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Renesas 71V67703S75BQ

Part No.:
71V67703S75BQ
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V67703S75BQ.pdf
Description:
IC SRAM 9MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,267

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Product details

Overview

71V67703S75BQ from IDT (now Renesas) is a 256K × 36-bit (9-Mbit), 3.3V synchronous SRAM with flow-through output architecture, 7.5ns access time, and support for 117MHz burst operation. It features self-timed write control via GW/BWE/BWx inputs, linear/interleaved burst mode selection via LBO, and single-cycle deselect capability. Used in high-bandwidth networking buffers and cache subsystems requiring deterministic timing.

For engineers reviewing the 71V67703S75BQ datasheet, 71V67703S75BQ pinout, 71V67703S75BQ application, or 71V67703S75BQ equivalent, key selection criteria include burst address sequencing behavior, flow-through vs. pipelined output latency, ZZ-controlled sleep mode current (≤70mA), and TQFP-100 package compatibility with industrial temperature range (–40°C to +85°C).

Technical Context

This SRAM implements a synchronous interface with clock-triggered address latching via ADSP/ADSC, internal burst counter logic, and asynchronous OE/ZZ controls. The flow-through output path eliminates output register delay, enabling tCD = 7.5ns clock-to-data propagation with no pipeline stage between array and I/O pins.

Burst operation is initiated by ADV=LOW and governed by LBO state: when LBO=LOW, linear sequence (00→01→10→11) applies; when LBO=HIGH, interleaved sequence (00→01→11→10) applies. Write cycles support global (GW) or byte-selectable (BW1–BW4) control with BWE gating, and all writes are self-timed without external wait-state generation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36-bit (9,175,040 bits); supports 512K × 18-bit configuration via address mapping
Access Time (tCD) 7.5ns maximum - defines minimum clock-to-valid-output delay for read bursts
Maximum Clock Frequency 117MHz - achievable only at 7.5ns speed grade with full burst reads
Supply Voltages VDD = 3.3V ±5% (core), VDDQ = 3.3V ±5% (I/O) - requires separate low-noise regulation
Operating Temperature –40°C to +85°C (industrial grade) - validated for extended thermal cycling in telecom infrastructure
Power-Down Current (IZZ) ≤70mA at VDD = max - enables low-power standby during packet idle periods
Output Architecture Flow-through (no output register) - eliminates one clock cycle of output latency vs. pipelined SRAMs

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14mm × 20mm body, 0.5mm pitch. Pinout validated per IDT document 5309 drw 02a for 256K×36 configuration.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs Synchronous address latching on rising CLK edge when ADSP/ADSC active; A0–A17 used for 256K×36 addressing
CLK System Clock Input Primary timing reference; all synchronous inputs sampled on rising edge
CE, CS0, CS1 Chip Enable / Selects Three-level chip select hierarchy: CE LOW + CS0 HIGH + CS1 LOW enables device
GW, BWE, BW1–BW4 Write Control Inputs GW enables full-word write; BWE gates BWx; BW1–BW4 each control 9-bit byte (I/O0–7+I/OP1, etc.)
OE Asynchronous Output Enable Drives I/O pins to high-Z immediately when HIGH - enables bus sharing without clock alignment
ZZ Asynchronous Sleep Mode Internally gates CLK and reduces IDD to ≤70mA; retains data with VDD applied
I/O0–I/O31, I/OP1–I/OP4 Data I/O Pins 36-bit bidirectional bus; flow-through outputs - data appears tCD after CLK rise with no register delay
LBO Burst Order Selection DC-level input: LOW = linear burst (00→01→10→11), HIGH = interleaved (00→01→11→10)

Key Features

Feature Design Value
Flow-through output architecture Eliminates output register delay - delivers first burst word in exactly tCD = 7.5ns from CLK rise
Self-timed write cycle No external wait-state generation required; internal timing completes write before next CLK edge
Single-cycle deselect Device enters high-Z output state within one clock cycle of CE/CS deassertion - prevents bus contention
Configurable burst order (LBO) Hardware-selectable linear or interleaved address sequencing - matches processor/cache controller requirements
Low-power sleep mode (ZZ) Reduces supply current to ≤70mA while retaining memory contents - critical for power-gated subsystems

Applications

High-Speed Network Packet Buffer L2 Cache Tag Storage

Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G Ethernet switch ASICs.

IC Role / Device Role / Timing Role: Primary burst-access buffer interfacing directly to SerDes MAC layer with 117MHz clock domain.

Use Value: 7.5ns tCD and flow-through outputs enable header lookup completion within one clock cycle - reducing forwarding latency by ≥1.5ns vs. pipelined SRAMs.

Use Scenario: Holding tag RAM entries for multi-way associative L2 caches in baseband processors.

IC Role / Device Role / Timing Role: Synchronous tag store accessed on every cache probe; supports burst reads of 4-way tag sets.

Use Value: Linear burst mode (LBO=LOW) delivers four consecutive tag words in four CLK edges - matching 4-way associativity without address reissuance.

Industrial PLC Real-Time FIFO Radar Signal Processing Buffer

Use Scenario: Implementing deterministic input/output FIFOs in programmable logic controllers with hard real-time deadlines.

IC Role / Device Role / Timing Role: Dual-port accessible SRAM buffer synchronized to deterministic scan cycle clock.

Use Value: Single-cycle deselect and ZZ sleep mode allow rapid context switching between I/O modules while maintaining data integrity across power-save intervals.

Use Scenario: Capturing and staging ADC samples from phased-array radar front-ends prior to FFT processing.

IC Role / Device Role / Timing Role: High-throughput burst-write buffer accepting 117MHz sample streams with minimal latency jitter.

Use Value: Self-timed write with GW/BWE control ensures reliable capture of 16-bit I/Q samples at 117MSPS without external handshake signals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371BV33-75BGXI 72-Mbit (2M×36), 7.5ns, 100-pin TQFP, but uses pipelined (not flow-through) output architecture Higher density but adds 1-cycle output latency - unsuitable where tCD-critical timing dominates Select only if capacity >9Mbit is required and added latency is acceptable in system timing budget
AS7C36256PFSIG-75 256K×36, 7.5ns, 100-pin TQFP, flow-through output, but rated only for commercial temp (0°C to +70°C) Lacks industrial temperature qualification - not suitable for outdoor or factory-floor deployments Acceptable for cost-sensitive commercial systems where ambient temperature remains <70°C

Compared with CY7C1371BV33-75BGXI and AS7C36256PFSIG-75, the 71V67703S75BQ uniquely combines industrial temperature rating, flow-through latency, and verified 117MHz burst operation - making it the sole option meeting all three requirements simultaneously in TQFP-100.

Availability

71V67703S75BQ is available at Aetrix Electronics and suitable for high-speed network packet buffering, L2 cache tag storage, industrial PLC real-time FIFOs, and radar signal processing buffers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 71V67703S75BQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, designs high-performance memory and timing solutions for communications, computing, and industrial markets.

The 71V67703S75BQ belongs to IDT's 3.3V synchronous SRAM product line, engineered specifically for deterministic-latency applications in networking infrastructure and real-time embedded systems where flow-through timing and industrial reliability are mandatory.

FAQ

What is the maximum operating frequency supported by the 71V67703S75BQ?

The 71V67703S75BQ supports up to 117MHz clock frequency when operated at its 7.5ns speed grade. This maximum frequency is achievable only during burst read operations with tCYC ≥ 8.5ns and under industrial temperature conditions (–40°C to +85°C) with VDD and VDDQ maintained at 3.3V ±5%. Non-burst or write operations may impose lower effective throughput limits due to setup/hold timing constraints.

Does the 71V67703S75BQ support both linear and interleaved burst modes?

Yes, the 71V67703S75BQ supports both burst modes via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, the device executes linear burst sequencing (00→01→10→11). When LBO is driven HIGH, it executes interleaved sequencing (00→01→11→10). LBO is a static DC input and must remain stable during active operation to prevent burst counter corruption.

How does the flow-through output architecture of the 71V67703S75BQ affect system timing?

The flow-through output architecture of the 71V67703S75BQ eliminates the output register stage found in pipelined SRAMs, resulting in tCD = 7.5ns clock-to-data delay with zero additional pipeline latency. This allows the first burst word to appear on I/O pins precisely 7.5ns after the rising CLK edge - enabling tighter timing closure in high-frequency interfaces such as SerDes MAC layers and real-time DSP buffers.

What is the function of the ZZ pin on the 71V67703S75BQ?

The ZZ pin on the 71V67703S75BQ provides asynchronous entry into full sleep mode. When ZZ is driven HIGH, the internal clock is gated and supply current drops to ≤70mA (IZZ), while memory contents are retained. ZZ is internally pulled to VSS if left unconnected, ensuring default active operation. Recovery requires tZZR ≥ 100ns after ZZ returns LOW before valid accesses resume.

Can the 71V67703S75BQ be used in both 256K×36 and 512K×18 configurations?

Yes, the 71V67703S75BQ is configurable as either 256K×36 or 512K×18 through external address pin routing and mode selection. In 256K×36 mode, A0–A17 serve as address inputs; in 512K×18 mode, A0–A18 are used and data width is halved. Pin configurations differ between modes - refer to IDT document 5309 drw 02a (256K×36) and 5309 drw 02b (512K×18) for TQFP-100 layout details.

71V67703S75BQ Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
117 MHz
Write Cycle Time - Word, Page:
-
Access Time:
7.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V67703S75BQ FAQ

1.How can I place an order for 71V67703S75BQ through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V67703S75BQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V67703S75BQ reliable?

The price and inventory of 71V67703S75BQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67703S75BQ is usually 5 days.

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71V67703S75BQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V67703S75BQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V67703S75BQ?

For technical support, including 71V67703S75BQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67703S75BQ requirements.

6.How does Aetrix verify that 71V67703S75BQ is sourced from the original manufacturer or authorized distributors?

All 71V67703S75BQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67703S75BQ meets industry standards.

7.What is the process for return or replacement of 71V67703S75BQ?

All 71V67703S75BQ units undergo pre-shipment inspection (PSI). If there is an issue with 71V67703S75BQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V67703S75BQ part is unused and in its original packaging.

Return procedure for 71V67703S75BQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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