Renesas 71V67703S85PFGI8
- Part No.:
- 71V67703S85PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V67703S85PFGI8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,604
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Product details
Overview
71V67703S85PFGI8 from IDT (now Renesas) is a 256K × 36-bit (9-Mbit), 3.3V synchronous SRAM with flow-through outputs, single-cycle deselect, and linear/interleaved burst mode. It supports 8.5 ns access time at up to 87 MHz clock frequency, operates across –40°C to +85°C industrial temperature range, and features self-timed write with global and byte-level write control - used in high-bandwidth packet buffering and cache subsystems of telecom line cards.
For engineers reviewing the 71V67703S85PFGI8 datasheet, 71V67703S85PFGI8 pinout, 71V67703S85PFGI8 application, or 71V67703S85PFGI8 equivalent, key selection criteria include burst address sequencing (LBO-controlled), 100-pin TQFP package compatibility, flow-through output timing, ZZ sleep-mode power management, and 3.3V core/I/O supply compliance.
Technical Context
This SRAM implements a synchronous, clock-driven architecture with registered address, control, and data inputs, and a flow-through (unregistered) output path. Its internal burst counter advances on ADV assertion and selects sequence order via LBO pin - linear (LBO = LOW) or interleaved (LBO = HIGH) - enabling four-word burst reads per address cycle.
Write operations support multiple modes: global write (GW), byte write enable (BWE), and individual byte writes (BW1–BW4), all synchronized to CLK rising edge. Power-down is controlled asynchronously by ZZ input, gating internal clock and reducing current to ≤70 mA in full sleep mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9,175,040 bits); supports 512K × 18-bit configuration via address mapping |
| Access Time / Max Frequency | 8.5 ns access time; supports up to 87 MHz clock frequency for sustained burst reads |
| Supply Voltages | 3.3 V ±5% core (VDD) and I/O (VDDQ); separate supplies enable noise isolation |
| Burst Mode | Four-word burst per address; sequence determined by LBO pin (linear or interleaved) |
| Power-Down Current | ≤70 mA in full sleep mode (ZZ HIGH); enables low-power standby in network processors |
| Operating Temperature | –40°C to +85°C industrial grade; qualified for base station and industrial control environments |
| Package | JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm footprint |
Pinout & Package
71V67703S85PFGI8 is packaged in a JEDEC-standard 100-pin thin plastic quad flatpack (TQFP), 14 mm × 20 mm body size, with exposed pad for thermal dissipation. Pin 1 marked by dot; pin numbering follows standard counter-clockwise convention from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous address latching on rising CLK edge when ADSP or ADSC asserted; A0–A17 used for 256K×36 mode |
| CLK | System Clock Input | Primary timing reference; all synchronous inputs sampled on rising edge; no internal clock division |
| CE, CS0, CS1 | Chip Enable / Selects | Three-level chip select hierarchy: CE active LOW, CS0 active HIGH, CS1 active LOW - enables multi-chip memory banks |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE gates BWx signals; BW1–BW4 each control one 9-bit byte (I/O0–7+I/OP1, etc.) |
| OE | Asynchronous Output Enable | Drives I/O pins to high-Z when HIGH; enables fast output disable independent of CLK |
| LBO | Burst Order Selection | DC-level input: LOW = linear burst (00→01→10→11), HIGH = interleaved burst (00→01→11→10) |
| ZZ | Asynchronous Sleep Mode | Internally gates CLK when HIGH; reduces IDD to ≤70 mA while retaining data; no setup required |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O (36-bit bus) | Synchronous input (registered), flow-through output (no register); supports byte-wide write masking |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Eliminates output register delay - data appears at I/O pins within tCD (≤8.5 ns) after CLK rise, critical for zero-wait-state interfaces |
| Single-cycle deselect | Device enters high-Z output state within one CLK cycle after chip deselect - prevents bus contention during rapid bank switching |
| Self-timed write cycle | Internal timing logic completes write without external wait-state generation - simplifies controller design and improves throughput |
| Configurable burst addressing | LBO pin selects linear or interleaved 4-word burst order - matches processor cache line layouts (e.g., PowerPC, MIPS) or custom DMA engines |
| Independent VDD/VDDQ supplies | Separate 3.3V core and I/O rails reduce switching noise coupling and support mixed-voltage system integration |
Applications
| Packet Buffering | Network Processor Cache |
|---|---|
Use Scenario: Line-rate buffering of Ethernet frames in Layer 2/L3 switches with dynamic queue depth allocation. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM serving as ingress/egress packet memory with burst-aligned read/write. Use Value: 8.5 ns access + flow-through output enables sub-10 ns data delivery to MAC controllers, supporting 10 Gbps+ throughput. |
Use Scenario: Instruction/data cache for multi-threaded network processors handling deep packet inspection. IC Role / Device Role / Timing Role: Synchronous burst-access memory interfaced directly to processor AXI/AHB bus with single-cycle deselect. Use Value: Linear burst mode aligns with 128-bit cache line fetches; ZZ sleep mode cuts idle power by >75% during low-traffic intervals. |
| Telecom Baseband Processing | Industrial PLC Data Logging |
Use Scenario: Real-time buffering of CPRI/OBSAI interface samples between FPGA and DSP in 4G/5G remote radio units. IC Role / Device Role / Timing Role: Flow-through SRAM providing deterministic latency for time-sensitive sample transfers. Use Value: tCD ≤8.5 ns and tCLZ = 0 ns ensure sample data meets strict jitter budgets (<1 ns variation) across temperature. |
Use Scenario: High-reliability data acquisition buffer in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Industrial-grade SRAM storing sensor history and control state with guaranteed retention at –40°C to +85°C. Use Value: Full industrial temp rating + ZZ sleep mode extends battery-backed runtime during brownouts without data loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1373KV18 | 512K × 18-bit only; no 256K × 36-bit config; 7.5 ns access; 165-ball fBGA only | Requires PCB redesign for BGA layout; lacks TQFP option and LBO-configurable burst order | Select when higher density (9-Mbit same) and faster 117 MHz operation are prioritized over pin compatibility and burst flexibility |
| AS7C36256PFSIG | 256K × 36-bit; 10 ns access; 100-pin TQFP; no burst mode; asynchronous interface | No ADV/LBO support; no flow-through output; requires external wait-state logic | Choose for cost-sensitive legacy designs where burst performance and zero-wait-state operation are not required |
Compared with CY7C1373KV18 and AS7C36256PFSIG, the 71V67703S85PFGI8 uniquely delivers 256K×36 organization in TQFP with configurable burst sequencing and flow-through timing - enabling drop-in replacement in IDT-based telecom platforms without layout or firmware changes.
Availability
71V67703S85PFGI8 is available at Aetrix Electronics and suitable for packet buffering, network processor cache, and industrial data logging requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.
Supply support for 71V67703S85PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in high-performance memory, timing, and connectivity solutions for infrastructure and industrial markets.
The 71V67703S85PFGI8 belongs to IDT's high-speed synchronous SRAM product line, engineered for deterministic, low-latency data buffering in telecom, networking, and real-time control systems.
FAQ
What is the maximum clock frequency supported by the 71V67703S85PFGI8?
The 71V67703S85PFGI8 supports up to 87 MHz clock frequency, corresponding to its 8.5 ns access time specification. This is validated across the full industrial temperature range (–40°C to +85°C) and under worst-case voltage conditions (VDD = 3.135 V). The device maintains timing compliance without derating when operated within recommended DC conditions.
Does the 71V67703S85PFGI8 support both linear and interleaved burst modes?
Yes, the 71V67703S85PFGI8 supports both burst modes via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, it selects linear burst order (00→01→10→11); when HIGH, it selects interleaved order (00→01→11→10). LBO is a static DC input and must remain stable during burst operation.
How does the flow-through output architecture benefit system timing in the 71V67703S85PFGI8?
The flow-through output architecture in the 71V67703S85PFGI8 eliminates output register delay, delivering valid data within tCD ≤8.5 ns after the CLK rising edge. This enables zero-wait-state interfacing with high-speed processors and ASICs, reducing overall memory access latency by up to 3 ns compared to registered-output SRAMs.
What is the function of the ZZ pin on the 71V67703S85PFGI8?
The ZZ pin on the 71V67703S85PFGI8 is an asynchronous sleep mode input. When driven HIGH, it internally gates the CLK signal and reduces supply current to ≤70 mA (industrial grade) while retaining full data integrity. Recovery time (tZZR) is 100 ns, and no external reset or reconfiguration is needed upon wake-up.
Can the 71V67703S85PFGI8 be used in both 256K×36 and 512K×18 configurations?
Yes, the 71V67703S85PFGI8 is configurable as either 256K × 36-bit or 512K × 18-bit. Address mapping differs: A0–A17 are used for 256K×36 mode, while A0–A18 are used for 512K×18. Pin functions remain identical; only address decoding logic changes - no hardware modification is required to switch modes.
71V67703S85PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 87 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V67703S85PFGI8 FAQ
1.How can I place an order for 71V67703S85PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67703S85PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V67703S85PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67703S85PFGI8 is usually 5 days.
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For technical support, including 71V67703S85PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67703S85PFGI8 requirements.
6.How does Aetrix verify that 71V67703S85PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V67703S85PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67703S85PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V67703S85PFGI8?
All 71V67703S85PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67703S85PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67703S85PFGI8 part is unused and in its original packaging.
Return procedure for 71V67703S85PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67703S85PFGI8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C08C-STUM-T
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