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Renesas 71V67703S75BGGI

Part No.:
71V67703S75BGGI
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V67703S75BGGI.pdf
Description:
IC SRAM 9MBIT PAR 117MHZ 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,810

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Product details

Overview

71V67703S75BGGI from IDT (now Renesas) is a 256K × 36-bit, 3.3V synchronous SRAM with flow-through output architecture, 7.5ns access time at up to 117MHz clock frequency, and JEDEC-standard 119-ball BGA (BGG) package. It supports linear/interleaved burst modes via LBO pin, self-timed write with global/byte write controls, and industrial temperature operation (–40°C to +85°C), targeting high-bandwidth cache and buffer applications in networking and telecom systems.

For engineers reviewing the 71V67703S75BGGI datasheet, 71V67703S75BGGI pinout, 71V67703S75BGGI application, or 71V67703S75BGGI equivalent, key selection criteria include burst-mode timing compliance, 3.3V I/O voltage tolerance, single-cycle deselect capability, flow-through output latency, and ZZ-controlled sleep mode current (≤70mA).

Technical Context

The 71V67703S75BGGI implements a synchronous, clock-driven interface with registered address/data inputs and unregistered (flow-through) outputs-eliminating output register delay. Its internal burst counter advances on ADV=LOW and selects sequence order (linear vs. interleaved) via static LBO configuration.

Write operations are fully synchronous and support four distinct control paths: global write (GW), byte write enable (BWE), individual byte writes (BW1–BW4), and asynchronous OE/ZZ for output disable and power-down. All timing references are synchronized to CLK rising edge with strict setup/hold requirements.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9Mbit); enables 36-bit parallel data path for wide-bus systems like RISC CPU caches.
Access Time7.5ns max; guarantees tCD ≤ 7.5ns from CLK rise to valid output data under commercial/industrial conditions.
Maximum Clock Frequency117MHz; derived from tCYC ≥ 8.5ns, supporting high-throughput burst reads/writes.
Supply VoltagesVDD = 3.3V ±5% (core), VDDQ = 3.3V ±5% (I/O); ensures compatibility with 3.3V logic families without level shifting.
Operating Temperature–40°C to +85°C; validated for industrial-grade reliability in base station and router environments.
Sleep Mode CurrentIZZ ≤ 70mA (industrial); reduces active power during idle cycles via asynchronous ZZ HIGH assertion.
Burst ModeFour-word burst per address; eliminates repeated address strobes and improves bus efficiency by 3× over single-word access.

Pinout & Package

71V67703S75BGGI is packaged in a JEDEC-standard 119-ball fine-pitch BGA (BGG119), 12mm × 12mm body, 0.8mm ball pitch, with thermal pad exposed on underside. Pinout matches BG119/BGG119 footprint per IDT document 5309 drw 02c.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit synchronous address bus; latched on rising CLK edge when ADSP/ADSC asserted with CE active.
CLKClock InputPrimary timing reference; all synchronous inputs sampled on rising edge; defines tCYC, tCD, tOE timing windows.
GW, BWE, BW1–BW4Write Control InputsGW enables full 36-bit write; BWE gates BWx; BW1–BW4 select 9-bit bytes (I/O0–7/I/OP1, etc.) independently.
ADV, LBOBurst Control InputsADV=LOW advances burst counter; LBO=LOW selects linear burst order (A0/A1 increment), LBO=HIGH selects interleaved.
OEOutput EnableAsynchronous control: OE=LOW enables flow-through outputs; OE=HIGH forces I/O pins to high-Z regardless of CLK state.
ZZSleep Mode InputAsynchronous power-down: ZZ=HIGH disables internal clock and reduces supply current to IZZ ≤ 70mA.
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional data bus; input path registered, output path flow-through (no output register delay).

Key Features

FeatureDesign Value
Flow-Through Output ArchitectureEliminates output register delay: data appears on I/O pins within tCD ≤ 7.5ns after CLK rise-critical for zero-wait-state CPU interfaces.
Single-Cycle DeselectChip deactivation completes in one clock cycle; enables rapid context switching between memory banks without pipeline stalls.
Self-Timed Write CycleInternal timing logic resolves write completion without external wait-state generation-simplifies controller design and improves throughput.
Configurable Burst OrderLBO pin statically selects linear (sequential A0/A1) or interleaved (cache-friendly) 4-word burst addressing-adapts to processor/cache architecture.
Industrial Temperature SupportValidated operation from –40°C to +85°C with full AC/DC specs; suitable for outdoor telecom equipment and industrial controllers.

Applications

High-Speed Network Packet BufferReal-Time DSP Data Cache

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/L3 switches with line-rate throughput.

IC Role / Device Role / Timing Role: 36-bit-wide synchronous SRAM acting as packet descriptor buffer and temporary payload store; leverages 117MHz burst reads to feed MAC engines.

Use Value: 7.5ns tCD and flow-through outputs eliminate output register latency, enabling deterministic frame processing within tight timing budgets.

Use Scenario: Serving as low-latency instruction/data cache for TI C6000 or Analog Devices SHARC DSPs in radar signal processing.

IC Role / Device Role / Timing Role: On-chip cache extension providing 9Mbit of fast, burst-accessible memory with single-cycle deselect for multi-context switching.

Use Value: Linear burst mode (LBO=LOW) delivers sequential 36-bit words matching DSP fetch patterns, reducing bus arbitration overhead by 75%.

Telecom Baseband Processor BufferIndustrial PLC Real-Time I/O Memory

Use Scenario: Holding channelized TDM data streams (E1/T1) and protocol stack buffers in 4G/LTE small cell baseband units.

IC Role / Device Role / Timing Role: Synchronous SRAM interfacing directly with FPGA-based framer logic; uses ADV/LBO to align burst addresses with timeslot boundaries.

Use Value: Interleaved burst mode (LBO=HIGH) maps naturally to TDM slot interleaving, minimizing address calculation logic in FPGA control state machines.

Use Scenario: Providing deterministic, jitter-free memory for cyclic I/O scanning and motion control algorithms in DIN-rail PLCs.

IC Role / Device Role / Timing Role: Deterministic-access memory mapped into real-time OS kernel space; leverages ZZ sleep mode during idle scan cycles to reduce system power.

Use Value: Industrial temp rating (–40°C to +85°C) and IZZ ≤ 70mA ensure reliable operation in uncooled control cabinets while meeting energy efficiency standards.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1373KV18512K × 18-bit organization; 8ns access; 165-ball fBGA; Cypress (Infineon) device with different burst control (BCD pin vs. LBO).Optimized for 18-bit bus systems (e.g., PCI-X); lacks linear/interleaved burst flexibility; requires redesign of burst address logic.Select when 18-bit data width suffices and legacy Cypress ecosystem integration is prioritized over burst configurability.
AS7C3256B32K × 8-bit async SRAM; no clock/burst; 32-pin SOIC; Alliance Memory device with 15ns access and 5V/3.3V dual supply.Asynchronous interface only; no flow-through or burst capability; unsuitable for high-speed synchronous buses requiring tCD ≤ 7.5ns.Consider only for cost-sensitive, low-frequency control-plane memory where timing determinism and bandwidth are non-critical.

Compared with CY7C1373KV18 and AS7C3256B, the 71V67703S75BGGI uniquely delivers 256K × 36-bit synchronous operation with programmable burst order, flow-through latency, and industrial-grade power management-making it irreplaceable in high-performance, timing-critical embedded memory subsystems.

Availability

71V67703S75BGGI is available at Aetrix Electronics and suitable for high-speed network packet buffering, real-time DSP caching, and telecom baseband processing requiring stable component supply across extended product lifecycles.

Supply support for 71V67703S75BGGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in microcontrollers, analog, and memory solutions for automotive, industrial, and communications markets.

The 71V67703S75BGGI belongs to IDT's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-capable memory subsystems in networking infrastructure and real-time embedded systems.

FAQ

What is the maximum operating frequency supported by the 71V67703S75BGGI?

The 71V67703S75BGGI supports up to 117MHz clock frequency, corresponding to a minimum clock cycle time (tCYC) of 8.5ns. This is guaranteed under both commercial (0°C to +70°C) and industrial (–40°C to +85°C) temperature ranges with VDD/VDDQ = 3.3V ±5%. The 7.5ns access time (tCD) is measured from CLK rise to valid output data under these conditions.

Does the 71V67703S75BGGI support both linear and interleaved burst modes?

Yes, the 71V67703S75BGGI supports both burst modes via the LBO (Linear/Interleaved Burst Order) pin. When LBO = LOW, the device executes linear burst addressing (A0/A1 increment sequentially). When LBO = HIGH, it performs interleaved burst addressing. LBO is a static input and must remain stable during operation-changing it mid-burst may cause undefined behavior.

How does the flow-through output architecture of the 71V67703S75BGGI improve system timing?

The 71V67703S75BGGI's flow-through output architecture eliminates the output register delay found in pipelined SRAMs. Data appears on I/O pins within tCD ≤ 7.5ns after the CLK rising edge-enabling zero-wait-state CPU or FPGA interfaces. This deterministic latency simplifies timing closure in high-speed designs where output register skew would otherwise require additional clock cycles or complex synchronization logic.

What is the function of the ZZ pin on the 71V67703S75BGGI?

The ZZ pin on the 71V67703S75BGGI is an asynchronous sleep mode input. When ZZ = HIGH, the internal clock is gated and the device enters full sleep mode, reducing supply current to IZZ ≤ 70mA (industrial grade). Data retention is guaranteed during sleep. ZZ requires no setup/hold timing relative to CLK and can be asserted at any time-even mid-burst-to minimize dynamic power without disrupting memory contents.

Can the 71V67703S75BGGI perform byte-level writes, and how are they controlled?

Yes, the 71V67703S75BGGI supports granular byte writes via four independent byte write enables (BW1–BW4), each controlling a 9-bit segment of the 36-bit data bus. BW1 governs I/O0–I/O7 and I/OP1; BW2 covers I/O8–I/O15 and I/OP2; and so on. These are enabled only when BWE = LOW and are sampled synchronously on the CLK rising edge-allowing precise 9-bit updates without disturbing adjacent data.

71V67703S75BGGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
117 MHz
Write Cycle Time - Word, Page:
-
Access Time:
7.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V67703S75BGGI FAQ

1.How can I place an order for 71V67703S75BGGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V67703S75BGGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V67703S75BGGI reliable?

The price and inventory of 71V67703S75BGGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67703S75BGGI is usually 5 days.

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4.How is shipping managed for 71V67703S75BGGI?

71V67703S75BGGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V67703S75BGGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V67703S75BGGI?

For technical support, including 71V67703S75BGGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67703S75BGGI requirements.

6.How does Aetrix verify that 71V67703S75BGGI is sourced from the original manufacturer or authorized distributors?

All 71V67703S75BGGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67703S75BGGI meets industry standards.

7.What is the process for return or replacement of 71V67703S75BGGI?

All 71V67703S75BGGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V67703S75BGGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V67703S75BGGI part is unused and in its original packaging.

Return procedure for 71V67703S75BGGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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