Renesas 71V67803S166PFGI8
- Part No.:
- 71V67803S166PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V67803S166PFGI8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,625
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Product details
Overview
71V67803S166PFGI8 from IDT (now Renesas) is a 512K × 18-bit, 3.3V synchronous SRAM with pipelined outputs, single-cycle deselect, and 166MHz clock operation (3.5ns access). It supports linear/interleaved burst modes via LBO input, features global and byte-level write control (GW/BWE/BW1–BW2), and operates across industrial temperature range (−40°C to +85°C) in a 100-pin TQFP package. It targets high-speed cache and buffer applications in networking line cards.
For engineers reviewing the 71V67803S166PFGI8 datasheet, 71V67803S166PFGI8 pinout, 71V67803S166PFGI8 application, or 71V67803S166PFGI8 equivalent, key selection criteria include burst timing compliance, ZZ-controlled sleep mode current (≤70mA), 3.3V I/O supply (VDDQ) tolerance, and compatibility with ADSP/ADSC address status protocols in cache-coherent systems.
Technical Context
This SRAM implements a synchronous, clock-driven architecture with registered address, data, and control inputs. Its internal burst counter advances on ADV=LOW and selects sequence order (linear vs. interleaved) based on static LBO state-no runtime reconfiguration. The self-timed write cycle resolves write decisions at the end of the clock cycle, decoupling setup timing from write completion.
Pipelined output staging delivers first valid data one clock cycle after address latch, enabling continuous burst reads at full speed. Deselect occurs in a single CLK cycle when CE/CS0/CS1 transition to inactive states, minimizing bus turnaround latency in multi-device memory subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18-bit (99,328 words × 18 bits); supports 18-bit data bus width without external multiplexing. |
| Max Clock Frequency | 166MHz - enables 6ns clock cycle time for sustained burst throughput in high-bandwidth packet buffering. |
| Access Time | 3.5ns clock-to-data (tCD) - guarantees pipelined output validity by next rising edge, critical for zero-wait-state CPU interfaces. |
| VDD / VDDQ | 3.3V ±5% core and I/O supplies - requires single 3.3V rail with separate VDDQ decoupling for signal integrity. |
| Operating Temperature | −40°C to +85°C - qualified for industrial-grade embedded systems including telecom base station control planes. |
| Sleep Current (IZZ) | ≤70mA at VDD=3.465V - low-power retention mode activated asynchronously via ZZ=HIGH, reducing system standby power. |
| Burst Mode Control | LBO pin selects linear or interleaved 4-word burst sequence - determines address wrap behavior for cache line fills. |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin plastic quad flatpack (TQFP), 14mm × 20mm body, 0.5mm pitch. Pin 1 marked by corner notch; top-side marking includes "71V67803S166PFGI8" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus for 512K-word addressing; latched synchronously on rising CLK with ADSP/ADSC assertion. |
| CLK | System Clock Input | Primary timing reference; all synchronous operations (read/write/burst advance) edge-triggered on rising edge. |
| ADSP / ADSC | Address Status Inputs | ADSP (processor) and ADSC (cache controller) signals load address register; gated by CE for selective activation. |
| ADV | Burst Address Advance | Active-LOW signal that increments internal burst counter; held HIGH to suspend burst and repeat current address. |
| GW / BWE / BW1–BW2 | Write Control Inputs | GW enables full 18-bit write; BWE enables byte write mode; BW1/BW2 select lower/upper 9-bit bytes (BW3/BW4 not used on 71V67803). |
| I/O0–I/O17 | Data I/O | 18-bit bidirectional data bus; registered input/output paths ensure deterministic timing alignment with CLK. |
| ZZ | Sleep Mode Input | Asynchronous HIGH-active signal that gates internal CLK and reduces IDD to ≤70mA while retaining data. |
| VDD / VDDQ / VSS | Power & Ground | VDD = 3.3V core supply; VDDQ = 3.3V I/O supply (separate decoupling required); VSS = common ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Outputs | First burst word appears on I/O pins one clock cycle after address latch, enabling back-to-back read cycles without dead time. |
| Single-Cycle Deselect | Device enters high-Z tri-state within one CLK period upon CE/CS0/CS1 deactivation, minimizing bus contention in shared-memory systems. |
| Self-Timed Write Cycle | Write decision finalized at end of clock cycle, relaxing setup timing constraints for GW/BWE/BWx relative to CLK edge. |
| Linear/Interleaved Burst Selection | LBO pin statically configures burst address sequence (e.g., 0x00→0x01→0x02→0x03 vs. 0x00→0x02→0x01→0x03), matching processor/cache controller expectations. |
| Industrial Temperature Range | Guaranteed operation from −40°C to +85°C with full AC/DC specifications, supporting deployment in uncontrolled environments like outdoor base stations. |
Applications
| Packet Buffer Memory | Cache Tag Storage |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-speed 18-bit SRAM providing sub-4ns read access to support wire-speed lookup pipelines. Use Value: Pipelined burst reads deliver four consecutive header words per address, aligning with 64-byte cache line size and eliminating inter-cycle gaps. | Use Scenario: Holding tag RAM entries for associative caches in network processors or FPGA-based accelerators. IC Role / Device Role / Timing Role: Synchronous tag store interfaced directly to cache controller's ADSP/ADSC handshake protocol. Use Value: Single-cycle deselect allows rapid tag array switching between instruction/data caches without bus arbitration delay. |
| Real-Time Control FIFO | Video Frame Buffer Interface |
Use Scenario: Implementing configurable-depth FIFOs for deterministic latency control in motor drive or PLC I/O modules. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as ping-pong buffer with external logic managing ADV and OE for flow control. Use Value: ZZ sleep mode reduces idle power to ≤70mA, extending thermal margin in sealed industrial enclosures. | Use Scenario: Supporting pixel data buffering between image sensor interface and video processing ASIC in broadcast equipment. IC Role / Device Role / Timing Role: 166MHz burst-mode SRAM supplying 18-bit parallel pixel streams synchronized to pixel clock domain. Use Value: 3.3V I/O (VDDQ) ensures clean signal integrity with LVCMOS receivers, minimizing jitter in high-resolution timing-critical video paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1372KV18 | 256K × 36 organization; supports 3.3V I/O but uses different burst control (BWS# instead of ADV/LBO); no ZZ sleep mode. | Requires wider data bus (36-bit) and lacks asynchronous power-down; better suited for legacy 36-bit cache designs. | Select only if 36-bit width and absence of sleep mode are acceptable; verify ADSP/ADSC timing compatibility. |
| AS7C3256B | Asynchronous SRAM (no CLK, ADV, ADSP); 32K × 8 organization; 55ns access; no burst or pipelining. | Cannot replace synchronous burst functionality; limited to low-speed control-plane storage where timing predictability is secondary. | Use only for non-critical configuration storage; not viable for packet buffering or cache tag roles requiring 166MHz throughput. |
Compared with CY7C1372KV18 and AS7C3256B, the 71V67803S166PFGI8 uniquely combines 166MHz burst capability, pipelined output staging, and ZZ-controlled sleep mode in a 512K×18 configuration-making it irreplaceable for high-throughput, low-latency industrial memory subsystems requiring deterministic timing and power management.
Availability
71V67803S166PFGI8 is available at Aetrix Electronics and suitable for packet buffering, cache tag storage, and real-time control FIFO applications requiring stable component supply, long-term industrial temperature qualification, and guaranteed 166MHz burst performance.
Supply support for 71V67803S166PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology, IDT) is a global semiconductor leader specializing in high-performance memory, timing, and analog solutions for communications, computing, and industrial markets.
The 71V67803S166PFGI8 belongs to IDT's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-oriented memory subsystems in networking infrastructure and real-time embedded control applications.
FAQ
What is the maximum supported clock frequency for the 71V67803S166PFGI8?
The 71V67803S166PFGI8 is rated for 166MHz operation with a minimum clock cycle time (tCYC) of 6ns. At this frequency, it achieves 3.5ns clock-to-data (tCD) access time under commercial conditions. Performance is guaranteed across the full industrial temperature range (−40°C to +85°C) with appropriate 3.3V ±5% supply regulation and layout adherence to AC timing constraints.
Does the 71V67803S166PFGI8 support both linear and interleaved burst modes?
Yes, the 71V67803S166PFGI8 supports both linear and interleaved burst sequences via the LBO (Linear Burst Order) pin. When LBO is driven LOW, the device executes linear bursts (e.g., addresses 0x00→0x01→0x02→0x03); when LBO is HIGH, it performs interleaved bursts (e.g., 0x00→0x02→0x01→0x03). LBO is a static input and must remain stable during active operation.
What is the function of the ZZ pin on the 71V67803S166PFGI8?
The ZZ pin on the 71V67803S166PFGI8 is an asynchronous sleep mode input. When asserted HIGH, ZZ gates the internal clock and places the device into full sleep mode, reducing supply current to ≤70mA while maintaining data retention. Recovery time (tZZR) is guaranteed at 100ns, and ZZ must be held HIGH for at least tZZPW (100ns) to enter sleep reliably.
How many byte write enable signals does the 71V67803S166PFGI8 support?
The 71V67803S166PFGI8 supports two byte write enable signals: BW1 and BW2. BW1 controls the lower 9-bit byte (I/O0–I/O8), and BW2 controls the upper 9-bit byte (I/O9–I/O17). Unlike the 71V67603 variant, BW3 and BW4 are not applicable to the 71V67803S166PFGI8 due to its 512K×18 organization.
Is the 71V67803S166PFGI8 compatible with 3.3V-only system designs?
Yes, the 71V67803S166PFGI8 is fully compatible with 3.3V-only systems. It requires VDD = 3.3V ±5% for core logic and VDDQ = 3.3V ±5% for I/O drivers, with separate decoupling recommended. All input thresholds (VIH/VIL) and output drive levels (VOH/VOL) are specified for 3.3V operation, and no 5V-tolerant signaling is supported.
71V67803S166PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V67803S166PFGI8 FAQ
1.How can I place an order for 71V67803S166PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67803S166PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V67803S166PFGI8 reliable?
The price and inventory of 71V67803S166PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67803S166PFGI8 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V67803S166PFGI8?
For technical support, including 71V67803S166PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67803S166PFGI8 requirements.
6.How does Aetrix verify that 71V67803S166PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V67803S166PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67803S166PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V67803S166PFGI8?
All 71V67803S166PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67803S166PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67803S166PFGI8 part is unused and in its original packaging.
Return procedure for 71V67803S166PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67803S166PFGI8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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