Renesas 71V67703S85BGG
- Part No.:
- 71V67703S85BGG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V67703S85BGG.pdf
- Description:
- IC SRAM 9MBIT PAR 87MHZ 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V67703S85BGG from IDT (now Renesas) is a 256K × 36-bit, 3.3V synchronous SRAM with flow-through outputs and single-cycle deselect. It supports 8.5ns access time at up to 87MHz clock frequency, features burst-mode operation with linear/interleaved address sequencing via LBO pin, and uses self-timed write with global (GW) and byte-level (BW1–BW4) write control. It is used in high-bandwidth packet buffering and cache coherency logic in telecom line cards.
For engineers reviewing the 71V67703S85BGG datasheet, 71V67703S85BGG pinout, 71V67703S85BGG application, or 71V67703S85BGG equivalent, key selection criteria include its 100-pin TQFP package, 3.3V core/I/O supply, industrial temperature range (–40°C to +85°C), flow-through output architecture, and support for burst read/write with programmable linear/interleaved ordering.
Technical Context
The 71V67703S85BGG implements a synchronous, clock-driven interface with registered address and control inputs (CE, CS0, CS1, ADSP, ADSC, ADV, GW, BWE, BW1–BW4, OE, LBO, ZZ), all sampled on the rising edge of CLK except asynchronous OE and ZZ. Its internal burst counter generates four sequential addresses per initial address, with order determined by LBO state and synchronized to CLK edges.
It employs a flow-through output path-no output register-enabling tCD = 8.5ns clock-to-data delay. Write cycles are self-timed: data is latched on CLK rise, and internal timing completes the write without external wait-state generation. Power management includes active standby (ISB1 = 50mA), clock-running standby (ISB2 = 135mA), and full sleep mode (IZZ = 50mA) activated by ZZ high.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9Mbit), configured as 36-bit wide data bus for high-throughput buffering |
| Access Time / Max Frequency | 8.5ns access time supports 87MHz system clock - enables one read/write per cycle in burst mode |
| Supply Voltages | 3.3V ±5% core (VDD) and I/O (VDDQ) - compatible with modern 3.3V logic families and eliminates level-shifting |
| Burst Mode | Four-word burst with linear or interleaved address sequence selected by static LBO pin - reduces address bus traffic by 75% |
| Write Control | Global write (GW) + byte write enables (BW1–BW4) + BWE gating - allows precise 9-bit sub-word writes without masking logic |
| Output Architecture | Flow-through (unregistered) outputs - eliminates output register delay, critical for deterministic tCD timing |
| Power-Down Mode | ZZ input asserts full sleep mode (IZZ ≤ 50mA) - gates internal clock and reduces dynamic power during idle periods |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14mm × 20mm body, lead pitch 0.5mm. Pinout validated per IDT document 5309 drw 02a (256K×36 configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous address latch triggered by CLK rise + ADSP/ADSC low - supports 256K depth (A0–A17) with A18 unused |
| CLK | System Clock Input | Rising-edge-triggered timing reference for all synchronous inputs and internal burst counter |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE gates BWx; BW1–BW4 each enable one 9-bit byte - enables flexible sub-word updates |
| ADSP / ADSC | Address Status Inputs | ADSP (processor) and ADSC (cache controller) load address register - supports dual-bus system integration |
| ADV | Burst Address Advance | Active-low signal that increments internal burst counter - HIGH suspends burst, enabling single-word access mid-sequence |
| LBO | Burst Order Select | Asynchronous static input: LOW = linear burst (00→01→10→11), HIGH = interleaved (00→01→11→10) - defines memory access pattern |
| ZZ | Sleep Mode Enable | Asynchronous high-active input that gates CLK internally - enters ultra-low-power retention mode (IZZ ≤ 50mA) |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O (36-bit) | Synchronous input path (registered), flow-through output path - ensures tCD = 8.5ns with no output skew |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Eliminates output register delay, guaranteeing tCD = 8.5ns from CLK rise to valid data - essential for tight timing closure in high-speed interfaces |
| Single-cycle deselect | Chip deactivation completes within one CLK cycle - enables rapid context switching between memory banks without pipeline stalls |
| Self-timed write cycle | Internal timing resolves write completion without external wait signals - simplifies controller design and removes need for write-ready handshake |
| Linear/interleaved burst mode | LBO pin selects burst address sequence to match processor/cache line layout - optimizes spatial locality for burst transfers |
| 3.3V-only operation (VDD/VDDQ) | Eliminates dual-supply complexity and associated noise coupling - simplifies PCB layout and power delivery network design |
| Industrial temperature range | Rated for –40°C to +85°C operation - suitable for uncontrolled environments such as base station cabinets and industrial controllers |
Applications
| Telecom Packet Buffering | Network Processor Cache |
|---|---|
Use Scenario: Storing incoming Ethernet frames in a line card prior to classification and forwarding. IC Role / Device Role / Timing Role: High-speed, low-latency buffer with burst read capability to feed packet inspection engines. Use Value: 8.5ns tCD and flow-through outputs enable deterministic frame latency; 36-bit width matches typical packet header size. |
Use Scenario: Acting as a tag RAM or data RAM in a multi-core network processor's L2 cache subsystem. IC Role / Device Role / Timing Role: Synchronous SRAM providing cache line storage with single-cycle deselect for fast bank switching. Use Value: Burst mode reduces address bus activity by 75%; industrial temp rating ensures reliability in dense compute modules. |
| Baseband Signal Processing | Industrial PLC Data Logging |
Use Scenario: Temporary storage of FFT results or channel estimation vectors in LTE/5G baseband ASICs. IC Role / Device Role / Timing Role: Low-jitter, clock-synchronous memory interfacing directly with DSP cores. Use Value: Self-timed write eliminates external timing constraints; 3.3V I/O compatibility avoids level shifters in mixed-voltage SoC designs. |
Use Scenario: Buffering sensor acquisition data in real-time industrial controllers before SD card write or Ethernet upload. IC Role / Device Role / Timing Role: Reliable, long-life SRAM with sleep mode (ZZ) for power-gated logging intervals. Use Value: ZZ-enabled sleep mode draws ≤50mA, extending battery life in remote deployments; –40°C to +85°C rating ensures field operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371BV33-85BGXI | 256K × 36-bit, 85MHz, 3.3V, 119-ball BGA - lacks ADSC/ADSP dual address status inputs and LBO-configurable burst order | Targeted at simpler burst systems without cache coherency requirements; no support for interleaved burst addressing | Choose when board space permits BGA and dual-bus address loading is unnecessary |
| AS7C3256A-85JCIN | 256K × 36-bit, 85MHz, 3.3V, 100-pin TQFP - asynchronous OE, no burst mode, no flow-through outputs (tAA = 85ns) | Designed for legacy parallel bus systems requiring simple read/write cycles without burst or timing-critical output paths | Choose only for cost-sensitive, non-burst, non-flow-through applications where tCD < 10ns is not required |
Compared with CY7C1371BV33-85BGXI and AS7C3256A-85JCIN, the 71V67703S85BGG uniquely delivers flow-through outputs (tCD = 8.5ns), dual address status inputs (ADSP/ADSC), and configurable linear/interleaved burst - making it optimal for cache-coherent, high-throughput telecom and networking systems requiring deterministic timing and flexible bus arbitration.
Availability
71V67703S85BGG is available at Aetrix Electronics and suitable for telecom infrastructure, network processor subsystems, and industrial control applications requiring stable component supply, long-lifecycle support, and guaranteed industrial temperature performance.
Supply support for 71V67703S85BGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.
The 71V67703S85BGG belongs to IDT's high-speed synchronous SRAM product line, designed specifically for bandwidth-intensive applications in telecom infrastructure, network processors, and real-time embedded systems demanding low-latency, burst-capable memory.
FAQ
What is the maximum operating frequency supported by the 71V67703S85BGG?
The 71V67703S85BGG supports up to 87MHz clock frequency, corresponding to an 8.5ns access time (tCD). This is specified under commercial and industrial temperature ranges with VDD and VDDQ at 3.3V ±5%. The device achieves this performance using a flow-through output architecture and registered synchronous inputs, ensuring reliable timing at full speed without external wait states.
Does the 71V67703S85BGG support both linear and interleaved burst modes?
Yes, the 71V67703S85BGG supports both linear and interleaved burst sequences via the LBO (Linear Burst Order) pin. When LBO is driven LOW, the burst follows linear order (00→01→10→11); when HIGH, it follows interleaved order (00→01→11→10). This selection is static and must remain stable during operation, as confirmed in the Interleaved and Linear Burst Sequence Tables (IDT doc 5309 tbl 14–15).
How does the self-timed write function work in the 71V67703S85BGG?
The 71V67703S85BGG implements a self-timed write cycle: once write inputs (GW/BWE/BWx) and data are sampled on the rising CLK edge, internal logic autonomously completes the write without requiring external timing signals or wait states. This is enabled by on-chip timing control and eliminates the need for write-ready handshaking - simplifying controller design while maintaining deterministic tCYC compliance.
What is the role of the ADSP and ADSC pins on the 71V67703S85BGG?
ADSP (Address Status from Processor) and ADSC (Address Status from Cache Controller) are synchronous, active-low inputs that trigger loading of the internal address register. ADSP is gated by CE and used for CPU-initiated accesses; ADSC operates independently and supports cache coherency protocols. Both allow the 71V67703S85BGG to interface directly with dual-bus architectures common in high-performance networking SoCs.
Is the 71V67703S85BGG available in industrial temperature grade?
Yes, the 71V67703S85BGG is qualified for industrial temperature operation from –40°C to +85°C. This is explicitly stated in the Recommended Operating Conditions table (IDT doc 5309 tbl 04) and confirmed across AC/DC electrical specifications. The part suffix "S85BGG" denotes the 85MHz speed grade in industrial-grade 100-pin TQFP packaging.
71V67703S85BGG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 87 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V67703S85BGG FAQ
1.How can I place an order for 71V67703S85BGG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67703S85BGG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V67703S85BGG reliable?
The price and inventory of 71V67703S85BGG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67703S85BGG is usually 5 days.
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5.How can I obtain technical support or documentation for 71V67703S85BGG?
For technical support, including 71V67703S85BGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67703S85BGG requirements.
6.How does Aetrix verify that 71V67703S85BGG is sourced from the original manufacturer or authorized distributors?
All 71V67703S85BGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67703S85BGG meets industry standards.
7.What is the process for return or replacement of 71V67703S85BGG?
All 71V67703S85BGG units undergo pre-shipment inspection (PSI). If there is an issue with 71V67703S85BGG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67703S85BGG part is unused and in its original packaging.
Return procedure for 71V67703S85BGG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67703S85BGG Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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