Renesas 71V67803S150BQI
- Part No.:
- 71V67803S150BQI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V67803S150BQI.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V67803S150BQI from IDT (now Renesas) is a 512K × 18-bit, 3.3V synchronous SRAM with pipelined outputs, single-cycle deselect, and 150MHz operation (3.8ns clock access time). It supports interleaved/linear burst modes via LBO input, features global and byte-level write control (GW/BWE/BW1–BW2), and operates across industrial temperature range (−40°C to +85°C) in a 100-pin TQFP package. It serves as high-speed cache or buffer memory in network packet processors and telecom line cards.
For engineers reviewing the 71V67803S150BQI datasheet, 71V67803S150BQI pinout, 71V67803S150BQI application, or 71V67803S150BQI equivalent, key selection criteria include burst timing compliance, ZZ-controlled sleep mode current (≤70mA), 3.3V I/O supply (VDDQ) tolerance, and compatibility with 150MHz system clocks in pipeline-constrained embedded memory subsystems.
Technical Context
The 71V67803S150BQI implements a synchronous, clock-driven architecture with registered address, data, and control inputs-triggered on the rising edge of CLK. Its internal burst counter generates four sequential addresses per initial address, with order determined by LBO (LOW = linear, HIGH = interleaved); BW3 and BW4 are not implemented per datasheet note.
It uses self-timed write cycles gated by GW (global) or BWE + BW1/BW2 (byte-select), with asynchronous OE and ZZ controls. Pipelined output registers deliver first data one clock cycle after address latch, enabling deterministic 150MHz read throughput without wait states in burst mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18-bit (9Mbit total); supports 18-bit data bus width for cost-optimized high-bandwidth interfaces. |
| Clock Frequency / Access Time | 150MHz max (tCYC = 6.7ns); 3.8ns clock-to-data (tCD) enables tight timing closure in FPGA- or ASIC-connected memory subsystems. |
| Supply Voltages | VDD = 3.3V ±5% (core), VDDQ = 3.3V ±5% (I/O); separate supplies allow independent noise management for logic and data paths. |
| Power Consumption | ISB2 = 150mA (clock running, deselected), IZZ = 70mA (full sleep); low-power modes reduce thermal load in dense telecom modules. |
| Burst & Control Logic | LBO selects linear/interleaved burst order; ADV suspends burst; ADSP/ADSC enable processor/cache coherency signaling. |
| Operating Temperature | −40°C to +85°C (industrial grade); validated for deployment in base station RF units and industrial PLC backplanes. |
| Package | JEDEC-standard 100-pin TQFP (14mm × 20mm); surface-mount compatible with standard reflow profiles and AOI inspection. |
Pinout & Package
71V67803S150BQI is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14mm × 20mm body, with 0.5mm pitch. Pin 14 may be tied to VDD or left unconnected; Pin 64 (ZZ) must be actively driven or pulled to VSS for sleep control.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK when ADSP or ADSC is active LOW. |
| CE, CS0, CS1 | Chip Enable / Selects | Three-level chip select hierarchy (CE active LOW, CS0 active HIGH, CS1 active LOW) enables multi-SRAM bank decoding. |
| GW, BWE, BW1–BW2 | Write Control Inputs | GW enables full 18-bit writes; BWE enables byte write gating; BW1/BW2 control lower/upper 9-bit bytes (BW3/BW4 unused per datasheet). |
| CLK, ADV, ADSP, ADSC | Burst Timing & Address Strobe | CLK drives all registers; ADV advances burst counter; ADSP (processor) and ADSC (cache) provide dual-source address status signaling. |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O (18-bit + 2 parity) | Synchronous bidirectional data bus with registered input/output paths; I/OP1/I/OP2 support optional parity checking. |
| OE, ZZ, LBO | Output & Mode Control | OE (asynchronous) enables/disables outputs; ZZ (asynchronous) forces full sleep; LBO (static) configures burst sequence at power-up. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Outputs | First output data appears one clock cycle after address latch, eliminating read latency bottlenecks in high-frequency pipelines. |
| Single-Cycle Deselect | Device enters high-Z state within one CLK cycle upon deassertion of CE/CS0/CS1, preventing bus contention during rapid bank switching. |
| Self-Timed Write Cycle | Internal timing logic eliminates external write pulse generation; write completion is guaranteed regardless of clock jitter or skew. |
| Industrial Temperature Range | Validated operation from −40°C to +85°C ensures reliability in outdoor telecom enclosures and factory automation controllers. |
| Low-Power Sleep Mode | IZZ ≤ 70mA with ZZ HIGH guarantees minimal standby current in always-on systems with periodic activity bursts. |
Applications
| Network Packet Buffering | Telecom Line Card Cache |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: High-speed synchronous buffer providing burst-aligned 18-bit data reads/writes at 150MHz to match MAC-layer throughput. Use Value: Pipelined outputs and single-cycle deselect prevent pipeline stalls during header parsing and forwarding decisions. |
Use Scenario: Acting as instruction/data cache for DSP-based channel bonding engines in DSLAMs and OLTs. IC Role / Device Role / Timing Role: Low-latency memory interface supporting interleaved burst fetches for real-time signal processing kernels. Use Value: LBO-configurable burst order aligns with DSP memory access patterns, reducing average instruction fetch latency by up to 25%. |
| Industrial PLC Backplane Memory | Radar Signal Processing Buffer |
|
Use Scenario: Holding real-time I/O mapping tables and motion control trajectory data in programmable logic controllers. IC Role / Device Role / Timing Role: Industrial-grade SRAM interfacing directly with microcontroller buses under wide ambient temperature swings. Use Value: −40°C to +85°C rating and robust VDD/VDDQ decoupling ensure deterministic timing across factory floor thermal gradients. |
Use Scenario: Temporary storage of digitized IF samples between ADC capture and FFT computation in phased-array radar receivers. IC Role / Device Role / Timing Role: Burst-capable memory delivering four consecutive 18-bit samples per clock cycle to match FFT engine input bandwidth. Use Value: 3.8ns tCD and 150MHz clock support enable real-time sample buffering without FIFO depth expansion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1373KV18 | 512K × 18-bit, 166MHz, 3.3V; supports QDR-II+ dual-port mode; no LBO or ADV pins. | Targeted at dual-clock domain applications (e.g., memory controller ↔ PHY bridging); lacks burst suspend capability. | Select when dual-port access or higher 166MHz frequency is required; avoid if ADV/LBO burst control is mandatory. |
| AS7C35128P | 512K × 18-bit, 133MHz, 3.3V; no pipelined outputs; asynchronous OE; only linear burst mode. | Suitable for cost-sensitive, non-pipelined systems where tCD > 4.2ns is acceptable and burst flexibility is unnecessary. | Choose for legacy designs requiring drop-in replacement with relaxed timing; not suitable for 150MHz pipeline-critical paths. |
Compared with CY7C1373KV18 and AS7C35128P, the 71V67803S150BQI uniquely delivers 150MHz pipelined burst operation with configurable linear/interleaved addressing and ADV-suspend-critical for real-time packet and signal processing where deterministic latency and burst adaptability are non-negotiable.
Availability
71V67803S150BQI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, and industrial PLC backplane memory applications requiring stable component supply across extended product lifecycles.
Supply support for 71V67803S150BQI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V67803S150BQI belongs to IDT's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-oriented memory subsystems in telecom infrastructure and real-time embedded control.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V67803S150BQI?
The 71V67803S150BQI is rated for 150MHz operation with a guaranteed clock-to-data access time (tCD) of 3.8ns. This specification applies across the full industrial temperature range (−40°C to +85°C) and is validated under VDD/VDDQ = 3.3V ±5%. The device also supports 133MHz (4.2ns) and 166MHz (3.5ns) variants, but the S150 suffix denotes the 150MHz grade.
Does the 71V67803S150BQI support both linear and interleaved burst modes, and how is this configured?
Yes, the 71V67803S150BQI supports both linear and interleaved burst sequences via the LBO (Linear Burst Order) pin. When LBO is driven LOW, linear burst order is selected; when HIGH, interleaved order is used. LBO is a static input and must remain stable during operation-its state is sampled at power-up or after ZZ recovery to configure the internal burst counter behavior.
Are BW3 and BW4 functional on the 71V67803S150BQI?
No, BW3 and BW4 are not applicable to the 71V67803S150BQI. As explicitly stated in the datasheet (Note 1, Pin Description Summary), these pins are reserved and unused for the 512K × 18 configuration. Only BW1 and BW2 are active, controlling the lower and upper 9-bit bytes respectively. This differs from the 256K × 36 variant (71V67603), which uses all four BWx signals.
What is the purpose of the ADV pin on the 71V67803S150BQI, and how does it affect burst operation?
The ADV (Burst Address Advance) pin controls whether the internal burst counter increments after the initial address is loaded. When ADV is LOW, the counter advances automatically for subsequent burst cycles; when HIGH, burst address progression is suspended, holding the current address for repeated access. This allows precise control over burst sequencing-e.g., pausing mid-burst to insert a priority write-without terminating the burst mode.
How does the 71V67803S150BQI handle power-down and sleep modes, and what is the typical current draw in each state?
The 71V67803S150BQI supports two low-power states: CMOS standby (ISB2 = 150mA at 150MHz, deselected) and full sleep mode (IZZ ≤ 70mA) activated by driving ZZ HIGH. In sleep mode, the internal clock is gated, core logic is halted, and data retention is guaranteed. VDD and VDDQ supplies must remain active; no power sequencing is required, but I/O pins must not exceed VDDQ during ramp-up.
71V67803S150BQI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V67803S150BQI FAQ
1.How can I place an order for 71V67803S150BQI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67803S150BQI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V67803S150BQI reliable?
The price and inventory of 71V67803S150BQI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67803S150BQI is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V67803S150BQI?
For technical support, including 71V67803S150BQI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67803S150BQI requirements.
6.How does Aetrix verify that 71V67803S150BQI is sourced from the original manufacturer or authorized distributors?
All 71V67803S150BQI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67803S150BQI meets industry standards.
7.What is the process for return or replacement of 71V67803S150BQI?
All 71V67803S150BQI units undergo pre-shipment inspection (PSI). If there is an issue with 71V67803S150BQI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67803S150BQI part is unused and in its original packaging.
Return procedure for 71V67803S150BQI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67803S150BQI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
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