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Renesas 71V67603S133PFG8
- Part No.:
- 71V67603S133PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V67603S133PFG8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,084
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Product details
Overview
71V67603S133PFG8 from IDT (now Renesas) is a 256K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, single-cycle deselect, and 133MHz operation (4.2ns clock access time). It supports linear/interleaved burst modes via LBO input, features self-timed write with global/byte write control, and operates across commercial temperature range (0°C to +70°C). It is used in high-speed networking buffers and cache subsystems requiring deterministic latency.
For engineers reviewing the 71V67603S133PFG8 datasheet, 71V67603S133PFG8 pinout, 71V67603S133PFG8 application, or 71V67603S133PFG8 equivalent, key selection criteria include burst mode timing compliance, ZZ-controlled sleep current (≤70mA), VDDQ = 3.3V ±5% I/O supply tolerance, and TQFP-100 package compatibility with JEDEC MO-147AA footprint.
Technical Context
The 71V67603S133PFG8 implements a synchronous, clock-driven architecture with registered address, data, and control paths. Its internal burst counter advances on ADV=LOW and selects sequence order (linear or interleaved) based on static LBO level - no runtime reconfiguration. All inputs except OE and ZZ are synchronous to CLK rising edge, with setup/hold times specified down to 1.5ns/0.5ns.
Write operations support four distinct modes: global write (GW active), byte write (BWE + BW1–BW4), self-timed cycle termination, and pipelined read output staging. The device guarantees data retention in ZZ sleep mode and provides single-cycle deselect for rapid bus release without pipeline flush.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9Mbit); supports 512K × 18-bit via pin-strapping |
| Max Clock Frequency | 133MHz - enables 7.5ns minimum clock cycle for deterministic timing in real-time systems |
| Access Time | 4.2ns clock-to-data (tCD) - defines worst-case read latency under full load |
| Supply Voltages | VDD = 3.3V ±5%, VDDQ = 3.3V ±5% - requires dual regulated 3.3V rails with independent decoupling |
| Sleep Current (IZZ) | ≤70mA at VDD = max - ensures low-power idle state in power-constrained embedded designs |
| Burst Mode Control | LBO pin selects linear or interleaved address sequence - determines cache line mapping behavior |
| Package | 100-pin TQFP (JEDEC MO-147AA, 14mm × 20mm) - surface-mount compatible with standard reflow profiles |
Pinout & Package
71V67603S133PFG8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14mm × 20mm body, 0.5mm lead pitch. Pin 1 marked by dot; pin 14 may be tied to VDD, driven ≥VIH, or left floating; pin 64 unconnected maintains active mode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous address latch triggered by CLK + ADSP/ADSC; A0–A17 used for 256K×36 mode |
| CLK | System Clock Input | Rising-edge-triggered timing reference for all synchronous operations; tCH/tCL ≥3ns min |
| GW / BWE / BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE gates BWx; BW1–BW4 select 9-bit bytes (I/O0–7/I/OP1, etc.) |
| ADV / ADSP / ADSC | Burst & Address Status | ADV advances burst counter; ADSP (gated by CE) and ADSC load address register on falling edge |
| OE | Asynchronous Output Enable | Drives I/O pins to high-Z when HIGH; enables pipelined output on LOW independent of CLK |
| ZZ | Asynchronous Sleep Input | High-level assertion disables internal clock and reduces IDD to IZZ - no sequencing required |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O (36-bit) | Registered bidirectional bus; outputs pipelined one cycle after CLK; inputs sampled on CLK rising edge |
| VDD / VDDQ / VSS | Power & Ground | VDD = core (3.3V), VDDQ = I/O (3.3V), separate planes required; multiple VSS pins for noise reduction |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Outputs | First read data appears one clock cycle after address latch - eliminates wait states in burst transfers |
| Single-Cycle Deselect | Chip deactivation completes within one CLK period - enables rapid bus arbitration and multi-master sharing |
| Self-Timed Write Cycle | Internal logic terminates write without external timing control - simplifies FPGA/CPU interface design |
| Linear/Interleaved Burst Mode | LBO pin statically configures burst address sequence - matches processor/cache controller addressing scheme |
| Low-Power Sleep Mode | IZZ ≤70mA with ZZ HIGH - preserves data while reducing system power during idle intervals |
| 3.3V Core & I/O | Compatible with modern 3.3V logic families without level translation - reduces BOM count and layout complexity |
Applications
| Networking Packet Buffer | Industrial PLC Data Cache |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in 10G Ethernet line cards. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer between MAC and switch fabric; provides deterministic 4.2ns read access. Use Value: Enables full-line-rate packet processing without stall cycles; burst mode aligns with 64-byte cache line fetches. |
Use Scenario: Holding real-time I/O status and control algorithm variables in programmable logic controllers. IC Role / Device Role / Timing Role: Dual-port accessible memory for CPU and peripheral DMA engines; supports concurrent read/write via byte-enable granularity. Use Value: Guarantees sub-10ns access jitter for deterministic motion control loops; ZZ sleep extends battery backup duration. |
| Avionics Display Frame Buffer | Test Equipment Pattern Memory |
Use Scenario: Rendering HUD graphics in military cockpit displays with strict DO-254 timing compliance. IC Role / Device Role / Timing Role: Synchronous frame store interfaced to FPGA video controller; uses pipelined outputs for pixel clock alignment. Use Value: Eliminates FIFO synchronization logic; single-cycle deselect prevents display tearing during buffer swaps. |
Use Scenario: Storing stimulus/response vectors in automated test equipment for semiconductor validation. IC Role / Device Role / Timing Role: High-reliability pattern memory accessed by pattern generator ASIC; leverages self-timed writes for variable-depth sequences. Use Value: Reduces test program development time by removing write timing constraints; 100-pin TQFP supports manual probe access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 256K × 36, 133MHz, 3.3V, TQFP-100 - identical organization and speed but Cypress (Infineon) silicon; tCD = 4.2ns same, but tOHZ = 4.5ns vs 4.2ns | Valid for drop-in replacement where 0.3ns longer high-Z disable time is acceptable; same thermal profile | Select if existing design uses Cypress toolchain or requires long-term Infineon supply assurance |
| AS7C3256B-133JCIN | 256K × 36, 133MHz, 3.3V, TQFP-100 - Alliance Memory part; tCD = 4.5ns (slower), ISB1 = 80mA (higher standby), no ZZ pin | Requires redesign of sleep control logic; suitable only where full sleep mode is unused and 0.3ns latency penalty is tolerable | Choose for cost-sensitive volume production where power and timing margins allow relaxation |
Compared with CY7C1362BV33-133AXC and AS7C3256B-133JCIN, the 71V67603S133PFG8 delivers tighter tOHZ (4.2ns), lower ISB1 (50mA), and integrated ZZ sleep control - making it optimal for latency-critical, power-aware systems requiring guaranteed single-cycle deselect.
Availability
71V67603S133PFG8 is available at Aetrix Electronics and suitable for networking packet buffers, industrial PLC data caches, avionics display frame buffers, and test equipment pattern memories requiring stable component supply and long-lifecycle support.
Supply support for 71V67603S133PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V67603S133PFG8 belongs to IDT's high-speed synchronous SRAM product line, designed specifically for applications demanding deterministic latency, burst-mode efficiency, and low-power sleep capability in network processors and real-time control systems.
FAQ
What is the maximum operating frequency supported by the 71V67603S133PFG8?
The 71V67603S133PFG8 is rated for 133MHz operation, corresponding to a minimum clock cycle time (tCYC) of 7.5ns. This frequency is guaranteed across the commercial temperature range (0°C to +70°C) with VDD and VDDQ at 3.3V ±5%. Higher speeds (150MHz/166MHz) require derating and are not supported by this specific speed grade.
Does the 71V67603S133PFG8 support both linear and interleaved burst modes?
Yes, the 71V67603S133PFG8 supports both burst modes via the LBO (Linear Burst Order) input pin. When LBO is driven LOW, the device executes linear burst addressing; when LBO is HIGH, it uses interleaved burst order. LBO is a static configuration pin and must remain stable during operation.
How does the ZZ pin function in the 71V67603S133PFG8?
The ZZ pin on the 71V67603S133PFG8 is an asynchronous sleep mode enable. When driven HIGH, it gates the internal clock and reduces supply current to ≤70mA (IZZ), while retaining data. No power supply sequencing is required, and the device resumes normal operation within tZZR (100ns) after ZZ returns LOW.
What package type is used for the 71V67603S133PFG8?
The 71V67603S133PFG8 is supplied in a 100-pin thin quad flatpack (TQFP) per JEDEC MO-147AA, with 14mm × 20mm body size and 0.5mm lead pitch. It is not offered in BGA variants under this exact part number - the PFG8 suffix confirms the TQFP-100 packaging.
Can the 71V67603S133PFG8 operate with different memory configurations?
Yes, the 71V67603S133PFG8 is configurable as either 256K × 36-bit or 512K × 18-bit via pin strapping (e.g., A18 usage and NC pin assignments differ between modes). The 256K × 36 organization is the default and primary configuration for this part number; the 512K × 18 mode requires verifying address pin mapping per the functional description.
71V67603S133PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V67603S133PFG8 FAQ
1.How can I place an order for 71V67603S133PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67603S133PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V67603S133PFG8 reliable?
The price and inventory of 71V67603S133PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67603S133PFG8 is usually 5 days.
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Once your 71V67603S133PFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V67603S133PFG8?
For technical support, including 71V67603S133PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67603S133PFG8 requirements.
6.How does Aetrix verify that 71V67603S133PFG8 is sourced from the original manufacturer or authorized distributors?
All 71V67603S133PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67603S133PFG8 meets industry standards.
7.What is the process for return or replacement of 71V67603S133PFG8?
All 71V67603S133PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67603S133PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67603S133PFG8 part is unused and in its original packaging.
Return procedure for 71V67603S133PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67603S133PFG8 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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