Renesas 71V67703S75BQG8
- Part No.:
- 71V67703S75BQG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V67703S75BQG8.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V67703S75BQG8 from IDT (now Renesas) is a 256K × 36-bit, 3.3V synchronous SRAM with flow-through output architecture, 7.5ns access time at up to 117MHz clock frequency, single-cycle deselect, and burst-mode capability. It serves as high-bandwidth data buffer in network packet processors and telecom line cards requiring deterministic latency and zero-output-register delay.
For engineers reviewing the 71V67703S75BQG8 datasheet, 71V67703S75BQG8 pinout, 71V67703S75BQG8 application, or 71V67703S75BQG8 equivalent, this page delivers verified timing parameters, JEDEC-standard TQFP-100 package mapping, burst control logic behavior, and industrial-grade power-down specifications - all confirmed against IDT's official 71V67703/71V67903 datasheet revision Aug.11.21.
Technical Context
The 71V67703S75BQG8 implements a synchronous, clock-driven interface with registered address, control, and data inputs, but unregistered (flow-through) outputs - eliminating output register delay for critical read-path timing. Its internal burst counter supports linear or interleaved 4-word sequences controlled by the asynchronous LBO pin.
Burst initiation is triggered by ADSP/ADSC low with CE low, and subsequent addresses are auto-generated on rising CLK edges. Write operations support global (GW) or byte-level (BW1–BW4 + BWE) control, with self-timed write cycles that complete independently of external timing constraints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9Mbit), configured as 36-bit wide data bus with A0–A17 addressing |
| Access Time | 7.5ns max - guarantees tCD ≤ 7.5ns from CLK rise to valid DOUT under commercial temp (0°C to +70°C) |
| Maximum Clock Frequency | 117MHz - enables 4-word burst reads at 468MB/s sustained throughput (36-bit × 117MHz) |
| Supply Voltages | VDD = 3.3V ±5% (core), VDDQ = 3.3V ±5% (I/O) - requires separate low-noise regulation for core and I/O rails |
| Power-Down Current | IZZ ≤ 70mA (industrial grade) - achieved via asynchronous ZZ pin assertion, retaining data during sleep |
| Operating Temperature | 0°C to +70°C (commercial grade) - validated across full voltage and frequency range per datasheet Table 04 |
| Package | JEDEC-standard 100-pin TQFP (14mm × 20mm), lead-free and RoHS-compliant (suffix 'G') |
Pinout & Package
71V67703S75BQG8 is packaged in a 100-pin thin quad flatpack (TQFP), JEDEC MO-140AC, 0.5mm pitch, body size 14mm × 20mm. Pin 1 is located at top-left corner (notch-marked side), with pins numbered counter-clockwise.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; latched on rising CLK edge when ADSP or ADSC is asserted low with CE low |
| CLK | System Clock Input | Primary timing reference; all synchronous inputs sampled on rising edge; no internal clock division |
| CE, CS0, CS1 | Chip Enable / Selects | Three-input chip selection logic: device enabled only when CE=LOW, CS0=HIGH, CS1=LOW (per Truth Table 11) |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE gates BWx; BW1–BW4 each control one 9-bit byte (I/O0–7+I/OP1, etc.) |
| OE | Output Enable | Asynchronous enable: drives I/O pins to active state when LOW; high-impedance when HIGH regardless of CLK |
| LBO | Burst Order Select | Static DC input: LOW = linear burst (00→01→10→11), HIGH = interleaved burst (00→01→11→10); must not toggle during operation |
| ZZ | Sleep Mode Input | Asynchronous entry to full sleep: asserts internal clock gate, reduces IDD to ≤70mA while retaining memory contents |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus; inputs registered on CLK rise; outputs flow-through (no register), enabling zero-cycle output latency |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Eliminates output register delay: tCD = 7.5ns is pure array + path delay - critical for real-time packet buffering where read-to-use latency must be minimized |
| Single-cycle deselect | Device transitions to high-Z output state within one CLK cycle after chip disable - prevents bus contention in multi-SRAM systems |
| Configurable burst mode (LBO) | Hardware-selectable linear or interleaved 4-word burst sequence - matches cache line ordering requirements of MIPS and PowerPC processors |
| Self-timed write cycle | Internal write completion detection frees system timing from worst-case write duration - simplifies controller design and improves bus utilization |
| Asynchronous ZZ sleep control | Instantaneous power reduction without clock-stopping coordination - enables dynamic power gating in burst-idle intervals of networking ASICs |
Applications
| Network Packet Buffering | Telecom Line Card Cache |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in 10Gbps Ethernet switch fabric ASICs. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet descriptor buffer with deterministic 7.5ns read access. Use Value: Enables line-rate header parsing and forwarding decisions without pipeline stalls - directly supported by flow-through outputs and single-cycle deselect. |
Use Scenario: Serving as instruction/data cache for DSP cores in OC-192 SONET/SDH line interface units. IC Role / Device Role / Timing Role: Synchronous burst-access memory providing 4×36-bit words per address for DSP program fetch. Use Value: Matches DSP burst-width requirements; LBO pin allows alignment with processor's native burst order (linear vs. interleaved). |
| Industrial PLC Data Logging | Medical Imaging Frame Buffer |
|
Use Scenario: Capturing timestamped sensor data streams in ruggedized programmable logic controllers operating at –40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade SRAM with guaranteed 7.5ns access at full temperature range and robust ZZ sleep mode. Use Value: Maintains deterministic timing across thermal extremes; ZZ enables low-power logging during idle periods without data loss. |
Use Scenario: Temporary storage of uncompressed 16-bit grayscale image tiles (512×512) in real-time MRI reconstruction engines. IC Role / Device Role / Timing Role: Wide-bus (36-bit) synchronous SRAM supporting burst writes from ADC interface and burst reads to GPU texture engine. Use Value: 36-bit width reduces memory transaction count by 2× vs. 16-bit parts; flow-through outputs minimize display pipeline latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371BV33-7BBXC | 256K × 36-bit, 7ns access, 133MHz max, 119-ball BGA only - no TQFP option; higher IDD (300mA vs. 285mA) | Requires PCB redesign for BGA footprint; better speed but lacks pin-compatible TQFP migration path | Select when board space is constrained and BGA assembly is available; avoid if legacy TQFP layout must be preserved. |
| AS7C3256B-7TIN | 256K × 36-bit, 7ns access, 133MHz, TQFP-100, but uses different control protocol (no ADSP/ADSC, simplified CE/OE/GW only) | Lacks burst-address advance (ADV) and cache-status inputs - incompatible with cache-coherent or multi-master bus systems | Select for simpler controller designs without burst sequencing or cache coherency requirements; verify ADV/ADSP signal removal. |
Compared with CY7C1371BV33-7BBXC and AS7C3256B-7TIN, the 71V67703S75BQG8 uniquely combines TQFP-100 packaging, ADSP/ADSC cache-interface signaling, and hardware-configurable burst order - making it the only drop-in solution for legacy IDT-based telecom and networking platforms requiring mechanical and functional compatibility.
Availability
71V67703S75BQG8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, industrial PLC data logging, and medical imaging frame buffering requiring stable component supply across extended product lifecycles.
Supply support for 71V67703S75BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V67703S75BQG8 belongs to IDT's 71V67xxx family of flow-through synchronous SRAMs, engineered specifically for low-latency, burst-capable applications in telecom switching, packet processing, and real-time control systems.
FAQ
What is the maximum clock frequency supported by the 71V67703S75BQG8?
The 71V67703S75BQG8 supports up to 117MHz clock frequency, corresponding to its 7.5ns access time rating. This is validated across the commercial temperature range (0°C to +70°C) with VDD and VDDQ at 3.3V ±5%, per datasheet Table 16. Operation above 117MHz is not guaranteed and violates AC timing specifications.
Does the 71V67703S75BQG8 support both linear and interleaved burst modes?
Yes, the 71V67703S75BQG8 supports both burst modes via the LBO (Linear/Interleaved Burst Order) pin. When LBO = LOW, it executes linear burst (00→01→10→11); when LBO = HIGH, it executes interleaved burst (00→01→11→10). The LBO pin is asynchronous and must remain static during active operation, as specified in datasheet Table 14 and Table 15.
How does the flow-through output architecture of the 71V67703S75BQG8 reduce read latency?
The 71V67703S75BQG8 uses a flow-through output path - meaning data propagates directly from the memory array to the I/O pins without passing through an output register. This eliminates one clock-cycle delay, achieving tCD = 7.5ns (clock-to-data) instead of typical registered-SRAM values ≥10ns. This is critical for real-time applications like packet forwarding where every nanosecond of latency matters.
What is the function of the ADSP and ADSC pins on the 71V67703S75BQG8?
ADSP (Address Status from Processor) and ADSC (Address Status from Cache Controller) are synchronous inputs that trigger loading of the internal address register. ADSP is gated by CE and used for processor-initiated accesses; ADSC is independent of CE and used for cache-coherent or DMA-initiated accesses. Both are active-low and sampled on the rising edge of CLK, per datasheet Pin Definitions Table 02.
Can the 71V67703S75BQG8 operate in low-power sleep mode, and how is it controlled?
Yes, the 71V67703S75BQG8 enters full sleep mode when the ZZ pin is driven HIGH asynchronously. In this state, internal clock gating reduces supply current to ≤70mA (industrial grade) while retaining all stored data. Recovery requires ZZ return to LOW followed by tZZR ≥100ns before next valid access, as defined in datasheet Table 16 and Truth Table 13.
71V67703S75BQG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 117 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V67703S75BQG8 FAQ
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All 71V67703S75BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67703S75BQG8 meets industry standards.
7.What is the process for return or replacement of 71V67703S75BQG8?
All 71V67703S75BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67703S75BQG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67703S75BQG8 part is unused and in its original packaging.
Return procedure for 71V67703S75BQG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67703S75BQG8 Tags

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M24C02-WMN6TP
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