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Renesas 71V67703S75BQGI

Part No.:
71V67703S75BQGI
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V67703S75BQGI.pdf
Description:
IC SRAM 9MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,314

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Product details

Overview

71V67703S75BQGI from IDT (now Renesas) is a 256K × 36-bit, 3.3V synchronous SRAM with flow-through outputs, 7.5ns access time, and single-cycle deselect. It supports interleaved/linear burst modes via LBO input, features self-timed write with global/byte write control, and operates across industrial temperature range (–40°C to +85°C). Used in high-speed networking buffers and real-time DSP memory subsystems.

For engineers reviewing the 71V67703S75BQGI datasheet, 71V67703S75BQGI pinout, 71V67703S75BQGI application, or 71V67703S75BQGI equivalent, key selection criteria include burst address sequencing behavior, flow-through vs. pipelined output timing, ZZ-controlled sleep mode current (≤70 mA), and TQFP-100 package compatibility with legacy PCB layouts.

Technical Context

The 71V67703S75BQGI implements a synchronous, clock-driven architecture with registered address, control, and data inputs, but unregistered (flow-through) data outputs - enabling zero-latency read data delivery after tCD = 7.5ns. Its internal burst counter advances on ADV low and selects linear or interleaved sequences based on static LBO pin state.

Write operations are fully synchronous and support four distinct modes: global write (GW), byte write enable (BWE) with BW1–BW4, or combinations thereof. The device uses dual power domains (VDD = 3.3V ±5% core, VDDQ = 3.3V ±5% I/O) and enters ultra-low-power sleep mode when ZZ > VHD, reducing supply current to ≤70 mA.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36-bit (9Mbit); supports 512K × 18-bit via address mapping
Access Time / Max Frequency 7.5ns / 117MHz - defines minimum clock cycle (tCYC ≥ 8.5ns) for full-speed operation
Core & I/O Voltage VDD = 3.3V ±5%, VDDQ = 3.3V ±5% - requires separate low-noise 3.3V supplies with decoupling
Output Architecture Flow-through - eliminates output register delay; data valid at Q within tCD of CLK high
Power-Down Current IZZ ≤ 70mA (industrial temp) - enables low-power idle states without data loss
Burst Mode Control LBO pin selects linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence
Operating Temperature –40°C to +85°C - qualified for industrial-grade embedded systems and telecom infrastructure

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14mm × 20mm body, 0.5mm pitch. Pin 1 marked by corner notch; pin 14 accepts < VIL voltage (not hard-connected to VSS); pin 64 unused (device remains active if floating).

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs Synchronous; latched on rising CLK edge with ADSP/ADSC assertion - 19-bit address space for 256K×36 config
CLK System Clock Input Single-ended CMOS clock; all synchronous timing referenced to rising edge
CE, CS0, CS1 Chip Enable / Selects Three-level decode: CE=LOW, CS0=HIGH, CS1=LOW required for device selection
GW, BWE, BW1–BW4 Write Control Inputs GW overrides BWE/BWx; BWE gates BW1–BW4; each BWx enables one 9-bit byte (I/O0–7+I/OP1, etc.)
ADV Burst Address Advance LOW advances internal burst counter; HIGH suspends burst - enables partial-burst termination
LBO Burst Order Selection Static DC input: LOW = linear sequence (00→01→10→11), HIGH = interleaved (00→01→11→10)
ZZ Sleep Mode Input Asynchronous HIGH disables internal clock and reduces IDD to IZZ ≤ 70mA; retains data
I/O0–I/O31, I/OP1–I/OP4 Data I/O (36-bit bus) Synchronous inputs (registered), flow-through outputs (unregistered); 32 data + 4 parity pins

Key Features

Feature Design Value
Flow-through output architecture Eliminates output register delay - data appears at I/O pins within 7.5ns of CLK high, critical for zero-wait-state interfaces
Self-timed write cycle Internal timing logic resolves write completion without external wait-state generation - simplifies controller design
Single-cycle deselect Device transitions to high-Z output state within one CLK cycle after deselection - prevents bus contention in multi-SRAM systems
Configurable burst order (LBO) Hardware-selectable linear or interleaved 4-word burst sequences - matches cache line ordering requirements of specific processors
Dual-supply I/O interface (VDDQ) Isolates I/O switching noise from core logic - improves signal integrity in mixed-signal SoC backplanes

Applications

Network Packet Buffering DSP Real-Time Data Cache

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer memory interfaced directly to MAC controller with burst reads/writes.

Use Value: 7.5ns tCD and flow-through outputs enable deterministic frame latency; 117MHz clock supports ≥400MB/s sustained throughput.

Use Scenario: Holding coefficient tables and intermediate results in fixed-point audio DSP pipelines.

IC Role / Device Role / Timing Role: On-chip scratchpad replacement with synchronous burst access aligned to DSP instruction cycles.

Use Value: Linear burst mode (LBO=LOW) matches sequential coefficient fetch patterns; single-cycle deselect avoids pipeline stalls during context switches.

Industrial PLC I/O Module Memory Radar Signal Processing FIFO

Use Scenario: Buffering sensor acquisition data and actuator command queues in deterministic real-time control loops.

IC Role / Device Role / Timing Role: Deterministic-access memory mapped to microcontroller's external bus with guaranteed 7.5ns read response.

Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliability in harsh environments; ZZ sleep mode reduces power between scan cycles.

Use Scenario: Capturing high-rate ADC samples from phased-array radar front-ends before FFT processing.

IC Role / Device Role / Timing Role: High-speed circular buffer supporting continuous 100+ MHz write streams and burst-aligned FFT reads.

Use Value: Self-timed writes absorb variable ADC sample jitter; 36-bit width accommodates 32-bit I/Q + 4-bit metadata per sample.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371DV33-7BBXC 256K × 36, 7ns access, 100-pin TQFP, but uses pipelined (not flow-through) outputs - adds 1-cycle output latency Less suitable for zero-wait-state CPU interfaces; better for buffered DMA engines where latency tolerance >1 cycle exists Select only if system controller can absorb extra output register delay; verify tCD + tCLZ meets setup timing.
AS7C331664PFS-75BIN 256K × 36, 75MHz max (13.3ns), 100-pin TQFP, flow-through outputs, but lacks ADV/LBO burst control and ZZ sleep Supports basic burst reads but no suspend/resume; no low-power sleep mode - unsuitable for intermittent operation Use where burst flexibility and power gating are non-critical; confirm 13.3ns tCD satisfies system timing margin.

Compared with CY7C1371DV33-7BBXC and AS7C331664PFS-75BIN, the 71V67703S75BQGI uniquely delivers 7.5ns flow-through access with programmable burst sequencing and hardware sleep control - essential for latency-sensitive, power-aware embedded systems.

Availability

71V67703S75BQGI is available at Aetrix Electronics and suitable for network packet buffering, DSP real-time data caching, industrial PLC I/O modules, and radar signal processing FIFOs requiring stable component supply and long-term industrial-grade availability.

Supply support for 71V67703S75BQGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, designs high-performance memory and timing solutions for communications, computing, and industrial markets.

The 71V67703S75BQGI belongs to IDT's 71V67xxx family of synchronous SRAMs engineered for ultra-low-latency, burst-capable memory subsystems in bandwidth-constrained real-time systems.

FAQ

What is the maximum operating frequency of the 71V67703S75BQGI?

The 71V67703S75BQGI supports up to 117MHz operation, corresponding to its 7.5ns access time and minimum clock cycle time (tCYC) of 8.5ns. This frequency assumes proper signal integrity, VDD/VDDQ within 3.3V ±5%, and ambient temperature within –40°C to +85°C. At 117MHz, the device delivers sustained burst read/write throughput exceeding 420MB/s on its 36-bit bus.

Does the 71V67703S75BQGI support both linear and interleaved burst modes?

Yes, the 71V67703S75BQGI supports both burst modes via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, the internal burst counter follows linear sequence (00→01→10→11); when LBO is HIGH, it follows interleaved sequence (00→01→11→10). LBO is a static input and must remain stable during active operation - changing it mid-burst may cause undefined address sequencing.

How does the flow-through output architecture of the 71V67703S75BQGI affect system timing?

The flow-through output architecture of the 71V67703S75BQGI eliminates output register delay, making data valid at the I/O pins within tCD = 7.5ns after the rising edge of CLK. This enables true zero-wait-state read cycles when interfaced with controllers that sample data on the same clock edge - unlike pipelined SRAMs which add one clock cycle of latency. System timing budgets must account for tCLZ (0ns) and tCHZ (≤3.5ns) for output enable transitions.

What is the function of the ZZ pin on the 71V67703S75BQGI?

The ZZ pin on the 71V67703S75BQGI is an asynchronous sleep mode input. When driven HIGH (VIH), it gates the internal clock and reduces supply current to IZZ ≤ 70mA while retaining memory contents. Recovery requires tZZR ≥ 100ns after ZZ returns LOW before valid accesses resume. ZZ must be stable before power-up from sleep; the device must be deselected during wake-up initialization.

Can the 71V67703S75BQGI perform byte-level writes, and how are they controlled?

Yes, the 71V67703S75BQGI supports byte-level writes using BW1–BW4 (each controlling a 9-bit byte: BW1→I/O0–7+I/OP1, BW2→I/O8–15+I/OP2, etc.) gated by BWE. When BWE is LOW at the rising CLK edge, active BWx signals enable corresponding bytes; when BWE is HIGH, only GW can initiate a write. All outputs are disabled during any byte write - ensuring clean bus transitions without read-modify-write overhead.

71V67703S75BQGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
117 MHz
Write Cycle Time - Word, Page:
-
Access Time:
7.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V67703S75BQGI FAQ

1.How can I place an order for 71V67703S75BQGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V67703S75BQGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V67703S75BQGI reliable?

The price and inventory of 71V67703S75BQGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67703S75BQGI is usually 5 days.

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Once your 71V67703S75BQGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V67703S75BQGI?

For technical support, including 71V67703S75BQGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67703S75BQGI requirements.

6.How does Aetrix verify that 71V67703S75BQGI is sourced from the original manufacturer or authorized distributors?

All 71V67703S75BQGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67703S75BQGI meets industry standards.

7.What is the process for return or replacement of 71V67703S75BQGI?

All 71V67703S75BQGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V67703S75BQGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V67703S75BQGI part is unused and in its original packaging.

Return procedure for 71V67703S75BQGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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