Renesas 71V67803S133BQG
- Part No.:
- 71V67803S133BQG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V67803S133BQG.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V67803S133BQG from IDT (now Renesas) is a 512K × 18-bit, 3.3V synchronous SRAM with pipelined outputs, single-cycle deselect, and 133MHz operation (4.2ns clock access time). It supports linear/interleaved burst modes via LBO input, features self-timed write with global/byte write control, and operates across industrial temperature range (–40°C to +85°C). It is used in high-speed networking buffers and FPGA co-processor memory subsystems.
For engineers reviewing the 71V67803S133BQG datasheet, 71V67803S133BQG pinout, 71V67803S133BQG application, or 71V67803S133BQG equivalent, key selection criteria include burst mode timing compliance, ZZ sleep current (≤70mA), VDD/VDDQ supply separation, and TQFP-100 package compatibility with legacy IDT SRAM layouts.
Technical Context
This SRAM implements a synchronous interface with registered address, data, and control paths triggered on the rising edge of CLK. Its internal burst counter advances on ADV=LOW and selects linear or interleaved sequences based on static LBO state - no runtime reconfiguration permitted. Pipelined read output delivers first valid data one clock cycle after address latch, with subsequent burst words aligned to consecutive CLK edges.
The device supports four distinct write modes: global write (GW), byte write enable (BWE) with BW1–BW2 (BW3/BW4 not applicable per datasheet note), and asynchronous OE-controlled output disable. Sleep mode is entered asynchronously via ZZ=HIGH, gating CLK internally while retaining data with IZZ ≤70mA at industrial temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18-bit (9Mbit); configured as 18-bit wide data bus for efficient FPGA or DSP interfacing. |
| Clock Frequency / Access Time | 133MHz max (tCYC = 7.5ns); 4.2ns clock-to-data (tCD) ensures timing margin for 133MHz system clocks. |
| Supply Voltages | VDD = 3.3V ±5% (core), VDDQ = 3.3V ±5% (I/O); separate supplies allow independent noise management. |
| Burst Mode Control | LBO input selects linear or interleaved burst order; static configuration required before operation. |
| Power-Down Current | IZZ ≤70mA (industrial temp); enables low-power standby in network line cards during idle periods. |
| Package | JEDEC-standard 100-pin TQFP (14mm × 20mm); pin-compatible with IDT71V67603/67803 family layouts. |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for base station and industrial controller environments. |
Pinout & Package
71V67803S133BQG is packaged in a JEDEC-standard 100-pin thin plastic quad flatpack (TQFP), 14mm × 20mm body size, with 0.5mm lead pitch. Pin 1 marked by corner notch; top-side marking includes "71V67803S133BQG" and date code.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADSP or ADSC active. |
| CE, CS0, CS1 | Chip Enable / Selects | Three-level chip select hierarchy (CE LOW + CS1 LOW + CS0 HIGH) enables multi-SRAM addressing. |
| GW, BWE, BW1–BW2 | Write Control Inputs | GW enables full 18-bit write; BWE gates BW1/BW2; BW1 controls I/O0–I/O8/I/OP1, BW2 controls I/O9–I/O17/I/OP2. |
| CLK, ADV, ADSP, ADSC | Timing & Burst Control | CLK drives all registers; ADV advances burst counter; ADSP/ADSC load address register from processor/cache. |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O | 18-bit bidirectional data bus + 2 parity bits; registered input/output paths ensure clean setup/hold timing. |
| OE, ZZ, LBO | Functional Control | OE (asynchronous) enables outputs; ZZ (asynchronous) enters sleep mode; LBO (static) configures burst order. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Outputs | First read data available one clock cycle after address latch; eliminates wait states in high-throughput pipelines. |
| Single-Cycle Deselect | Device transitions to high-Z output state within one CLK cycle upon chip disable - critical for bus arbitration. |
| Self-Timed Write Cycle | Internal timing logic eliminates external write pulse generation; simplifies FPGA controller logic. |
| Linear/Interleaved Burst Modes | LBO pin selects burst sequence without software overhead - matches cache line access patterns in RISC processors. |
| Separate Core & I/O Supplies | VDD (core) and VDDQ (I/O) decoupling reduces switching noise coupling between logic and data paths. |
Applications
| Networking Packet Buffer | FPGA Co-Processor Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in 10G Ethernet line cards. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly with MAC-layer logic via synchronous burst reads. Use Value: 133MHz operation and pipelined outputs sustain >2.4 Gbps sustained throughput with zero wait states. |
Use Scenario: Offloading real-time signal processing tasks from host CPU using FPGA-accelerated algorithms. IC Role / Device Role / Timing Role: Dual-port accessible memory block providing scratchpad storage for FFT and filter coefficient tables. Use Value: Single-cycle deselect and burst capability enable seamless handoff between FPGA pipeline stages without bus contention. |
| Industrial PLC Data Cache | Avionics Sensor Interface Buffer |
|
Use Scenario: Caching sensor fusion results and motion control setpoints in ruggedized programmable logic controllers. IC Role / Device Role / Timing Role: Industrial-grade SRAM holding deterministic execution data with guaranteed retention at –40°C to +85°C. Use Value: ZZ sleep mode reduces standby power to ≤70mA, extending uptime in battery-backed control modules. |
Use Scenario: Temporarily storing high-rate inertial measurement unit (IMU) samples before ARINC-429 formatting. IC Role / Device Role / Timing Role: Synchronous burst buffer synchronizing to aircraft master clock for deterministic latency. Use Value: 4.2ns tCD and 0ns tCLZ/tOLZ support sub-10ns timing closure in DO-254-compliant designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-133BZXI | 512K × 18, 133MHz, same VDD/VDDQ, but uses different burst counter architecture and lacks ADSC input. | Requires redesign of cache controller interface due to missing ADSC; compatible with standard processor ADSP-only systems. | Select when ADSC functionality is unused and Cypress footprint compatibility is prioritized. |
| AS7C3512PFSI-133 | 512K × 18, 133MHz, identical pinout and AC timing, but only supports linear burst (no LBO pin). | Cannot implement interleaved burst sequences; limits optimization for certain cache architectures. | Select when linear burst suffices and long-term ASI supply chain continuity is preferred. |
Compared with CY7C1371DV33-133BZXI and AS7C3512PFSI-133, the 71V67803S133BQG uniquely supports both ADSC-based cache coherency and configurable linear/interleaved burst - enabling tighter integration with legacy IDT-based systems and flexible memory controller design.
Availability
71V67803S133BQG is available at Aetrix Electronics and suitable for networking infrastructure, industrial automation, and avionics applications requiring stable component supply, extended temperature operation, and long-lifecycle support.
Supply support for 71V67803S133BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in microcontrollers, analog, power management, and high-performance memory solutions.
The 71V67803S133BQG belongs to IDT's high-speed synchronous SRAM product line, designed specifically for demanding real-time applications in communications, test equipment, and industrial control where deterministic timing and low-latency access are critical.
FAQ
What is the maximum operating frequency of the 71V67803S133BQG?
The 71V67803S133BQG is rated for 133MHz operation with a minimum clock cycle time (tCYC) of 7.5ns. At this frequency, its clock-to-data delay (tCD) is guaranteed at 4.2ns. The device also supports lower-speed 150MHz (3.8ns tCD) and 166MHz (3.5ns tCD) variants within the same family, but the 'S133' suffix confirms this unit is specifically characterized and screened for 133MHz performance.
Does the 71V67803S133BQG support byte write operations?
Yes, the 71V67803S133BQG supports byte write operations via BWE and BW1–BW2 inputs. BW1 controls I/O0–I/O8 and I/OP1 (9 bits), BW2 controls I/O9–I/O17 and I/OP2 (9 bits). Per datasheet note, BW3 and BW4 are not applicable for the 71V67803S133BQG - confirming it is the 512K × 18 variant, not the 256K × 36 version which uses all four byte enables.
What is the function of the LBO pin on the 71V67803S133BQG?
The LBO (Linear Burst Order) pin on the 71V67803S133BQG is an asynchronous input that statically selects burst sequence mode: LBO = LOW enables linear burst order, LBO = HIGH enables interleaved burst order. It must remain stable during operation - dynamic switching is not supported. This allows alignment with specific processor cache line access patterns without software intervention.
How does sleep mode work on the 71V67803S133BQG?
Sleep mode on the 71V67803S133BQG is activated asynchronously by driving ZZ = HIGH. This internally gates the CLK path and reduces supply current to ≤70mA (industrial grade). Data retention is guaranteed during sleep. To resume operation, ZZ must be returned LOW and the device must be deselected (CE/CS1 deasserted) before re-enabling - per datasheet requirement that the device be deselected when powered up from sleep mode.
Is the 71V67803S133BQG pin-compatible with other IDT SRAMs?
Yes, the 71V67803S133BQG uses the standard IDT 100-pin TQFP footprint (PKG100) shared across the 71V67603/67803 family. Pin functions match identically for A0–A17, CLK, CE, CS0, CS1, GW, BWE, BW1–BW2, OE, ZZ, LBO, I/O0–I/O17, I/OP1–I/OP2, VDD, VDDQ, and VSS. NC pins and address bit allocation (e.g., A18 usage) differ between 256K×36 and 512K×18 variants, but layout reuse is feasible with minor netlist updates.
71V67803S133BQG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V67803S133BQG FAQ
1.How can I place an order for 71V67803S133BQG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67803S133BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V67803S133BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67803S133BQG is usually 5 days.
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6.How does Aetrix verify that 71V67803S133BQG is sourced from the original manufacturer or authorized distributors?
All 71V67803S133BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67803S133BQG meets industry standards.
7.What is the process for return or replacement of 71V67803S133BQG?
All 71V67803S133BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V67803S133BQG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67803S133BQG part is unused and in its original packaging.
Return procedure for 71V67803S133BQG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67803S133BQG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
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