Renesas 71V67703S85BG
- Part No.:
- 71V67703S85BG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V67703S85BG.pdf
- Description:
- IC SRAM 9MBIT PAR 87MHZ 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V67703S85BG from IDT (now Renesas) is a 256K × 36-bit or 512K × 18-bit 3.3V synchronous SRAM with flow-through outputs, single-cycle deselect, and burst-mode operation. It supports 8.5ns access time at up to 87MHz clock frequency, features LBO-controlled linear/interleaved burst sequencing, self-timed write with global and byte-level write enables, and industrial temperature range (–40°C to +85°C). It is used in high-bandwidth networking and telecom data buffering where deterministic latency and burst throughput are critical.
For engineers reviewing the 71V67703S85BG datasheet, 71V67703S85BG pinout, 71V67703S85BG application, or 71V67703S85BG equivalent, key selection criteria include its JEDEC-standard 100-pin TQFP package, 3.3V core/I/O supply compatibility, flow-through output architecture eliminating output register delay, ZZ-controlled sleep mode for low-power standby, and support for both interleaved and linear burst addressing via the LBO pin.
Technical Context
The 71V67703S85BG implements a synchronous, clock-driven interface with all control inputs (CE, CS0, CS1, ADSP, ADSC, ADV, GW, BWE, BW1–BW4, OE, LBO, ZZ) sampled on the rising edge of CLK except OE and ZZ, which are asynchronous. Its internal burst address counter advances on ADV=LOW and wraps after four cycles, with sequence order determined by LBO state (LOW = linear, HIGH = interleaved).
It uses a flow-through output architecture-no output register-so valid data appears at I/O pins within tCD (≤8.5ns) after the rising clock edge, enabling zero-cycle output latency. Write operations are self-timed: the internal logic completes the write cycle without external timing control, using either global write (GW) or byte-write (BWE + BWx) activation synchronized to CLK.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit or 512K × 18-bit - dual-configurable density supporting either wide-data or deep-address system architectures |
| Access Time / Max Clock | 8.5ns / 87MHz - guarantees deterministic read latency aligned to clock edge for real-time buffer applications |
| Core & I/O Voltage | 3.3V ±5% (VDD and VDDQ) - compatible with standard 3.3V logic families and eliminates level-shifting requirements |
| Burst Mode | 4-word burst with LBO-selectable linear or interleaved sequence - reduces address bus traffic and improves sustained bandwidth |
| Output Architecture | Flow-through - no output register; data appears on I/O pins within tCD, enabling immediate consumption by downstream logic |
| Power-Down Control | Asynchronous ZZ input - places device in full sleep mode with ≤70mA ISB2 and ≤70mA IZZ current, preserving data retention |
| Temperature Range | –40°C to +85°C - qualified for industrial-grade operation in base stations, routers, and embedded control systems |
Pinout & Package
Packaged in a JEDEC-standard 100-pin thin plastic quad flatpack (TQFP), 14mm × 20mm body, lead pitch 0.5mm. Pin 1 marked by dot; top-side view shown in datasheet drawing 5309 drw 02a.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous address latching triggered by CLK + ADSP/ADSC; A0–A17 used for 256K×36, A0–A18 for 512K×18 configuration |
| CLK | Clock Input | Primary timing reference; all synchronous inputs sampled on rising edge; defines tCYC (min 11.5ns) |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE gates byte writes; BW1–BW4 select 9-bit bytes (I/O0–7+I/OP1, etc.) |
| ADSP / ADSC | Address Status Inputs | ADSP (processor) and ADSC (cache controller) load address register; both active LOW, gated by CE |
| ADV | Burst Address Advance | Active LOW signal that increments internal burst counter; HOLD = HIGH suspends burst sequence |
| LBO | Burst Order Select | Asynchronous static input: LOW = linear burst (00→01→10→11), HIGH = interleaved burst (00→01→11→10) |
| ZZ | Sleep Mode Enable | Asynchronous HIGH input disabling internal clock and reducing supply current to ≤70mA while retaining memory contents |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous data bus; input path registered, output path flow-through (no register) |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Eliminates output register delay: data valid at I/O pins within tCD ≤8.5ns after CLK rise, enabling zero-latency read handoff |
| Single-cycle deselect | Device transitions to high-Z output state within one clock cycle upon deassertion of chip selects, simplifying bus arbitration |
| Self-timed write cycle | Internal timing logic completes write without external strobes-reduces system timing constraints and PCB routing complexity |
| Configurable burst addressing | LBO pin selects linear or interleaved 4-word burst order, matching processor cache line layouts or DMA engine expectations |
| Low-power sleep mode | ZZ HIGH reduces IDD to ≤70mA while maintaining full data retention-critical for power-constrained telecom line cards |
Applications
| Telecom Line Card Buffering | Network Packet Switching |
|---|---|
Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in carrier-grade aggregation switches before classification and forwarding. IC Role / Device Role / Timing Role: High-speed, low-latency data buffer interfacing directly with SerDes PHYs and packet processors via synchronous burst reads/writes. Use Value: 8.5ns tCD and flow-through outputs ensure frame payload data is available to the switch fabric within one clock cycle, minimizing queuing jitter. |
Use Scenario: Acting as a shared buffer between ingress and egress ports in multi-gigabit Layer 2/L3 switches handling cut-through or store-and-forward forwarding. IC Role / Device Role / Timing Role: Dual-port-capable synchronous SRAM providing concurrent read/write access to multiple traffic engines via burst-aligned addressing. Use Value: 4-word burst mode reduces address bus cycles by 75% per transaction, increasing effective bandwidth to >300 MB/s at 87MHz. |
| Industrial PLC Data Logging | Radar Signal Processing Buffer |
Use Scenario: Capturing sensor telemetry and control command histories in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Deterministic-access memory storing timestamped I/O snapshots with guaranteed worst-case 8.5ns read latency under industrial temperature stress. Use Value: –40°C to +85°C qualification and ZZ sleep mode enable reliable long-term logging even during brownout or thermal cycling events. |
Use Scenario: Temporarily storing digitized RF samples from ADCs prior to FFT computation in phased-array radar front-ends. IC Role / Device Role / Timing Role: Low-jitter, flow-through SRAM feeding pipeline stages of FPGA-based DSP blocks requiring precise sample alignment. Use Value: Absence of output register eliminates clock-to-data skew, ensuring phase coherence across 36-bit sample words critical for beamforming accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1373KV18 | 512K × 18-bit, 3.3V, 7.5ns access, 165-ball fBGA only - no TQFP option; no LBO pin; fixed linear burst | Requires PCB redesign due to different package and pinout; lacks configurable burst order | Select when maximum speed (117MHz) and fBGA integration are prioritized over pin compatibility and burst flexibility |
| AS7C33128PFSIG | 256K × 36-bit, 3.3V, 10ns access, 100-pin TQFP - slower (100MHz max), no burst mode, no ZZ sleep, no flow-through output | Higher read latency (10ns vs 8.5ns); no burst capability limits throughput; no low-power sleep mode | Select only for cost-sensitive, non-burst, non-low-power applications where 1.5ns latency penalty is acceptable |
Compared with CY7C1373KV18 and AS7C33128PFSIG, the 71V67703S85BG uniquely delivers 8.5ns flow-through latency in a drop-in 100-pin TQFP with configurable burst order and hardware sleep control-making it optimal for latency-critical, power-aware, and layout-constrained industrial and telecom designs.
Availability
71V67703S85BG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, and radar signal processing applications requiring stable component supply, long-lifecycle support, and industrial-temperature qualification.
Supply support for 71V67703S85BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V67703S85BG belongs to IDT's high-speed synchronous SRAM product line, designed specifically for applications demanding deterministic latency, burst throughput, and industrial reliability in networking and real-time embedded systems.
FAQ
What memory organization does the 71V67703S85BG support?
The 71V67703S85BG supports two configurations: 256K × 36-bit (address range A0–A17) or 512K × 18-bit (A0–A18), selected by address decoding and pin strapping. Both configurations share identical timing, packaging, and control logic, allowing flexible system-level memory mapping without changing the 71V67703S85BG footprint or firmware interface.
How does the LBO pin affect burst behavior in the 71V67703S85BG?
In the 71V67703S85BG, the LBO pin statically configures burst order: when pulled LOW, it enables linear burst (00→01→10→11); when pulled HIGH, it enables interleaved burst (00→01→11→10). LBO must remain stable during operation-changing it mid-burst causes undefined address sequencing. This matches common processor cache line layouts and enables optimization for specific DMA or prefetch patterns.
What is the role of the ZZ pin in the 71V67703S85BG?
The ZZ pin in the 71V67703S85BG provides asynchronous entry into full sleep mode: asserting ZZ HIGH gates the internal clock and reduces supply current to ≤70mA while guaranteeing data retention across the full industrial temperature range. Unlike standby modes, ZZ sleep requires no clock or control signal sequencing-making it ideal for rapid power gating in burst-idle intervals.
Does the 71V67703S85BG support byte-level writes, and how are they enabled?
Yes, the 71V67703S85BG supports independent 9-bit byte writes via BW1–BW4, each controlling one 9-bit segment of the 36-bit I/O bus (e.g., BW1 → I/O0–7 + I/OP1). Byte writes require BWE=LOW to enable the BWx signals; if BWE=HIGH, only GW-controlled full-word writes are possible. This enables precise data updates without disturbing adjacent bytes-critical for protocol header manipulation.
What is the significance of "flow-through outputs" in the 71V67703S85BG?
"Flow-through outputs" means the 71V67703S85BG has no output register: data from the memory array appears directly at the I/O pins within tCD ≤8.5ns after the rising CLK edge. This eliminates register-induced skew and jitter, ensures deterministic zero-cycle output latency, and allows downstream logic (e.g., FPGA fabric or ASIC datapaths) to sample data on the same clock edge-essential for timing-critical interfaces like SerDes buffers.
71V67703S85BG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 87 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V67703S85BG FAQ
1.How can I place an order for 71V67703S85BG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67703S85BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V67703S85BG reliable?
The price and inventory of 71V67703S85BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67703S85BG is usually 5 days.
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Once your 71V67703S85BG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V67703S85BG?
For technical support, including 71V67703S85BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67703S85BG requirements.
6.How does Aetrix verify that 71V67703S85BG is sourced from the original manufacturer or authorized distributors?
All 71V67703S85BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67703S85BG meets industry standards.
7.What is the process for return or replacement of 71V67703S85BG?
All 71V67703S85BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V67703S85BG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67703S85BG part is unused and in its original packaging.
Return procedure for 71V67703S85BG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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