Renesas 71V67603S150BQG8
- Part No.:
- 71V67603S150BQG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V67603S150BQG8.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,444
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V67603S150BQG8 from IDT (now Renesas) is a 256K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, single-cycle deselect, and 150MHz operation (3.8ns clock access time). It supports interleaved/linear burst modes via LBO input, features self-timed write with global and byte-level write control, and targets high-bandwidth cache and buffer applications in telecom and networking equipment.
For engineers reviewing the 71V67603S150BQG8 datasheet, 71V67603S150BQG8 pinout, 71V67603S150BQG8 application, or 71V67603S150BQG8 equivalent, key selection considerations include its 100-pin TQFP package, 3.3V core/I/O supply, burst counter architecture, ZZ sleep mode support, and compatibility with high-speed processor/cache controller interfaces requiring pipelined read timing and single-cycle deselection.
Technical Context
The 71V67603S150BQG8 implements a synchronous, clock-driven interface with registered address, data, and control inputs triggered on the rising edge of CLK. Its internal burst logic uses a binary counter to generate four consecutive addresses from a single input, with sequence order determined by the static LBO pin state-linear when LBO = LOW, interleaved when LBO = HIGH.
Write operations are self-timed and configurable: global write (GW) enables full 36-bit writes, while BWE and BW1–BW4 allow selective 9-bit byte writes. Pipelined output registers deliver first data one clock cycle after address assertion, enabling sustained 150MHz throughput without wait states in burst mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9Mbit), supporting 512K × 18-bit via pin-compatible variant mapping |
| Clock Frequency | 150MHz max - enables 6.7ns clock cycle for high-throughput burst reads/writes |
| Access Time | 3.8ns clock-to-data (tCD) - defines minimum latency for first valid output in pipelined read |
| Supply Voltages | 3.3V ±5% VDD (core) and VDDQ (I/O) - requires dual 3.3V rails with independent decoupling |
| Burst Mode | Linear or interleaved 4-word burst - selectable via LBO pin; no external counter needed |
| Sleep Current | 50mA max IZZ in full sleep mode (ZZ = HIGH) - reduces power during idle periods |
| Package | 100-pin thin quad flatpack (TQFP), JEDEC standard 14mm × 20mm footprint |
Pinout & Package
71V67603S150BQG8 is packaged in a JEDEC-standard 100-pin thin plastic quad flatpack (TQFP), 14mm × 20mm body size, with 0.5mm lead pitch. Pin 1 is marked by a dot or beveled corner per standard orientation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous address latching on rising CLK edge gated by ADSP/ADSC; A0–A17 used for 256K×36 mode |
| CLK | System Clock Input | Primary timing reference; all synchronous operations aligned to rising edge |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE gates BWx; BW1–BW4 select four 9-bit bytes independently |
| ADV, ADSP, ADSC | Burst Address Control | ADSP/ADSC load address register; ADV advances internal burst counter; all synchronous |
| LBO | Burst Order Select | Asynchronous static input: LOW = linear burst, HIGH = interleaved burst |
| ZZ | Sleep Mode Enable | Asynchronous HIGH disables internal clock and reduces current to 50mA (IZZ) |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus with registered input/output paths; I/OP1–I/OP4 are parity bits |
| VDD, VDDQ, VSS | Power/Ground | VDD = 3.3V core; VDDQ = 3.3V I/O; separate planes required for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Outputs | First data appears on next CLK rising edge - eliminates read turnaround penalty in burst sequences |
| Single-Cycle Deselect | Device enters high-Z output state within one clock cycle of chip disable - prevents bus contention |
| Self-Timed Write Cycle | Internal timing logic eliminates need for external write pulse generation - simplifies controller design |
| Byte-Write Capability | Four independent 9-bit write enables (BW1–BW4) - allows partial-word updates without read-modify-write |
| Configurable Burst Order | LBO pin selects linear or interleaved addressing - matches cache line layouts in specific processors |
Applications
| Network Packet Buffer | Processor Cache Tag RAM |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: High-speed, low-latency buffer memory interfacing directly with packet classifier ASICs. Use Value: 150MHz burst reads deliver four 36-bit words per cycle, matching line-rate header processing requirements without stalling. | Use Scenario: Holding tag and status information for L1/L2 cache lines in RISC-based baseband processors. IC Role / Device Role / Timing Role: Synchronous tag RAM with pipelined outputs synchronized to CPU clock domain. Use Value: Single-cycle deselect prevents bus conflicts during cache miss handling; ZZ sleep mode cuts standby power by >85%. |
| Telecom Line Card FIFO | Industrial PLC Data Exchange Buffer |
Use Scenario: Temporary storage of TDM frame payloads between framer and DSP on telecom line cards. IC Role / Device Role / Timing Role: Burst-mode SRAM acting as elastic buffer between asynchronous framer and synchronous DSP core. Use Value: Interleaved burst mode (LBO=HIGH) aligns with Motorola/Freescale DSP address sequencing, reducing address bus overhead. | Use Scenario: Real-time exchange of sensor data and control commands between multiple I/O modules and main controller. IC Role / Device Role / Timing Role: Deterministic-access shared memory for time-critical deterministic Ethernet (TSN) protocols. Use Value: Guaranteed 3.8ns tCD and 4.2ns tOHZ ensure predictable read/write timing margins under industrial temperature range (–40°C to +85°C). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV18-167BZXI | 512K × 18-bit, 167MHz, 165-ball fBGA only - no TQFP option; different pinout and burst control scheme | Higher density but incompatible package and interface timing; requires PCB redesign | Select only if migrating to higher capacity and accepting BGA-only assembly and new layout |
| AS7C3256A-15JIN | 32K × 8-bit, 15ns async access, SOJ-32 package - asynchronous, lower speed, smaller capacity | Not suitable for burst or pipelined systems; lacks ADV/ADSP/ADSC interface and ZZ sleep | Use only for legacy non-burst designs where synchronous timing and low-power sleep are not required |
Compared with CY7C1362BV18-167BZXI and AS7C3256A-15JIN, the 71V67603S150BQG8 uniquely delivers 256K×36 organization in a 100-pin TQFP with full burst control, pipelined outputs, and hardware sleep - making it irreplaceable for space-constrained, high-throughput synchronous buffer designs requiring pin-compatible upgrade paths.
Availability
71V67603S150BQG8 is available at Aetrix Electronics and suitable for network packet buffering, processor cache tag storage, and telecom line card FIFO applications requiring stable component supply across extended product lifecycles.
Supply support for 71V67603S150BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation (formerly Integrated Device Technology, IDT) is a global semiconductor leader specializing in high-performance analog, mixed-signal, and memory solutions for communications, computing, and industrial markets.
The 71V67603S150BQG8 belongs to IDT's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-oriented buffer and cache applications in telecom infrastructure and high-end embedded systems.
FAQ
What is the maximum operating frequency of the 71V67603S150BQG8?
The 71V67603S150BQG8 is rated for 150MHz operation, corresponding to a 6.7ns clock cycle time and 3.8ns clock-to-data (tCD) access time. This rating applies across the commercial temperature range (0°C to +70°C); industrial-grade variants support 133MHz at –40°C to +85°C. The 'S150' suffix explicitly denotes the 150MHz speed grade.
Does the 71V67603S150BQG8 support both linear and interleaved burst modes?
Yes, the 71V67603S150BQG8 supports both burst modes via the LBO (Linear Burst Order) pin. When LBO is driven LOW, the device executes linear burst addressing (00→01→10→11); when LBO is HIGH, it performs interleaved burst (00→01→11→10). LBO is an asynchronous static input and must remain stable during active operation.
What is the function of the ZZ pin on the 71V67603S150BQG8?
The ZZ pin on the 71V67603S150BQG8 enables full sleep mode. When ZZ is driven HIGH, the internal clock is gated and core logic enters ultra-low-power state, reducing supply current to 50mA (IZZ) while maintaining data retention. ZZ is asynchronous and requires no setup/hold timing relative to CLK.
How many data bits does the 71V67603S150BQG8 provide, and what is the role of I/OP1–I/OP4?
The 71V67603S150BQG8 provides 36 data bits: I/O0–I/O31 (32 bits) plus I/OP1–I/OP4 (4 parity bits). These parity bits support error detection in mission-critical buffer applications. In 512K×18 configurations (e.g., 71V67803), I/OP1–I/OP4 are unused and may be left unconnected.
Is the 71V67603S150BQG8 pin-compatible with other devices in the 71V676xx/71V678xx family?
Yes, the 71V67603S150BQG8 shares identical pinout and package (100-pin TQFP) with 71V67803 variants and other speed grades (e.g., 71V67603S166BQG8). Memory organization (256K×36 vs. 512K×18) is configured via address pin usage (A18), not pin count - enabling drop-in replacement within the same package footprint and signal routing.
71V67603S150BQG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V67603S150BQG8 FAQ
1.How can I place an order for 71V67603S150BQG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67603S150BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V67603S150BQG8 reliable?
The price and inventory of 71V67603S150BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67603S150BQG8 is usually 5 days.
3.What payment methods are accepted for 71V67603S150BQG8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V67603S150BQG8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V67603S150BQG8?
71V67603S150BQG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V67603S150BQG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V67603S150BQG8?
For technical support, including 71V67603S150BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67603S150BQG8 requirements.
6.How does Aetrix verify that 71V67603S150BQG8 is sourced from the original manufacturer or authorized distributors?
All 71V67603S150BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67603S150BQG8 meets industry standards.
7.What is the process for return or replacement of 71V67603S150BQG8?
All 71V67603S150BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67603S150BQG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67603S150BQG8 part is unused and in its original packaging.
Return procedure for 71V67603S150BQG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67603S150BQG8 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

