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Renesas 71V67603S150BQG8

Part No.:
71V67603S150BQG8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V67603S150BQG8.pdf
Description:
IC SRAM 9MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,444

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Product details

Overview

71V67603S150BQG8 from IDT (now Renesas) is a 256K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, single-cycle deselect, and 150MHz operation (3.8ns clock access time). It supports interleaved/linear burst modes via LBO input, features self-timed write with global and byte-level write control, and targets high-bandwidth cache and buffer applications in telecom and networking equipment.

For engineers reviewing the 71V67603S150BQG8 datasheet, 71V67603S150BQG8 pinout, 71V67603S150BQG8 application, or 71V67603S150BQG8 equivalent, key selection considerations include its 100-pin TQFP package, 3.3V core/I/O supply, burst counter architecture, ZZ sleep mode support, and compatibility with high-speed processor/cache controller interfaces requiring pipelined read timing and single-cycle deselection.

Technical Context

The 71V67603S150BQG8 implements a synchronous, clock-driven interface with registered address, data, and control inputs triggered on the rising edge of CLK. Its internal burst logic uses a binary counter to generate four consecutive addresses from a single input, with sequence order determined by the static LBO pin state-linear when LBO = LOW, interleaved when LBO = HIGH.

Write operations are self-timed and configurable: global write (GW) enables full 36-bit writes, while BWE and BW1–BW4 allow selective 9-bit byte writes. Pipelined output registers deliver first data one clock cycle after address assertion, enabling sustained 150MHz throughput without wait states in burst mode.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9Mbit), supporting 512K × 18-bit via pin-compatible variant mapping
Clock Frequency150MHz max - enables 6.7ns clock cycle for high-throughput burst reads/writes
Access Time3.8ns clock-to-data (tCD) - defines minimum latency for first valid output in pipelined read
Supply Voltages3.3V ±5% VDD (core) and VDDQ (I/O) - requires dual 3.3V rails with independent decoupling
Burst ModeLinear or interleaved 4-word burst - selectable via LBO pin; no external counter needed
Sleep Current50mA max IZZ in full sleep mode (ZZ = HIGH) - reduces power during idle periods
Package100-pin thin quad flatpack (TQFP), JEDEC standard 14mm × 20mm footprint

Pinout & Package

71V67603S150BQG8 is packaged in a JEDEC-standard 100-pin thin plastic quad flatpack (TQFP), 14mm × 20mm body size, with 0.5mm lead pitch. Pin 1 is marked by a dot or beveled corner per standard orientation.

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Address InputsSynchronous address latching on rising CLK edge gated by ADSP/ADSC; A0–A17 used for 256K×36 mode
CLKSystem Clock InputPrimary timing reference; all synchronous operations aligned to rising edge
GW, BWE, BW1–BW4Write Control InputsGW enables full 36-bit write; BWE gates BWx; BW1–BW4 select four 9-bit bytes independently
ADV, ADSP, ADSCBurst Address ControlADSP/ADSC load address register; ADV advances internal burst counter; all synchronous
LBOBurst Order SelectAsynchronous static input: LOW = linear burst, HIGH = interleaved burst
ZZSleep Mode EnableAsynchronous HIGH disables internal clock and reduces current to 50mA (IZZ)
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional bus with registered input/output paths; I/OP1–I/OP4 are parity bits
VDD, VDDQ, VSSPower/GroundVDD = 3.3V core; VDDQ = 3.3V I/O; separate planes required for noise isolation

Key Features

FeatureDesign Value
Pipelined OutputsFirst data appears on next CLK rising edge - eliminates read turnaround penalty in burst sequences
Single-Cycle DeselectDevice enters high-Z output state within one clock cycle of chip disable - prevents bus contention
Self-Timed Write CycleInternal timing logic eliminates need for external write pulse generation - simplifies controller design
Byte-Write CapabilityFour independent 9-bit write enables (BW1–BW4) - allows partial-word updates without read-modify-write
Configurable Burst OrderLBO pin selects linear or interleaved addressing - matches cache line layouts in specific processors

Applications

Network Packet BufferProcessor Cache Tag RAM

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: High-speed, low-latency buffer memory interfacing directly with packet classifier ASICs.

Use Value: 150MHz burst reads deliver four 36-bit words per cycle, matching line-rate header processing requirements without stalling.

Use Scenario: Holding tag and status information for L1/L2 cache lines in RISC-based baseband processors.

IC Role / Device Role / Timing Role: Synchronous tag RAM with pipelined outputs synchronized to CPU clock domain.

Use Value: Single-cycle deselect prevents bus conflicts during cache miss handling; ZZ sleep mode cuts standby power by >85%.

Telecom Line Card FIFOIndustrial PLC Data Exchange Buffer

Use Scenario: Temporary storage of TDM frame payloads between framer and DSP on telecom line cards.

IC Role / Device Role / Timing Role: Burst-mode SRAM acting as elastic buffer between asynchronous framer and synchronous DSP core.

Use Value: Interleaved burst mode (LBO=HIGH) aligns with Motorola/Freescale DSP address sequencing, reducing address bus overhead.

Use Scenario: Real-time exchange of sensor data and control commands between multiple I/O modules and main controller.

IC Role / Device Role / Timing Role: Deterministic-access shared memory for time-critical deterministic Ethernet (TSN) protocols.

Use Value: Guaranteed 3.8ns tCD and 4.2ns tOHZ ensure predictable read/write timing margins under industrial temperature range (–40°C to +85°C).

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV18-167BZXI512K × 18-bit, 167MHz, 165-ball fBGA only - no TQFP option; different pinout and burst control schemeHigher density but incompatible package and interface timing; requires PCB redesignSelect only if migrating to higher capacity and accepting BGA-only assembly and new layout
AS7C3256A-15JIN32K × 8-bit, 15ns async access, SOJ-32 package - asynchronous, lower speed, smaller capacityNot suitable for burst or pipelined systems; lacks ADV/ADSP/ADSC interface and ZZ sleepUse only for legacy non-burst designs where synchronous timing and low-power sleep are not required

Compared with CY7C1362BV18-167BZXI and AS7C3256A-15JIN, the 71V67603S150BQG8 uniquely delivers 256K×36 organization in a 100-pin TQFP with full burst control, pipelined outputs, and hardware sleep - making it irreplaceable for space-constrained, high-throughput synchronous buffer designs requiring pin-compatible upgrade paths.

Availability

71V67603S150BQG8 is available at Aetrix Electronics and suitable for network packet buffering, processor cache tag storage, and telecom line card FIFO applications requiring stable component supply across extended product lifecycles.

Supply support for 71V67603S150BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation (formerly Integrated Device Technology, IDT) is a global semiconductor leader specializing in high-performance analog, mixed-signal, and memory solutions for communications, computing, and industrial markets.

The 71V67603S150BQG8 belongs to IDT's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-oriented buffer and cache applications in telecom infrastructure and high-end embedded systems.

FAQ

What is the maximum operating frequency of the 71V67603S150BQG8?

The 71V67603S150BQG8 is rated for 150MHz operation, corresponding to a 6.7ns clock cycle time and 3.8ns clock-to-data (tCD) access time. This rating applies across the commercial temperature range (0°C to +70°C); industrial-grade variants support 133MHz at –40°C to +85°C. The 'S150' suffix explicitly denotes the 150MHz speed grade.

Does the 71V67603S150BQG8 support both linear and interleaved burst modes?

Yes, the 71V67603S150BQG8 supports both burst modes via the LBO (Linear Burst Order) pin. When LBO is driven LOW, the device executes linear burst addressing (00→01→10→11); when LBO is HIGH, it performs interleaved burst (00→01→11→10). LBO is an asynchronous static input and must remain stable during active operation.

What is the function of the ZZ pin on the 71V67603S150BQG8?

The ZZ pin on the 71V67603S150BQG8 enables full sleep mode. When ZZ is driven HIGH, the internal clock is gated and core logic enters ultra-low-power state, reducing supply current to 50mA (IZZ) while maintaining data retention. ZZ is asynchronous and requires no setup/hold timing relative to CLK.

How many data bits does the 71V67603S150BQG8 provide, and what is the role of I/OP1–I/OP4?

The 71V67603S150BQG8 provides 36 data bits: I/O0–I/O31 (32 bits) plus I/OP1–I/OP4 (4 parity bits). These parity bits support error detection in mission-critical buffer applications. In 512K×18 configurations (e.g., 71V67803), I/OP1–I/OP4 are unused and may be left unconnected.

Is the 71V67603S150BQG8 pin-compatible with other devices in the 71V676xx/71V678xx family?

Yes, the 71V67603S150BQG8 shares identical pinout and package (100-pin TQFP) with 71V67803 variants and other speed grades (e.g., 71V67603S166BQG8). Memory organization (256K×36 vs. 512K×18) is configured via address pin usage (A18), not pin count - enabling drop-in replacement within the same package footprint and signal routing.

71V67603S150BQG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
150 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V67603S150BQG8 FAQ

1.How can I place an order for 71V67603S150BQG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V67603S150BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V67603S150BQG8 reliable?

The price and inventory of 71V67603S150BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67603S150BQG8 is usually 5 days.

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4.How is shipping managed for 71V67603S150BQG8?

71V67603S150BQG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V67603S150BQG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V67603S150BQG8?

For technical support, including 71V67603S150BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67603S150BQG8 requirements.

6.How does Aetrix verify that 71V67603S150BQG8 is sourced from the original manufacturer or authorized distributors?

All 71V67603S150BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67603S150BQG8 meets industry standards.

7.What is the process for return or replacement of 71V67603S150BQG8?

All 71V67603S150BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67603S150BQG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V67603S150BQG8 part is unused and in its original packaging.

Return procedure for 71V67603S150BQG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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