Renesas 71V67903S75BQ
- Part No.:
- 71V67903S75BQ
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V67903S75BQ.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V67903S75BQ from IDT (now Renesas) is a 512K × 18-bit, 3.3V synchronous SRAM with flow-through outputs, single-cycle deselect, and 7.5ns access time at up to 117MHz clock frequency. It supports linear/interleaved burst modes via LBO input, self-timed write with global/byte write controls, and operates across industrial temperature range (–40°C to +85°C). Used in high-bandwidth packet buffering and cache subsystems requiring deterministic timing.
For engineers reviewing the 71V67903S75BQ datasheet, 71V67903S75BQ pinout, 71V67903S75BQ application, or 71V67903S75BQ equivalent, key selection criteria include burst address sequencing behavior, ZZ-controlled sleep mode current (≤70mA), 100-pin TQFP package compatibility, and absence of BW3/BW4 pins per datasheet Note 1 - critical for PCB layout and timing validation.
Technical Context
This SRAM implements a synchronous, clock-driven architecture with registered address/data inputs and flow-through (unregistered) outputs - enabling zero-latency data delivery on the same clock edge as address latching. Burst operation is initiated by ADSP/ADSC low and ADV low, with internal binary counter generating four consecutive addresses based on LBO state.
Write control uses hierarchical enable logic: GW overrides BWE, and BWE gates BW1–BW4 (though BW3/BW4 are not applicable for 71V67903). Power management includes asynchronous ZZ input that gates CLK internally, reducing supply current to ≤70mA in full sleep mode while guaranteeing data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18-bit (9Mbit); configured as 18-bit wide data bus for high-throughput memory mapping |
| Access Time | 7.5ns max - enables 117MHz system clock interfacing with guaranteed tCD timing |
| Supply Voltages | VDD = 3.3V ±5% (core), VDDQ = 3.3V ±5% (I/O) - requires dual-rail 3.3V regulation |
| Burst Mode | Linear or interleaved 4-word burst via LBO pin - determines address sequence order for cache-line fills |
| Sleep Current | IZZ ≤ 70mA at VDD = max - enables low-power idle states without data loss |
| Operating Temperature | –40°C to +85°C - qualified for industrial embedded systems with thermal cycling |
| Package | JEDEC-standard 100-pin TQFP (14mm × 20mm) - surface-mount compatible with standard reflow profiles |
Pinout & Package
71V67903S75BQ is packaged in a JEDEC-standard 100-pin thin plastic quad flatpack (TQFP), 14mm × 20mm body size, with 0.5mm lead pitch. Pin 1 marked by corner notch; pin numbering follows standard counter-clockwise convention from top-left.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; A0/A1 determine burst word order per LBO setting |
| CLK | Clock Input | Single-ended system clock reference; all synchronous inputs timed to rising edge |
| CE, CS0, CS1 | Chip Enable/Select | Three-level chip select hierarchy (CE active-low, CS0 active-high, CS1 active-low) |
| GW, BWE, BW1–BW2 | Write Control | Global write (GW), byte write enable (BWE), and two 9-bit byte selects (BW1, BW2); BW3/BW4 not connected per datasheet Note 1 |
| ADV, ADSP, ADSC | Burst Address Control | ADV advances internal burst counter; ADSP/ADSC load initial address register synchronously |
| LBO | Burst Order Select | Asynchronous static input: LBO = LOW → linear burst; LBO = HIGH → interleaved burst |
| ZZ | Sleep Mode Input | Asynchronous high-active signal that gates internal clock and reduces IDD to IZZ level |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O | 18-bit bidirectional data bus + 2 parity bits; flow-through output path eliminates output register delay |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Zero-cycle output latency: data appears on I/O pins within tCD (≤7.5ns) after CLK rise, eliminating pipeline stalls |
| Single-cycle deselect | Device enters high-Z state on I/Os within one clock cycle after CE/CS deassertion - prevents bus contention during rapid switching |
| Self-timed write cycle | Internal timing logic resolves write completion without external wait-state generation, simplifying controller interface |
| Configurable burst addressing | LBO pin selects linear (00→01→10→11) or interleaved (00→01→11→10) 4-word sequences - matches CPU/cache line ordering requirements |
| Industrial-grade power management | ZZ sleep mode draws ≤70mA while retaining data - enables dynamic power scaling in network processors and baseband ICs |
Applications
| Network Packet Buffering | High-Speed Cache Controller Interface |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decision and egress scheduling. IC Role / Device Role / Timing Role: Primary buffer SRAM providing deterministic 7.5ns read access and burst-aligned writes to match MAC/PHY DMA engines. Use Value: Single-cycle deselect and flow-through outputs eliminate inter-packet guard bands, increasing effective throughput by up to 12% vs registered-output SRAMs. |
Use Scenario: Serving as L2 cache tag/data array in multi-core SoCs where CPU clusters require low-latency, burst-capable memory access. IC Role / Device Role / Timing Role: Synchronous burst SRAM interfaced directly to cache controller's ADSP/ADV signals for cache-line fill operations. Use Value: Linear/interleaved burst mode selection via LBO allows alignment with ARM Cortex-A or RISC-V cache line layouts without glue logic. |
| Telecom Baseband Processing | Industrial Real-Time Control Buffering |
Use Scenario: Temporary storage of OFDM symbol buffers in LTE/5G baseband units during FFT/IFFT processing pipelines. IC Role / Device Role / Timing Role: High-reliability SRAM operating at –40°C to +85°C, synchronized to FPGA-based DSP clock domain. Use Value: ZZ sleep mode enables power-gating between symbol bursts, reducing average power by >40% in discontinuous transmission (DTX) modes. |
Use Scenario: Holding motion-control trajectory data in CNC controllers where jitter-free memory access ensures sub-microsecond servo loop timing. IC Role / Device Role / Timing Role: Deterministic 7.5ns access SRAM used for dual-port-like read/write isolation via CE/ADV timing control. Use Value: tCD ≤ 7.5ns and tCLZ = 0ns guarantee worst-case output activation within one clock cycle - critical for <1µs position update deadlines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1315KV18-75BZXI | Same 512K×18 organization, 75MHz max (8.5ns), but uses QDR-II+ interface with separate read/write clocks | Requires dual-clock domain design; incompatible with single-clock ADSP/ADV control scheme | Select only if migrating to QDR architecture; not drop-in for 71V67903S75BQ's flow-through timing model |
| AS7C35128P-75BIN | 512K×18, 7.5ns, but asynchronous control (no CLK, ADSP, ADV); no burst mode or ZZ sleep | Lacks burst addressing and power-down capability - unsuitable for cache-line or low-power applications | Use only in legacy designs requiring simple async SRAM interface; no timing or feature compatibility |
Compared with CY7C1315KV18-75BZXI and AS7C35128P-75BIN, the 71V67903S75BQ uniquely combines single-clock synchronous burst operation, flow-through outputs, and ZZ-controlled sleep - making it irreplaceable in deterministic real-time buffering where clock-domain bridging or power gating is required.
Availability
71V67903S75BQ is available at Aetrix Electronics and suitable for network packet buffering, high-speed cache controller interfaces, and telecom baseband processing requiring stable component supply across extended industrial temperature ranges.
Supply support for 71V67903S75BQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in high-performance memory, microcontrollers, and analog/power solutions for industrial, automotive, and communications markets.
The 71V67903S75BQ belongs to IDT's high-speed synchronous SRAM product line, designed specifically for deterministic, low-latency memory subsystems in networking, baseband, and real-time control applications demanding burst-mode efficiency and industrial reliability.
FAQ
What is the maximum clock frequency supported by the 71V67903S75BQ?
The 71V67903S75BQ supports up to 117MHz clock frequency when operating at its 7.5ns access time rating. This is validated under commercial and industrial temperature conditions with VDD and VDDQ at 3.3V ±5%. The device maintains timing compliance across the full –40°C to +85°C range, with AC parameters including tCYC ≥ 8.5ns and tCD ≤ 7.5ns.
Does the 71V67903S75BQ support both linear and interleaved burst modes?
Yes, the 71V67903S75BQ supports both linear and interleaved burst modes via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, the internal burst counter follows linear sequence (00→01→10→11); when LBO is HIGH, it follows interleaved sequence (00→01→11→10). LBO is asynchronous and must remain static during burst operation.
Are BW3 and BW4 pins functional on the 71V67903S75BQ?
No, BW3 and BW4 are not applicable for the 71V67903S75BQ, as explicitly stated in the datasheet Note 1 under Pin Description Summary. The 71V67903S75BQ implements only BW1 and BW2 for 9-bit byte write control of the 18-bit data bus. Pins designated BW3/BW4 in the 100-pin TQFP footprint are NC (no-connect) for this variant.
What is the power consumption of the 71V67903S75BQ in sleep mode?
In full sleep mode (ZZ = HIGH), the 71V67903S75BQ draws ≤70mA of supply current (IZZ) at maximum VDD, as specified in the AC Electrical Characteristics table for industrial temperature grade. This current level guarantees data retention and enables rapid wake-up (<100ns tZZR) without requiring initialization or refresh.
Which package does the 71V67903S75BQ use, and what are its key mechanical features?
The 71V67903S75BQ uses a JEDEC-standard 100-pin thin plastic quad flatpack (TQFP) package, measuring 14mm × 20mm with 0.5mm lead pitch. It features exposed pad-less construction, standard gull-wing leads, and is compatible with IPC-7351B footprint guidelines. Pin 1 is identified by a corner notch, and the package is rated for industrial reflow profiles per J-STD-020.
71V67903S75BQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 117 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V67903S75BQ FAQ
1.How can I place an order for 71V67903S75BQ through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67903S75BQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V67903S75BQ reliable?
The price and inventory of 71V67903S75BQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67903S75BQ is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V67903S75BQ?
For technical support, including 71V67903S75BQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67903S75BQ requirements.
6.How does Aetrix verify that 71V67903S75BQ is sourced from the original manufacturer or authorized distributors?
All 71V67903S75BQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67903S75BQ meets industry standards.
7.What is the process for return or replacement of 71V67903S75BQ?
All 71V67903S75BQ units undergo pre-shipment inspection (PSI). If there is an issue with 71V67903S75BQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67903S75BQ part is unused and in its original packaging.
Return procedure for 71V67903S75BQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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