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Renesas 71V67703S85BQ

Part No.:
71V67703S85BQ
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V67703S85BQ.pdf
Description:
IC SRAM 9MBIT PAR 87MHZ 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,695

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Product details

Overview

71V67703S85BQ from IDT (now Renesas) is a 256K × 36-bit, 3.3V synchronous SRAM with flow-through outputs, 8.5ns access time at 87MHz clock frequency, single-cycle deselect, and burst-mode operation enabled by ADV/LBO control logic. It serves as high-bandwidth data buffer in network packet processors and telecom line cards requiring deterministic latency and burst-aligned memory access.

For engineers reviewing the 71V67703S85BQ datasheet, 71V67703S85BQ pinout, 71V67703S85BQ application, or 71V67703S85BQ equivalent, key selection criteria include its 100-pin TQFP package, 3.3V core/I/O supply compatibility, linear/interleaved burst ordering via LBO, self-timed write with byte-level granularity (BW1–BW4), and industrial-grade temperature support up to +85°C.

Technical Context

The 71V67703S85BQ implements a synchronous, clock-driven architecture with registered address/data inputs and flow-through (unregistered) outputs - eliminating output register delay for minimal read-to-data timing. Its internal burst counter advances on ADV=LOW transitions, generating four consecutive addresses per initial access using either linear (LBO=LOW) or interleaved (LBO=HIGH) sequences.

Write operations are controlled synchronously via GW (global), BWE (byte enable gate), and BW1–BW4 (individual 9-bit byte selects), enabling precise 8-bit or 36-bit granularity writes without bus contention. Power management includes asynchronous ZZ input for full-sleep mode (IZZ ≤ 70mA) and CMOS standby (ISB1 ≤ 70mA) when deselected.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9Mbit); supports 512K × 18-bit via pin-compatible variant
Access Time / Max Clock8.5ns access time; operates up to 87MHz clock frequency with guaranteed timing margins
Supply VoltagesVDD = 3.3V ±5% (core); VDDQ = 3.3V ±5% (I/O); separate supplies enable noise isolation
Burst ModeFour-word burst initiated by ADV=LOW; LBO selects linear or interleaved address sequence
Write ControlSelf-timed write with global (GW), byte-write-enable (BWE), and four independent byte-write (BW1–BW4) inputs
Output ArchitectureFlow-through outputs - no output register - enables immediate data availability after tCD (8.5ns)
Temperature RangeIndustrial grade: –40°C to +85°C; validated across full range for telecom and industrial applications

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14mm × 20mm body, lead-free and RoHS-compliant. Pinout optimized for signal integrity with distributed VDD/VSS/VDDQ and dedicated ground planes.

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Address InputsSynchronous address latching on rising CLK edge gated by ADSP/ADSC; A0–A17 used for 256K×36 mode
CLKSystem Clock InputPrimary timing reference; all synchronous inputs referenced to rising edge; no internal clock division
ADVBurst Address AdvanceActive-LOW signal that increments internal burst counter; HIGH suspends burst sequence
LBOLinear/Interleaved Burst OrderDC-level static control: LOW = linear burst (00→01→10→11); HIGH = interleaved (00→01→11→10)
BW1–BW4Byte Write EnablesEach controls one 9-bit byte (BW1: I/O0–7 + I/OP1); active-LOW enables write to corresponding byte lane
ZZSleep Mode InputAsynchronous HIGH activates full-sleep mode; reduces ICC to ≤70mA while retaining data
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional interface; flow-through outputs eliminate output register delay

Key Features

FeatureDesign Value
Flow-through output architectureEliminates output register delay - tCD = 8.5ns is pure array + path delay, critical for real-time packet buffering
Single-cycle deselectDevice enters high-Z state within one clock cycle of CE/CS deassertion - prevents bus contention in multi-SRAM systems
Configurable burst order (LBO)Hardware-selectable linear or interleaved addressing enables optimization for cache line or DMA engine alignment
Byte-granularity write controlIndependent BW1–BW4 + BWE allows partial writes without masking or read-modify-write cycles
Asynchronous sleep (ZZ)Reduces power to ≤70mA while preserving data - enables dynamic power scaling in burst-idle intervals

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing incoming Ethernet frames in ingress pipeline before classification and forwarding.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with deterministic 8.5ns read access and burst-aligned writes.

Use Value: Enables line-rate processing at 10Gbps by supporting four 36-bit words per clock cycle without pipeline stalls.

Use Scenario: Holding configuration tables and real-time statistics in SONET/SDH framer ASICs.

IC Role / Device Role / Timing Role: Synchronous SRAM interfacing directly to framer's parallel bus with single-cycle deselect for rapid context switching.

Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliability in uncooled outdoor cabinet deployments.

Baseband Processing CacheIndustrial PLC Data Exchange Buffer

Use Scenario: Serving as instruction/data cache for DSP cores in wireless baseband units handling LTE/5G modulation.

IC Role / Device Role / Timing Role: Burst-mode SRAM delivering four consecutive 36-bit words per address request to match DSP fetch width.

Use Value: Linear burst ordering (LBO=LOW) aligns with sequential instruction fetch patterns, reducing address overhead.

Use Scenario: Buffering sensor data between fieldbus interface and real-time controller in factory automation systems.

IC Role / Device Role / Timing Role: Deterministic-access SRAM providing jitter-free data handoff under cyclic interrupt-driven I/O scanning.

Use Value: Flow-through outputs guarantee sub-9ns read response - meets <10ns hard real-time deadlines for motion control loops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1373KV18512K × 18-bit organization; 165-ball fBGA only; no LBO pin; fixed linear burstRequires PCB redesign due to different pinout and missing LBO control; suited for space-constrained designs needing higher densitySelect when board layout allows fBGA and burst order flexibility is unnecessary
AS7C3256BAsynchronous SRAM; 32K × 8-bit; no burst mode, no clock, no flow-through; 28-pin SOJCannot replace in clocked systems; lacks timing determinism and burst throughput; suitable only for legacy non-burst control-plane buffersChoose only for cost-sensitive, low-speed control memory where clock domain isolation is not required

Compared with CY7C1373KV18 and AS7C3256B, the 71V67703S85BQ uniquely delivers 256K×36 burst capability in TQFP with configurable LBO and flow-through outputs - making it irreplaceable for latency-critical, clock-synchronized data buffering where pin compatibility and timing predictability are mandatory.

Availability

71V67703S85BQ is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and industrial PLC data exchange requiring stable component supply and long-term industrial-grade availability.

Supply support for 71V67703S85BQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in high-performance memory, analog, and embedded solutions for communications, industrial, and automotive markets.

The 71V67703S85BQ belongs to IDT's high-speed synchronous SRAM product line, designed specifically for deterministic-latency, burst-capable memory subsystems in networking infrastructure and real-time embedded systems.

FAQ

What is the maximum operating frequency of the 71V67703S85BQ?

The 71V67703S85BQ is rated for operation up to 87MHz clock frequency, corresponding to an 8.5ns access time (tCD). This specification is guaranteed over the full industrial temperature range (–40°C to +85°C) and 3.3V ±5% supply conditions. The device supports lower-speed grades (100MHz/8.0ns and 117MHz/7.5ns) in other variants, but the 'S85' suffix confirms the 87MHz/8.5ns speed grade.

Does the 71V67703S85BQ support both linear and interleaved burst modes?

Yes, the 71V67703S85BQ supports both burst modes via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, the device uses linear burst ordering (00→01→10→11); when LBO is HIGH, it uses interleaved ordering (00→01→11→10). LBO is a static DC input and must remain stable during burst operation - changing it mid-burst may cause undefined address sequencing.

How does the 71V67703S85BQ handle partial writes to its 36-bit data bus?

Partial writes are supported through four independent byte-write enables (BW1–BW4), each controlling a 9-bit segment (BW1: I/O0–7 + I/OP1; BW2: I/O8–15 + I/OP2; etc.), gated by the synchronous BWE input. When BWE is LOW and a specific BWx is LOW on the rising CLK edge, only that 9-bit byte is written; all other bytes retain their prior values. This eliminates need for read-modify-write cycles.

What is the function of the ZZ pin on the 71V67703S85BQ?

The ZZ pin is an asynchronous sleep mode input. When driven HIGH, the 71V67703S85BQ gates its internal clock and enters full-sleep mode, reducing supply current to ≤70mA (ISB2) while retaining all stored data. ZZ requires no setup/hold timing relative to CLK and can be asserted at any time - including during active burst sequences - with guaranteed data retention.

Is the 71V67703S85BQ compatible with 5V-tolerant systems?

No, the 71V67703S85BQ is strictly a 3.3V device: VDD and VDDQ are specified at 3.3V ±5% (3.135V–3.465V). Input voltage limits are VIH = 2.0V min (VDD+0.3V max) and VIL = –0.3V min (0.8V max), confirming incompatibility with 5V logic levels. Interfacing with 5V systems requires level-shifting circuitry on all address, control, and data lines.

71V67703S85BQ Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
87 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V67703S85BQ FAQ

1.How can I place an order for 71V67703S85BQ through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V67703S85BQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V67703S85BQ reliable?

The price and inventory of 71V67703S85BQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67703S85BQ is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V67703S85BQ transactions.

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71V67703S85BQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V67703S85BQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V67703S85BQ?

For technical support, including 71V67703S85BQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67703S85BQ requirements.

6.How does Aetrix verify that 71V67703S85BQ is sourced from the original manufacturer or authorized distributors?

All 71V67703S85BQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67703S85BQ meets industry standards.

7.What is the process for return or replacement of 71V67703S85BQ?

All 71V67703S85BQ units undergo pre-shipment inspection (PSI). If there is an issue with 71V67703S85BQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V67703S85BQ part is unused and in its original packaging.

Return procedure for 71V67703S85BQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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