Renesas 71V67703S80BQGI
- Part No.:
- 71V67703S80BQGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V67703S80BQGI.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V67703S80BQGI from IDT (now Renesas) is a 256K × 36-bit or 512K × 18-bit 3.3V synchronous SRAM with flow-through outputs, single-cycle deselect, and burst-mode operation. It supports 8.0 ns access time at up to 100 MHz clock frequency, features LBO-controlled linear/interleaved burst sequencing, self-timed write with global and byte-level write enables, and operates across industrial temperature range (–40°C to +85°C). It is used in high-speed networking packet buffers and cache-coherent memory subsystems.
For engineers reviewing the 71V67703S80BQGI datasheet, 71V67703S80BQGI pinout, 71V67703S80BQGI application, or 71V67703S80BQGI equivalent, key selection criteria include burst mode timing compliance, ZZ-controlled sleep current (≤70 mA), flow-through output latency, 100-pin TQFP mechanical compatibility, and support for synchronous CE/CS0/CS1 chip select arbitration in multi-SRAM systems.
Technical Context
The 71V67703S80BQGI implements a synchronous, clock-driven architecture with registered address, control, and data inputs, and a flow-through (unregistered) output path-enabling zero-cycle output delay after clock edge. Its internal burst counter advances on ADV assertion and selects sequence order via LBO pin state (linear vs. interleaved).
Write operations are fully synchronous and support four modes: global write (GW), byte write enable (BWE) with BW1–BW4, and combinations thereof. Power management includes asynchronous ZZ input that gates internal clock and reduces supply current to ≤70 mA in full sleep mode while retaining data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (or 512K × 18-bit); dual-configuration supports flexible bus-width matching in 32-bit or 64-bit systems. |
| Access Time | 8.0 ns maximum at 100 MHz clock; guarantees deterministic read latency for real-time packet processing pipelines. |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate supplies allow I/O voltage domain isolation in mixed-voltage designs. |
| Burst Mode | Four-word burst per address; LBO pin selects linear or interleaved sequence-critical for cache line fill efficiency in CPU coherency protocols. |
| Power-Down Current | IZZ ≤ 70 mA (industrial temp); enables low-power standby in network line cards during traffic lulls without data loss. |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade embedded systems including telecom infrastructure and industrial controllers. |
| Package | JEDEC-standard 100-pin thin quad flatpack (TQFP, 14 mm × 20 mm); compatible with standard SMT reflow and automated optical inspection. |
Pinout & Package
71V67703S80BQGI is packaged in a JEDEC-standard 100-pin thin plastic quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch and exposed thermal pad (not electrically connected). Pin 1 is located at top-left corner when notch is oriented upward.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous address latch triggered by CLK rising edge plus ADSP/ADSC assertion; A0–A17 used for 256K×36, A0–A18 for 512K×18. |
| CE, CS0, CS1 | Chip Enable / Selects | Three-level synchronous chip select hierarchy: CE active-low gated by CS0 (active-high) and CS1 (active-low) for multi-device decoding. |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE enables byte-write mode; BW1–BW4 select 9-bit bytes (I/O0–7+I/OP1, etc.)-supports partial writes without bus contention. |
| ADV, LBO, ZZ | Burst & Power Control | ADV advances burst counter; LBO selects linear/interleaved sequence (static, must not toggle during operation); ZZ asynchronously enters low-power sleep mode. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous data bus; flow-through output path eliminates output register delay-critical for tight timing budgets. |
| CLK, OE, ADSP, ADSC | Timing & Interface Control | CLK drives all synchronous registers; OE is asynchronous output enable; ADSP/ADSC indicate processor/cache address status-enables cache coherency handshake. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Zero-cycle output latency: data appears on I/O pins within tCD (≤8.0 ns) after CLK rising edge-eliminates pipeline stalls in high-frequency read paths. |
| Single-cycle deselect | Device transitions to high-Z output state within one clock cycle upon deassertion of CE/CS0/CS1-prevents bus contention during rapid address switching. |
| Self-timed write cycle | Internal timing logic completes write without external wait-state generation; supports GW-only, BWE+BWx, or mixed write granularity without external control logic. |
| Asynchronous ZZ sleep mode | Reduces IDD to ≤70 mA while preserving data; no clock gating or configuration reset required-ideal for bursty traffic applications with idle periods. |
| Linear/interleaved burst ordering | LBO pin statically configures burst address sequence to match CPU cache line layout (e.g., Intel Pentium vs. PowerPC)-avoids software remapping overhead. |
Applications
| Networking Packet Buffer | CPU Cache Coherency Module |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before classification and forwarding. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer supporting 10 Gbps line-rate packet buffering with burst reads aligned to 64-byte cache lines. Use Value: 8.0 ns access time and flow-through outputs enable sustained 100 MHz read throughput; single-cycle deselect prevents inter-packet bus contention. | Use Scenario: Acting as shared tag/data RAM in multi-core cache coherency snoop filters or directory-based coherence protocols. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic access to cache line metadata and directory entries under strict timing constraints. Use Value: LBO-configurable burst order matches CPU-specific cache line addressing; 3.3V I/O interface ensures compatibility with modern ASIC I/O standards. |
| Industrial PLC Memory Expansion | Radar Signal Processing FIFO |
Use Scenario: Extending program/data memory in programmable logic controllers requiring deterministic execution under industrial temperature extremes. IC Role / Device Role / Timing Role: Non-volatile-retentive fast memory supplementing microcontroller internal RAM for ladder logic execution and I/O mapping tables. Use Value: –40°C to +85°C qualification ensures reliability in uncontrolled cabinet environments; ZZ sleep mode reduces power during scan-idle cycles. | Use Scenario: Implementing high-speed first-in-first-out buffers for digitized RF samples in phased-array radar front-ends. IC Role / Device Role / Timing Role: Burst-capable SRAM absorbing ADC sample bursts at >100 MSPS and feeding DSP cores with aligned 36-bit words. Use Value: 256K × 36 organization provides 1.152 Mbit depth; synchronous write with BWE/BWx enables partial updates without full-line overwrite latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371BV33-100AXC | 128K × 32 organization; 100 MHz, 3.3V; no LBO or ADV; uses BYTE# instead of BWx pins. | Lacks burst sequencing control; limited to fixed 32-bit width; no linear/interleaved mode-requires software address translation for cache line alignment. | Select when burst control is unnecessary and 32-bit bus width suffices; verify timing margins for flow-through output use case. |
| AS7C33128PFSIG | 256K × 32 organization; 10 ns access at 100 MHz; 3.3V; no ZZ sleep; only CE-based deselect. | No asynchronous sleep mode; higher standby current (ISB1 = 100 mA); lacks ADV/LBO-no hardware burst advance or order selection. | Choose where power budget allows higher ISB1 and burst control is managed externally; confirm single-cycle deselect meets system timing. |
Compared with CY7C1371BV33-100AXC and AS7C33128PFSIG, the 71V67703S80BQGI uniquely delivers hardware-configurable burst sequencing, asynchronous sleep entry, and true single-cycle deselect-making it optimal for cache-coherent and power-constrained real-time systems where deterministic latency and low quiescent power are mandatory.
Availability
71V67703S80BQGI is available at Aetrix Electronics and suitable for networking packet buffers, CPU cache coherency modules, industrial PLC memory expansion, and radar signal processing FIFOs requiring stable component supply, long-term lifecycle assurance, and industrial-temperature operation.
Supply support for 71V67703S80BQGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology, IDT) is a global semiconductor leader specializing in high-performance memory, timing, and connectivity solutions for communications, computing, and industrial markets.
The 71V67703S80BQGI belongs to IDT's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-capable memory subsystems in networking infrastructure, real-time control, and embedded signal processing applications.
FAQ
What memory configurations does the 71V67703S80BQGI support?
The 71V67703S80BQGI supports two configurable organizations: 256K × 36 bits (address range A0–A17) or 512K × 18 bits (A0–A18), selected via external address decoding and pin strapping. This dual-mode flexibility allows system designers to optimize bus width and density without changing the physical device, making the 71V67703S80BQGI adaptable to both 32-bit and 64-bit data paths in networking and embedded applications.
How does the LBO pin affect burst behavior in the 71V67703S80BQGI?
The LBO (Linear Burst Order) pin on the 71V67703S80BQGI statically selects between linear (LBO = LOW) and interleaved (LBO = HIGH) burst address sequences for the four-word burst. This setting must remain stable during operation and directly maps to CPU cache line layouts-e.g., linear mode suits PowerPC-style addressing, while interleaved aligns with Intel Pentium. The 71V67703S80BQGI does not support dynamic LBO switching mid-burst.
What is the role of the ZZ pin in the 71V67703S80BQGI, and how does it impact power consumption?
The ZZ pin on the 71V67703S80BQGI provides asynchronous entry into full sleep mode: when driven HIGH, it internally gates the CLK signal and reduces supply current to ≤70 mA (industrial grade) while retaining memory contents. No clock-stopping sequence or register programming is required-making the 71V67703S80BQGI ideal for intermittent-traffic applications like packet buffering where power savings during idle periods are critical.
Does the 71V67703S80BQGI support byte-level writes, and how are they implemented?
Yes, the 71V67703S80BQGI supports granular byte-level writes via synchronous BWE (Byte Write Enable) and four BWx inputs (BW1–BW4), each controlling a 9-bit byte (e.g., BW1 → I/O0–I/O7 + I/OP1). When BWE is LOW at the CLK rising edge, active BWx signals gate corresponding write drivers; inactive bytes retain prior data. This eliminates need for external byte-mask logic and enables efficient partial-line updates in cache or buffer applications using the 71V67703S80BQGI.
What package type and pin count does the 71V67703S80BQGI use, and is it RoHS-compliant?
The 71V67703S80BQGI uses a JEDEC-standard 100-pin thin quad flatpack (TQFP) with 0.5 mm pitch and 14 mm × 20 mm body size. It is RoHS-compliant and qualifies as a "green part" per IDT's ordering information-containing no lead, mercury, cadmium, hexavalent chromium, PBB, or PBDE. The "BQGI" suffix explicitly denotes this industrial-grade, lead-free TQFP variant of the 71V67703S80BQGI.
71V67703S80BQGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V67703S80BQGI FAQ
1.How can I place an order for 71V67703S80BQGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67703S80BQGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V67703S80BQGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67703S80BQGI is usually 5 days.
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6.How does Aetrix verify that 71V67703S80BQGI is sourced from the original manufacturer or authorized distributors?
All 71V67703S80BQGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67703S80BQGI meets industry standards.
7.What is the process for return or replacement of 71V67703S80BQGI?
All 71V67703S80BQGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V67703S80BQGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67703S80BQGI part is unused and in its original packaging.
Return procedure for 71V67703S80BQGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67703S80BQGI Tags

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M24C02-WMN6TP
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AT21CS01-STUM10-T
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