Yes, the 71V67603S133BGGI supports partial-word writes via four independent byte-write enables (BW1–BW4), each controlling a 9-bit segment of the 36-bit bus. Activation requires BWE = LOW and the corresponding BWx = LOW on the rising CLK edge. This enables 1–4 byte updates without read-modify-write cycles.

71V67603S133BGGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V67603S133BGGI FAQ

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The price and inventory of 71V67603S133BGGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67603S133BGGI is usually 5 days.

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5.How can I obtain technical support or documentation for 71V67603S133BGGI?

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6.How does Aetrix verify that 71V67603S133BGGI is sourced from the original manufacturer or authorized distributors?

All 71V67603S133BGGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67603S133BGGI meets industry standards.

7.What is the process for return or replacement of 71V67603S133BGGI?

All 71V67603S133BGGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V67603S133BGGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V67603S133BGGI part is unused and in its original packaging.

Return procedure for 71V67603S133BGGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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