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Renesas 71V67603S133PFG

Part No.:
71V67603S133PFG
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V67603S133PFG.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,514

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Product details

Overview

71V67603S133PFG from IDT (Integrated Device Technology) is a 256K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, single-cycle deselect, and 133MHz operation (4.2ns clock access time). It supports interleaved/linear burst modes via LBO input, features self-timed write with global and byte-level write control, and operates across commercial temperature range (0°C to +70°C). It is used in high-speed networking buffers and cache subsystems requiring deterministic timing.

For engineers reviewing the 71V67603S133PFG datasheet, 71V67603S133PFG pinout, 71V67603S133PFG application, or 71V67603S133PFG equivalent, key selection criteria include burst mode flexibility (LBO-controlled), 3.3V I/O compatibility, pipelined read latency, ZZ sleep mode power management, and TQFP-100 packaging for board-level signal integrity.

Technical Context

This SRAM implements a synchronous interface with dual address status inputs (ADSP/ADSC) for processor/cache controller coordination, enabling precise burst address generation. Its internal 2-bit binary burst counter advances on ADV=LOW and selects sequence order based on static LBO level - linear (LBO=LOW) or interleaved (LBO=HIGH).

The device integrates separate write registers per 9-bit byte (BW1–BW4), gated by BWE and overridden by GW, allowing granular data masking without affecting other bytes. Pipelined output staging delivers first valid data one clock cycle after CLK rising edge, with subsequent burst words aligned to successive edges.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36-bit (9Mbit); supports 512K × 18-bit configuration via address mapping
Clock Frequency 133MHz max; enables 7.5ns clock cycle time for deterministic system timing
Access Time 4.2ns clock-to-data (tCD); defines minimum latency for first burst word delivery
Supply Voltages VDD = 3.3V ±5% (core), VDDQ = 3.3V ±5% (I/O); ensures signal integrity with 3.3V logic families
Power Modes Active (IDD = 260mA @133MHz), Standby (ISB2 = 150mA), Sleep (IZZ = 50mA); ZZ input triggers full sleep
Burst Control LBO pin selects linear or interleaved 4-word burst sequence; ADV advances counter synchronously
Write Architecture Self-timed write with GW (global) or BW1–BW4 (byte-selectable); BWE enables/disables byte write path

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14mm × 20mm body, lead pitch 0.5mm. Pinout validated for 256K × 36 configuration (PKG100).

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs Synchronous address latching triggered by ADSP/ADSC low + CE low; A0/A1 define burst word order
CLK Clock Input Single-phase edge-triggered reference for all synchronous operations; no internal PLL
GW / BWE / BW1–BW4 Write Control Inputs GW writes all 36 bits; BWE enables BWx; BW1–BW4 each mask one 9-bit byte (I/O0–7/I/OP1, etc.)
ADV / ADSP / ADSC Burst Address Control ADSP (processor) or ADSC (cache) loads address register; ADV advances internal burst counter
LBO Burst Order Select Asynchronous static input: LOW = linear burst (00→01→10→11), HIGH = interleaved (00→01→11→10)
ZZ Sleep Mode Input Asynchronous HIGH disables internal clock and reduces current to 50mA; retains data
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional bus; registered input/output paths synchronized to CLK rising edge

Key Features

Feature Design Value
Pipelined Outputs First burst word available on second CLK edge; eliminates wait states in high-throughput pipelines
Single-Cycle Deselect Outputs enter high-Z within one clock cycle after chip disable; prevents bus contention during mode switching
Byte-Write Flexibility Four independent 9-bit write masks (BW1–BW4) enable partial-word updates without read-modify-write overhead
Configurable Burst Mode LBO pin statically selects linear or interleaved addressing - matches CPU or cache controller burst expectations
Low-Power Sleep Mode ZZ-driven sleep draws only 50mA while retaining memory contents; ideal for power-gated subsystems

Applications

Networking Packet Buffer High-Speed Cache Controller

Use Scenario: Storing ingress/egress packet headers and metadata in 10G Ethernet line cards.

IC Role / Device Role / Timing Role: Synchronous buffer between MAC and traffic manager; provides deterministic 4.2ns read latency for header inspection.

Use Value: Pipelined burst reads deliver four consecutive header words per address, reducing bus arbitration overhead by 75% vs. random access.

Use Scenario: Second-level cache tag RAM in RISC-V SoC designs with burst-capable bus fabric.

IC Role / Device Role / Timing Role: Tag storage with LBO-matched burst order to align with CPU's prefetch engine (linear or interleaved).

Use Value: Single-cycle deselect allows rapid context switching between instruction and data caches without bus glitches.

Industrial PLC Memory Module Test Equipment Pattern Memory

Use Scenario: Real-time I/O mapping table storage in programmable logic controllers with deterministic scan cycles.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding process variable tables; accessed via burst reads during scan phase.

Use Value: ZZ sleep mode cuts power by >70% during idle periods while preserving state - critical for fanless enclosures.

Use Scenario: Vector pattern storage in automated test equipment requiring precise timing alignment across 36-bit stimulus channels.

IC Role / Device Role / Timing Role: High-speed pattern buffer synchronized to tester clock; tCD = 4.2ns ensures sub-nanosecond setup margin.

Use Value: Self-timed write with GW/BWx enables atomic multi-byte updates - essential for glitch-free vector transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-133AXC 256K × 36, 133MHz, 3.3V core/I/O; same TQFP-100 package but Cypress pinout differs on ADV/ADSC/ADSP assignment Supports JTAG boundary scan; lacks LBO-controlled burst order flexibility Choose when IEEE 1149.1 testability is required and burst sequence is fixed
AS7C3256A-133JCIN 256K × 36, 133MHz, 3.3V; uses different burst counter architecture - no LBO input, fixed linear burst only No ZZ sleep mode; standby current (ISB1) is 120mA vs. 50mA for 71V67603S133PFG Choose for cost-sensitive designs where sleep mode and burst configurability are unnecessary

Compared with CY7C1362BV33-133AXC and AS7C3256A-133JCIN, the 71V67603S133PFG uniquely combines LBO-selectable burst order, ZZ-driven deep sleep, and identical 4.2ns tCD performance - making it optimal for systems requiring both timing determinism and dynamic power scaling.

Availability

71V67603S133PFG is available at Aetrix Electronics and suitable for high-speed networking packet buffers, industrial PLC memory modules, and test equipment pattern memory requiring stable component supply and long-term lifecycle support.

Supply support for 71V67603S133PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology) is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions, acquired by Renesas Electronics in 2019.

The 71V67603S133PFG belongs to IDT's high-speed synchronous SRAM product line, designed specifically for deterministic-latency applications in networking, computing, and industrial control where pipelined burst access and low-power sleep modes are critical.

FAQ

What is the maximum operating frequency of the 71V67603S133PFG?

The 71V67603S133PFG is rated for 133MHz operation, corresponding to a 7.5ns clock cycle time and 4.2ns clock-to-data (tCD) access time. This specification is guaranteed over the commercial temperature range (0°C to +70°C) with VDD and VDDQ at 3.3V ±5%. Higher frequencies (150MHz/166MHz) apply only to other speed grades (e.g., 71V67603S150/166), not the S133 variant.

Does the 71V67603S133PFG support both 256K × 36 and 512K × 18 configurations?

Yes, the 71V67603S133PFG supports both memory organizations. In 256K × 36 mode, all 36 data bits (I/O0–I/O31 + I/OP1–I/OP4) are active. In 512K × 18 mode, the device maps to 18-bit data width using I/O0–I/O15 + I/OP1–I/OP2, with address lines A17–A18 repurposed for row extension. Pin configurations differ between modes, as shown in the 100-pin TQFP diagrams.

How does the LBO pin affect burst behavior in the 71V67603S133PFG?

The LBO (Linear Burst Order) pin is an asynchronous static input that determines burst address sequencing: when LBO = LOW, the internal counter follows linear order (00→01→10→11); when LBO = HIGH, it follows interleaved order (00→01→11→10). The selected mode persists until LBO changes - and must remain stable during operation to avoid undefined burst behavior.

What is the function of the ZZ pin on the 71V67603S133PFG?

The ZZ pin enables full sleep mode: when driven HIGH, it gates the internal clock and reduces supply current to 50mA (IZZ) while retaining memory contents. ZZ is asynchronous and requires no timing coordination with CLK. Data retention is guaranteed across the commercial temperature range, and the device resumes normal operation within tZZR = 100ns after ZZ returns LOW.

Can the 71V67603S133PFG perform byte-level writes without affecting other data bytes?

Yes. The 71V67603S133PFG supports true byte-selectable writes via BW1–BW4 inputs, each controlling a 9-bit segment (e.g., BW1 → I/O0–I/O7 + I/OP1). When BWE = LOW, active BWx signals mask corresponding bytes during a write cycle; inactive bytes retain prior data. Global Write (GW = LOW) overrides all BWx and writes all 36 bits simultaneously.

71V67603S133PFG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V67603S133PFG FAQ

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Please submit a Request for Quotation (RFQ) for 71V67603S133PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 71V67603S133PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67603S133PFG is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V67603S133PFG?

For technical support, including 71V67603S133PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67603S133PFG requirements.

6.How does Aetrix verify that 71V67603S133PFG is sourced from the original manufacturer or authorized distributors?

All 71V67603S133PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67603S133PFG meets industry standards.

7.What is the process for return or replacement of 71V67603S133PFG?

All 71V67603S133PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V67603S133PFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V67603S133PFG part is unused and in its original packaging.

Return procedure for 71V67603S133PFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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