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Renesas 71V67703S80BG8

Part No.:
71V67703S80BG8
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V67703S80BG8.pdf
Description:
IC SRAM 9MBIT PAR 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,862

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Product details

Overview

71V67703S80BG8 from IDT (now Renesas) is a 256K × 36-bit, 3.3V synchronous SRAM with flow-through outputs, single-cycle deselect, and burst-mode capability. It supports 8.0 ns access time at up to 100 MHz clock frequency, operates across industrial temperature range (–40°C to +85°C), and uses JEDEC-standard 119-ball BGA (BG119) package. It is used in high-speed networking buffers and real-time packet processing systems requiring deterministic latency.

For engineers reviewing the 71V67703S80BG8 datasheet, 71V67703S80BG8 pinout, 71V67703S80BG8 application, or 71V67703S80BG8 equivalent, key selection criteria include burst order control via LBO, self-timed write with GW/BWE/BWx granularity, flow-through output timing, ZZ-controlled sleep mode, and compatibility with 3.3V I/O interfaces in telecom and embedded control subsystems.

Technical Context

The 71V67703S80BG8 implements a synchronous, clock-driven architecture with registered address, control, and data inputs, but unregistered (flow-through) data outputs-enabling predictable tCD = 8.0 ns clock-to-data delay. Its internal burst counter advances on ADV assertion and selects linear or interleaved sequences based on LBO state.

Burst operation initiates on ADSP/ADSC low with CE/CS0/CS1 asserted; subsequent outputs appear on consecutive CLK rising edges without reissuing address. Write cycles support global (GW) or byte-level (BW1–BW4) control, with BWE gating byte enables and OE providing asynchronous output disable.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9Mbit); supports 512K × 18-bit via pin-compatible variant
Access Time / Max Frequency8.0 ns / 100 MHz - guarantees deterministic read latency for real-time buffer applications
Core & I/O Supply3.3 V ±5% (VDD and VDDQ) - requires separate low-noise 3.3V rails for core logic and I/O drivers
Burst Mode ControlLBO input selects linear or interleaved 4-word burst sequence - critical for cache line alignment in processor interfaces
Power-Down CurrentIZZ ≤ 70 mA (industrial) when ZZ = HIGH - reduces standby power in idle network interface modules
Operating Temperature–40°C to +85°C - qualified for industrial-grade base station and industrial automation equipment
Package119-ball BGA (BG119), 12 mm × 12 mm - surface-mount compatible with automated PCB assembly

Pinout & Package

71V67703S80BG8 is packaged in a JEDEC-standard 119-ball grid array (BG119) with 0.8 mm ball pitch, 12 mm × 12 mm body size, and thermal pad exposed on underside. Pin functions are defined per the BG119 top-view layout in IDT document 5309 drw 02d.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit synchronous address bus; A0/A1 determine burst word order per LBO setting
CLKClock InputPrimary timing reference; all synchronous inputs sampled on rising edge
CE, CS0, CS1Chip Enable / SelectsThree-input decode enables device only when CE=LOW, CS0=HIGH, CS1=LOW
GW, BWE, BW1–BW4Write Control InputsGlobal write (GW) overrides byte writes; BWE gates BWx; each BWx enables one 9-bit data byte
OEOutput EnableAsynchronous; drives I/O pins to high-Z when HIGH, regardless of clock state
ZZSleep Mode InputAsynchronous HIGH disables internal clock and reduces current to IZZ ≤ 70 mA
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional bus; flow-through outputs eliminate output register delay
VDD, VDDQ, VSSPower/GroundVDD = 3.3V core; VDDQ = 3.3V I/O; multiple VSS balls ensure low-impedance return paths

Key Features

FeatureDesign Value
Flow-through output architectureEliminates output register delay, enabling tCD = 8.0 ns with no additional clock-to-data skew
Single-cycle deselectDevice enters high-Z output state within one CLK cycle after chip select deassertion - prevents bus contention
Self-timed write cycleInternal timing logic completes write without external wait-state generation - simplifies controller design
Linear/interleaved burst selectionLBO pin statically configures burst address sequence to match processor cache line ordering requirements
Asynchronous ZZ sleep modeReduces power to <70 mA without clock gating or software sequencing - ideal for intermittent traffic scenarios

Applications

High-Speed Network BufferReal-Time Packet Processing

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2 switches before forwarding decision.

IC Role / Device Role / Timing Role: Synchronous SRAM buffer with deterministic 8.0 ns read access and burst capability for full-line-rate frame buffering.

Use Value: Enables zero-latency frame queuing under 10 Gbps line rates using 100 MHz system clock and flow-through output timing.

Use Scenario: Temporary storage of packet headers during deep packet inspection in firewall ASICs.

IC Role / Device Role / Timing Role: Low-latency, burst-access memory for header caching between parser and classifier stages.

Use Value: Linear burst mode (LBO=LOW) delivers four 36-bit words per address, matching 128-bit wide internal bus widths.

Industrial PLC Data ExchangeBaseband Signal Processing

Use Scenario: Shared memory between dual-core ARM processors in modular programmable logic controllers.

IC Role / Device Role / Timing Role: Dual-ported SRAM interface supporting concurrent read/write via CE/CS partitioning and byte-write granularity.

Use Value: Byte write enables (BW1–BW4) allow independent updates to 9-bit status registers without disturbing adjacent control fields.

Use Scenario: Intermediate storage of FFT coefficients in wireless baseband transceivers.

IC Role / Device Role / Timing Role: High-bandwidth, low-jitter memory for coefficient buffering between DSP engine and ADC/DAC interfaces.

Use Value: Industrial temperature rating (–40°C to +85°C) and 3.3V I/O compatibility ensure stable operation in outdoor radio units.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1373KV18512K × 18 organization; 165-fBGA package; 7.5 ns access at 117 MHzHigher density but narrower data bus; requires PCB redesign for 18-bit vs. 36-bit interfaceSelect when system bandwidth demand exceeds 9Mbit capacity and 18-bit bus width is acceptable
AS7C3256A32K × 8 organization; 32-pin SOJ; async interface; no burst or flow-through modeLower density, asynchronous operation, no clock domain control - unsuitable for high-speed burst systemsConsider only for legacy cost-sensitive designs where timing determinism and burst access are not required

Compared with CY7C1373KV18 and AS7C3256A, the 71V67703S80BG8 uniquely balances 256K × 36-bit density, 8.0 ns flow-through latency, and industrial-temperature BGA packaging - making it optimal for new designs requiring deterministic burst buffering in space-constrained telecom modules.

Availability

71V67703S80BG8 is available at Aetrix Electronics and suitable for high-speed network buffers, real-time packet processing, and industrial PLC data exchange requiring stable component supply and long-term lifecycle assurance.

Supply support for 71V67703S80BG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in microcontrollers, analog, power management, and high-performance memory solutions.

The 71V67703S80BG8 belongs to IDT's high-speed synchronous SRAM product line, designed specifically for deterministic-latency applications in networking, telecommunications, and industrial control where burst-mode throughput and flow-through timing are critical.

FAQ

What is the maximum clock frequency supported by the 71V67703S80BG8?

The 71V67703S80BG8 supports up to 100 MHz clock frequency with guaranteed 8.0 ns access time. This is validated across the industrial temperature range (–40°C to +85°C) and 3.3V ±5% supply conditions. The device achieves this performance using a flow-through output architecture that eliminates output register delay, ensuring tCD remains fixed at 8.0 ns regardless of clock duty cycle or load.

Does the 71V67703S80BG8 support both linear and interleaved burst modes?

Yes, the 71V67703S80BG8 supports both linear and interleaved burst modes via the LBO (Linear Burst Order) input. When LBO = LOW, the device executes linear burst addressing (00→01→10→11). When LBO = HIGH, it executes interleaved burst (00→01→11→10). This static configuration must be set prior to operation and held stable during burst sequences to prevent address counter corruption.

How does the 71V67703S80BG8 handle power-down and sleep mode?

The 71V67703S80BG8 enters low-power sleep mode when ZZ is driven HIGH asynchronously. In this state, internal clock gating reduces supply current to ≤70 mA (industrial grade) while retaining data. Recovery requires tZZR ≥ 100 ns after ZZ returns LOW and the device must be deselected during wake-up. No external reset or initialization sequence is needed post-sleep.

What is the function of the ADV pin on the 71V67703S80BG8?

The ADV (Burst Address Advance) pin controls burst progression on the 71V67703S80BG8. When ADV = LOW on the rising edge of CLK, the internal burst counter increments and delivers the next sequential word. When ADV = HIGH, burst advancement halts - suspending the sequence and holding the current address. This allows precise control over burst length and enables partial-burst reads/writes.

Can the 71V67703S80BG8 be used in systems requiring byte-level write granularity?

Yes, the 71V67703S80BG8 supports true byte-level write control via four independent byte write enables (BW1–BW4), each controlling a 9-bit segment of the 36-bit data bus. When BWE = LOW, active BWx signals gate corresponding byte writes; inactive bytes retain their prior values. This enables atomic updates to status registers or protocol fields without read-modify-write cycles.

71V67703S80BG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V67703S80BG8 FAQ

1.How can I place an order for 71V67703S80BG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V67703S80BG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V67703S80BG8 reliable?

The price and inventory of 71V67703S80BG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67703S80BG8 is usually 5 days.

3.What payment methods are accepted for 71V67703S80BG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V67703S80BG8 transactions.

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71V67703S80BG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V67703S80BG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V67703S80BG8?

For technical support, including 71V67703S80BG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67703S80BG8 requirements.

6.How does Aetrix verify that 71V67703S80BG8 is sourced from the original manufacturer or authorized distributors?

All 71V67703S80BG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67703S80BG8 meets industry standards.

7.What is the process for return or replacement of 71V67703S80BG8?

All 71V67703S80BG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67703S80BG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V67703S80BG8 part is unused and in its original packaging.

Return procedure for 71V67703S80BG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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