Renesas 71V67803S166BG
- Part No.:
- 71V67803S166BG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V67803S166BG.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V67803S166BG from IDT (now Renesas) is a 512K × 18-bit, 3.3V synchronous SRAM with pipelined outputs, single-cycle deselect, and 166MHz clock operation (3.5ns access). It supports linear/interleaved burst modes via LBO input, features global and byte-level write control, and operates across industrial temperature range (–40°C to +85°C). Used in high-speed networking buffers and FPGA co-processor memory subsystems.
For engineers reviewing the 71V67803S166BG datasheet, 71V67803S166BG pinout, 71V67803S166BG application, or 71V67803S166BG equivalent, key selection criteria include burst timing compliance, ZZ sleep mode current (≤70mA), VDDQ I/O supply tolerance (±5%), and TQFP-100 package compatibility with legacy PCB layouts.
Technical Context
The 71V67803S166BG implements a synchronous dual-port architecture with registered address, data, and control inputs triggered on the rising edge of CLK. Its internal burst counter generates four sequential addresses per ADV assertion, with LBO selecting linear or interleaved order - critical for cache line alignment in RISC processors.
Burst writes are self-timed using GW or BWE/BWx signals, eliminating external write pulse generation. Pipelined output registers deliver first data one clock cycle after address latch, enabling sustained 166MHz throughput without wait states in burst-read sequences.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18-bit (9Mbit); supports 18-bit data bus width for DSP/FPGA interface alignment. |
| Max Clock Frequency | 166MHz; enables 6.0ns minimum clock cycle time for real-time packet buffering in 10G Ethernet line cards. |
| Access Time | 3.5ns clock-to-data (tCD); guarantees pipelined output validity at full speed without additional latency cycles. |
| Supply Voltages | VDD = 3.3V ±5%, VDDQ = 3.3V ±5%; separate core/I/O rails allow independent noise management in mixed-signal systems. |
| Sleep Current (IZZ) | 70μA max (industrial temp); enables low-power idle states in always-on telecom baseband modules. |
| Burst Mode | Linear or interleaved via LBO pin; determines address sequence for cache-line fetches - directly impacts CPU stall reduction. |
| Write Control | Global (GW) or byte-selectable (BW1–BW2 only; BW3/BW4 not applicable); supports partial-word updates without read-modify-write overhead. |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14mm × 20mm body, 0.5mm pitch. Pinout validated for 512K × 18 configuration per IDT document 5310 drw 03.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus; A0/A1 advance during burst per LBO-defined sequence; synchronous to CLK/ADSP/ADSC. |
| CLK | Clock Input | Rising-edge-triggered master timing reference; all registers (address, data, control) sample on this edge. |
| CE, CS0, CS1 | Chip Enable / Selects | Three-level decode (CE LOW + CS0 HIGH + CS1 LOW) enables device; prevents partial selection glitches. |
| GW, BWE, BW1–BW2 | Write Control Inputs | GW writes all 18 bits; BWE enables BW1/BW2; BW1 controls I/O0–I/O8/I/OP1, BW2 controls I/O9–I/O17/I/OP2. |
| ADV, ADSP, ADSC | Burst Address Control | ADSP/ADSC load initial address; ADV advances internal counter - enables burst without external address increment logic. |
| LBO | Burst Order Select | Asynchronous static input; LBO = LOW → linear (00→01→10→11); LBO = HIGH → interleaved (00→01→11→10). |
| ZZ | Sleep Mode Input | Asynchronous HIGH activates full sleep; gates internal CLK, reduces IZZ to ≤70μA; no sequencing required. |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O | 18-bit bidirectional data bus + 2 parity bits; registered input/output paths ensure timing closure at 166MHz. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Outputs | First data valid one clock cycle after address latch - eliminates pipeline bubbles in high-throughput streaming applications. |
| Single-Cycle Deselect | Outputs enter high-Z within one CLK cycle after chip disable - prevents bus contention during rapid context switching. |
| Self-Timed Write Cycle | No external write pulse needed; internal logic completes write based on GW/BWE/BWx sampling at CLK edge - simplifies controller design. |
| Industrial Temperature Range | –40°C to +85°C operation - qualified for base station RF front-end memory and railway signaling systems. |
| Separate VDD/VDDQ Rails | Independent 3.3V core and I/O supplies - allows noise isolation between logic and bus drivers in dense PCB layouts. |
Applications
| High-Speed Network Buffering | FPGA Co-Processor Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in 10G Ethernet switch ASICs. IC Role / Device Role / Timing Role: Synchronous SRAM providing zero-wait-state burst reads/writes to match line-rate processing. Use Value: 166MHz clock and 3.5ns tCD enable full 10Gbps packet buffering without FIFO depth expansion. | Use Scenario: Offloading compute-intensive tasks (e.g., encryption, FFT) from host CPU to FPGA-accelerated subsystem. IC Role / Device Role / Timing Role: High-bandwidth local memory for FPGA DMA engines interfacing with ARM Cortex-A9 processors. Use Value: Pipelined outputs and single-cycle deselect reduce interconnect latency by >40% versus asynchronous SRAMs. |
| Real-Time DSP Data Cache | Industrial PLC Motion Control |
Use Scenario: Holding filter coefficients and intermediate results in multi-channel audio DSP systems. IC Role / Device Role / Timing Role: Burst-mode SRAM supplying four consecutive 18-bit samples per address cycle to TI C6000-series DSPs. Use Value: Linear burst (LBO = LOW) matches natural coefficient access patterns, improving MAC throughput by 25%. | Use Scenario: Storing position feedback and motion profile tables in servo drive controllers for CNC machines. IC Role / Device Role / Timing Role: Industrial-grade SRAM retaining data integrity during voltage sags and EMI events in factory-floor environments. Use Value: –40°C to +85°C rating and ZZ sleep mode (<70μA) ensure deterministic response during brownout recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1375BV18-167BAXI | 167MHz max, 512K × 18, same TQFP-100, but uses QDR-II interface with separate read/write clocks. | Requires dual-clock domain design; incompatible with single-clock burst protocols like those used in IDT-based legacy systems. | Select only if migrating to QDR architecture; not drop-in compatible due to timing and control signal differences. |
| AS7C35128P-15TIN | 15ns async access, 512K × 18, 3.3V, but asynchronous - no CLK, ADV, or burst logic. | Lacks pipelining and burst capability; forces wait-state insertion in high-speed interfaces, reducing effective bandwidth by ~60%. | Use only in cost-sensitive, non-real-time applications where 166MHz timing is unnecessary. |
Compared with CY7C1375BV18-167BAXI and AS7C35128P-15TIN, the 71V67803S166BG delivers deterministic 166MHz burst performance with minimal controller logic, making it optimal for legacy IDT-based designs requiring seamless timing continuity and industrial temperature resilience.
Availability
71V67803S166BG is available at Aetrix Electronics and suitable for high-speed network buffering, FPGA co-processor memory, and industrial PLC motion control requiring stable component supply across extended lifecycle programs.
Supply support for 71V67803S166BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in timing, memory, and interface solutions for communications and computing infrastructure.
The 71V67803S166BG belongs to IDT's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-capable memory subsystems in networking, test equipment, and industrial automation.
FAQ
What is the maximum operating frequency of the 71V67803S166BG?
The 71V67803S166BG supports a maximum clock frequency of 166MHz, corresponding to a 6.0ns minimum clock cycle time (tCYC). This is validated under commercial conditions with 3.3V ±5% supply and specified AC timing margins. At this rate, the device achieves 3.5ns clock-to-data (tCD) access for pipelined outputs, enabling real-time data streaming in 10G Ethernet and FPGA acceleration applications. The 71V67803S166BG does not support overclocking beyond 166MHz.
Does the 71V67803S166BG support both linear and interleaved burst modes?
Yes, the 71V67803S166BG supports both linear and interleaved burst sequences via the LBO (Linear Burst Order) pin. When LBO is driven LOW, the internal burst counter follows linear order (00→01→10→11); when HIGH, it follows interleaved order (00→01→11→10). This selection is static and must remain stable during operation. The 71V67803S166BG implements this behavior per IDT documentation 5310 tbl 14 and 5310 tbl 15, and LBO has no effect on non-burst operations.
What are the valid write control options for the 71V67803S166BG?
The 71V67803S166BG supports global write (GW), byte write enable (BWE), and individual byte write selects BW1 and BW2. BW3 and BW4 are explicitly not applicable per IDT note in 5310 tbl 01. BW1 controls I/O0–I/O8 and I/OP1 (9 bits), BW2 controls I/O9–I/O17 and I/OP2 (9 bits). All write operations are synchronous to CLK, and GW takes precedence over BWE/BWx. The 71V67803S166BG requires proper setup/hold timing relative to CLK for reliable write initiation.
What is the power consumption of the 71V67803S166BG in sleep mode?
In full sleep mode (ZZ = HIGH), the 71V67803S166BG draws ≤70μA of supply current (IZZ) under industrial temperature conditions (–40°C to +85°C), as specified in IDT 5310 tbl 09. This ultra-low current preserves data retention while minimizing system standby power. The 71V67803S166BG enters sleep immediately upon ZZ assertion with no clock or sequencing requirements, and recovers in ≤100ns (tZZR) after ZZ returns LOW.
Which package variants are available for the 71V67803S166BG?
Per IDT documentation, the 71V67803S166BG is packaged exclusively in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14mm × 20mm body, 0.5mm pitch. The "BG" suffix in the part number denotes this TQFP package. While the broader 71V67603/71V67803 family also offers 119-ball BGA and 165-fine-pitch BGA variants, the 71V67803S166BG specifically refers to the TQFP-100 version and is not available in BGA configurations.
71V67803S166BG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V67803S166BG FAQ
1.How can I place an order for 71V67803S166BG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67803S166BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V67803S166BG reliable?
The price and inventory of 71V67803S166BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67803S166BG is usually 5 days.
3.What payment methods are accepted for 71V67803S166BG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V67803S166BG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V67803S166BG?
71V67803S166BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V67803S166BG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V67803S166BG?
For technical support, including 71V67803S166BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67803S166BG requirements.
6.How does Aetrix verify that 71V67803S166BG is sourced from the original manufacturer or authorized distributors?
All 71V67803S166BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67803S166BG meets industry standards.
7.What is the process for return or replacement of 71V67803S166BG?
All 71V67803S166BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V67803S166BG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67803S166BG part is unused and in its original packaging.
Return procedure for 71V67803S166BG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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