Renesas 71V67603S133BQ8
- Part No.:
- 71V67603S133BQ8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V67603S133BQ8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V67603S133BQ8 from IDT (now Renesas) is a 256K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, single-cycle deselect, and 133MHz operation (4.2ns clock access time). It supports linear/interleaved burst modes via LBO input, features self-timed write with global/byte write control, and operates across commercial temperature range (0°C to +70°C). It is used in high-speed networking buffers and cache subsystems requiring deterministic latency.
For engineers reviewing the 71V67603S133BQ8 datasheet, 71V67603S133BQ8 pinout, 71V67603S133BQ8 application, or 71V67603S133BQ8 equivalent, key selection criteria include burst mode timing compliance, ZZ sleep current (≤70mA), VDD/VDDQ supply separation, and TQFP-100 package compatibility with legacy board layouts.
Technical Context
This SRAM implements a synchronous interface with registered address, data, and control inputs triggered on the rising edge of CLK. Its internal burst counter generates four sequential addresses per ADV assertion, with output pipelining delivering first data one cycle after clock edge and subsequent data on successive edges.
The device supports dual write control schemes: global write (GW) enables full 36-bit writes, while byte write enable (BWE) combined with BW1–BW4 selects individual 9-bit bytes. Asynchronous OE and ZZ inputs provide output enable and deep-sleep control independent of clock timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9Mbit); supports 512K × 18-bit configuration via address mapping |
| Clock Frequency | 133MHz max - defines minimum tCYC = 7.5ns for timing closure in high-speed bus designs |
| Access Time | 4.2ns clock-to-data (tCD) - guarantees deterministic read latency under worst-case commercial conditions |
| Supply Voltages | VDD = 3.3V ±5% (core), VDDQ = 3.3V ±5% (I/O) - requires separate low-noise regulation for signal integrity |
| Power Consumption | IDD = 260mA @133MHz (commercial); IZZ = 70mA in full sleep - enables low-power idle states in burst-oriented systems |
| Burst Mode | Linear or interleaved via LBO pin - determines address sequence order for cache-line-aligned transfers |
| Package | JEDEC-standard 100-pin TQFP (14mm × 20mm) - compatible with standard SMT reflow profiles and legacy footprint libraries |
Pinout & Package
71V67603S133BQ8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14mm × 20mm body size, with 0.5mm lead pitch. Pin 1 is marked by a dot or beveled corner; pin numbering follows standard counter-clockwise convention from top-left.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous address register inputs; A0–A17 used for 256K×36 mode; A18 unused but must be tied to VSS or VDD |
| CLK | Clock Input | Rising-edge-triggered master timing reference for all synchronous operations including burst sequencing |
| CE, CS0, CS1 | Chip Enable / Selects | Three-level chip select hierarchy: CE active-low gated with CS0 (active-high) and CS1 (active-low) |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW enables full 36-bit writes; BWE enables byte write; BW1–BW4 select four 9-bit data bytes independently |
| OE | Output Enable | Asynchronous control - drives I/O pins to high-Z when HIGH, enabling bus sharing without clock dependency |
| ZZ | Sleep Mode Input | Asynchronous high-active signal that gates internal clock and reduces supply current to ≤70mA |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous data bus; I/OP1–I/OP4 are parity bits for error detection in mission-critical systems |
| VDD, VDDQ, VSS | Power/Ground | VDD powers core logic; VDDQ powers I/O drivers; separate supplies minimize switching noise coupling into memory array |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Outputs | First data valid one clock cycle after address latch; eliminates wait states in burst-read pipelines |
| Single-Cycle Deselect | Device enters high-Z state within one CLK cycle after chip disable - prevents bus contention during rapid address changes |
| Self-Timed Write Cycle | Internal timing logic completes write without external strobe; simplifies controller design and improves reliability |
| Configurable Burst Order | LBO pin selects linear (LBO=LOW) or interleaved (LBO=HIGH) address sequence - matches CPU/cache controller requirements |
| Separate Core/I/O Supplies | VDD (core) and VDDQ (I/O) decoupling allows independent power domain optimization for noise isolation and EMI reduction |
Applications
| Networking Packet Buffer | Industrial PLC Cache |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in 10G Ethernet line cards with strict latency budgets. IC Role / Device Role / Timing Role: High-speed buffer between MAC and switch fabric; provides pipelined 4-word bursts synchronized to system clock. Use Value: 4.2ns tCD and single-cycle deselect ensure sub-10ns round-trip latency for header lookups, meeting IEEE 802.3ae jitter requirements. |
Use Scenario: Real-time instruction caching in programmable logic controllers handling motion control loops at 1kHz update rates. IC Role / Device Role / Timing Role: Instruction SRAM interfaced to RISC processor core; burst mode fetches 4 instructions per cycle. Use Value: Linear burst mode (LBO=LOW) aligns with sequential program flow, reducing average instruction fetch latency by 35% vs. random access. |
| Medical Imaging Frame Store | Avionics Data Recorder |
|
Use Scenario: Temporary frame storage in digital X-ray acquisition systems where image data arrives at 120MB/s burst rates. IC Role / Device Role / Timing Role: Dual-port-capable buffer (via CE/ADV control) accepting parallel sensor data while feeding display pipeline. Use Value: 133MHz clock rate and 36-bit width support sustained 475MB/s throughput, exceeding DICOM transfer requirements. |
Use Scenario: Non-volatile flight data buffering in black box recorders requiring guaranteed data retention during power loss events. IC Role / Device Role / Timing Role: High-reliability SRAM with ZZ-controlled sleep mode; retains data at ≤70mA standby current during aircraft idle periods. Use Value: Full sleep mode (IZZ ≤70mA) extends battery-backed operation to >48 hours without refresh, satisfying DO-178C safety margins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-133BZXI | 256K × 36-bit, 133MHz, same TQFP-100 package; supports JTAG boundary scan not present in 71V67603S133BQ8 | Preferred in test-heavy production environments requiring in-system verification | Choose for enhanced testability; verify JTAG pin conflicts with existing layout |
| AS7C331024B-133BIN | 256K × 36-bit, 133MHz, but uses 119-ball BGA; no LBO pin - fixed linear burst only | Suitable for space-constrained PCBs where BGA routing is acceptable and burst order is fixed | Choose only if redesigning for BGA; LBO absence limits flexibility in multi-processor cache coherency schemes |
Compared with CY7C1371DV33-133BZXI and AS7C331024B-133BIN, the 71V67603S133BQ8 offers unique LBO-configurable burst ordering and TQFP-100 compatibility for legacy upgrades, while lacking JTAG but providing lower ZZ sleep current than the Cypress part.
Availability
71V67603S133BQ8 is available at Aetrix Electronics and suitable for high-speed networking equipment, industrial automation controllers, medical imaging subsystems, and avionics data recorders requiring stable component supply and long-term obsolescence management.
Supply support for 71V67603S133BQ8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in timing, memory, and interface solutions for high-performance computing and communications infrastructure.
The 71V67603S133BQ8 belongs to IDT's high-speed synchronous SRAM product line, designed specifically for cache and buffer applications in systems demanding deterministic timing, low-latency burst access, and robust industrial temperature operation.
FAQ
What is the maximum operating frequency of the 71V67603S133BQ8?
The 71V67603S133BQ8 is rated for 133MHz operation, corresponding to a minimum clock cycle time (tCYC) of 7.5ns. This frequency is guaranteed across the commercial temperature range (0°C to +70°C) with VDD and VDDQ at 3.3V ±5%. The device also supports 150MHz and 166MHz variants (71V67603S150BQ8 and 71V67603S166BQ8), but the 71V67603S133BQ8 is specifically characterized and binned for 133MHz performance.
Does the 71V67603S133BQ8 support both linear and interleaved burst modes?
Yes, the 71V67603S133BQ8 supports both burst modes via the LBO (Linear Burst Order) input pin. When LBO is driven LOW, the device executes linear burst addressing; when LBO is driven HIGH, it executes interleaved burst addressing. The LBO pin is asynchronous and must remain static during active operation - changing its state mid-burst may cause undefined address sequencing.
What is the function of the ZZ pin on the 71V67603S133BQ8?
The ZZ pin on the 71V67603S133BQ8 is an asynchronous high-active sleep mode input. When ZZ is driven HIGH, the internal clock is gated and the device enters full sleep mode, reducing supply current to ≤70mA (industrial grade) while retaining data. The device must be deselected (CE, CS0, CS1 inactive) before asserting ZZ, and requires tZZR ≥100ns recovery time before resuming normal operation.
How many data bits does the 71V67603S133BQ8 provide, and what is the role of I/OP1–I/OP4?
The 71V67603S133BQ8 provides 36 data bits: I/O0–I/O31 (32 bits) plus I/OP1–I/OP4 (4 parity bits). These parity bits support error detection in safety-critical applications such as industrial control and avionics. The device does not perform parity generation or checking internally - external logic must manage parity encoding/decoding.
Can the 71V67603S133BQ8 operate with a single 3.3V supply, or are separate VDD and VDDQ supplies required?
The 71V67603S133BQ8 requires two independent 3.3V supplies: VDD for the core logic and VDDQ for the I/O drivers. Although both are nominally 3.3V ±5%, they must be separately decoupled and routed to minimize noise coupling from I/O switching into the sensitive memory array. Using a single shared supply violates the DC operating conditions and risks timing violations or data corruption.
71V67603S133BQ8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V67603S133BQ8 FAQ
1.How can I place an order for 71V67603S133BQ8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67603S133BQ8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V67603S133BQ8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67603S133BQ8 is usually 5 days.
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5.How can I obtain technical support or documentation for 71V67603S133BQ8?
For technical support, including 71V67603S133BQ8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67603S133BQ8 requirements.
6.How does Aetrix verify that 71V67603S133BQ8 is sourced from the original manufacturer or authorized distributors?
All 71V67603S133BQ8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67603S133BQ8 meets industry standards.
7.What is the process for return or replacement of 71V67603S133BQ8?
All 71V67603S133BQ8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67603S133BQ8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67603S133BQ8 part is unused and in its original packaging.
Return procedure for 71V67603S133BQ8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67603S133BQ8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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