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Renesas 71V67903S80BQ8

Part No.:
71V67903S80BQ8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V67903S80BQ8.pdf
Description:
IC SRAM 9MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,037

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Product details

Overview

71V67903S80BQ8 from IDT (now Renesas) is a 512K × 18-bit, 3.3V synchronous SRAM with flow-through outputs, single-cycle deselect, and burst-mode capability. It supports 8.0 ns access time at up to 100 MHz clock frequency, operates across industrial temperature range (–40°C to +85°C), and uses JEDEC-standard 100-pin TQFP packaging. It serves as high-speed buffer/cache memory in network packet processors and telecom line cards.

For engineers reviewing the 71V67903S80BQ8 datasheet, 71V67903S80BQ8 pinout, 71V67903S80BQ8 application, or 71V67903S80BQ8 equivalent, key selection criteria include burst order control via LBO, self-timed write with GW/BWE/BWx, flow-through output timing, ZZ-controlled sleep mode, and compatibility with 3.3V I/O systems requiring deterministic read latency.

Technical Context

The 71V67903S80BQ8 implements a synchronous, clock-driven architecture with registered address, control, and data inputs, but unregistered (flow-through) data outputs-enabling predictable tCD timing without output register delay. Its internal burst counter generates four sequential addresses per ADV assertion, with ordering determined by the static LBO pin state (linear vs. interleaved).

Burst writes and reads are controlled synchronously via ADSP/ADSC, CE, CS0/CS1, and ADV; OE remains asynchronous for fast output disable. Write operations support global (GW) or byte-level (BW1–BW2 only-BW3/BW4 are not applicable per datasheet note) enable, with BWE gating byte write enables and GW overriding them.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization512K × 18-bit (983,040 bits); configured as 18-bit wide data bus for compact high-bandwidth storage
Access Time / Max Frequency8.0 ns access time; supports up to 100 MHz system clock - enables 400 MB/s peak throughput in burst mode
Supply VoltagesVDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate supplies allow I/O voltage domain isolation
Operating Temperature–40°C to +85°C (industrial grade); validated for sustained operation in telecom infrastructure environments
Power ConsumptionISB1 = 70 mA standby (deselected), IDD = 230 mA active (100 MHz), IZZ = 70 mA sleep mode - low-power retention during idle cycles
Burst ModeFour-word burst per address; LBO pin selects linear or interleaved sequence - critical for cache-line alignment in RISC processors
Output ArchitectureFlow-through (no output register); tCD = 8.0 ns max from CLK↑ to valid data - eliminates output skew in timing-critical pipelines

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout optimized for signal integrity: dedicated VSS/VDDQ pairs adjacent to I/O banks, separated power/ground planes, and NC pins placed for routing flexibility.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit synchronous address bus; latched on rising CLK edge when ADSP or ADSC is asserted low with CE low
CE, CS0, CS1Chip Enable / SelectsThree-level decode (CE LOW + CS0 HIGH + CS1 LOW) enables device; allows multi-chip memory expansion
GW, BWE, BW1–BW2Write Control InputsGW enables full 18-bit write; BWE gates BW1/BW2; BW1 controls I/O0–I/O8/I/OP1, BW2 controls I/O9–I/O17/I/OP2 - no BW3/BW4 support per datasheet
CLK, ADV, ADSP, ADSCBurst Timing ControlsCLK drives all registers; ADV advances internal burst counter; ADSP/ADSC load address register - supports processor- or cache-controller-initiated bursts
LBO, ZZ, OEConfiguration & Output ControlLBO (asynchronous) selects burst order; ZZ (asynchronous HIGH) forces sleep mode; OE (asynchronous LOW) enables flow-through outputs
I/O0–I/O17, I/OP1–I/OP2Data I/O18 data bits + 2 parity bits; synchronous input path, flow-through output path - ensures deterministic read-to-read timing

Key Features

FeatureDesign Value
Flow-through output architectureEliminates output register delay, guaranteeing tCD ≤ 8.0 ns - essential for zero-wait-state CPU interfaces
Single-cycle deselectDevice enters high-Z output state within one CLK cycle after deselection - prevents bus contention in multi-SRAM systems
Self-timed write cycleInternal timing logic completes write without external wait-state generation - simplifies controller design and improves throughput
Asynchronous ZZ sleep modeReduces supply current to 70 mA while retaining data - enables dynamic power gating in burst-idle intervals
Linear/interleaved burst order selectionLBO pin statically configures burst address sequence to match processor cache-line mapping (e.g., MIPS vs. PowerPC)

Applications

Network Packet BufferTelecom Line Card Cache

Use Scenario: Storing ingress/egress packet headers and metadata in 10Gbps Ethernet switch ASICs.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with deterministic 8.0 ns read access.

Use Value: Enables line-rate packet classification by delivering burst-aligned header data to lookup engines within fixed clock cycles.

Use Scenario: Serving as instruction/data cache for DSP-based channelized TDM framer in optical transport equipment.

IC Role / Device Role / Timing Role: Synchronous SRAM providing burst-mode code fetch and context-switch storage for multi-channel framing logic.

Use Value: Reduces average instruction fetch latency by 4× via linear burst, improving framer channel density and jitter tolerance.

Industrial PLC Motion ControllerRadar Signal Processing FIFO

Use Scenario: Holding real-time servo position setpoints and encoder feedback in deterministic motion control loops.

IC Role / Device Role / Timing Role: Deterministic-access SRAM buffering interpolated trajectory points between FPGA interpolator and motor driver interface.

Use Value: Guarantees sub-microsecond read latency (tCD ≤ 8.0 ns) for closed-loop timing, enabling <1 µs jitter in position update cycles.

Use Scenario: Acting as ping-pong FIFO for ADC sample streaming in automotive radar front-end SoCs.

IC Role / Device Role / Timing Role: Flow-through SRAM capturing high-speed ADC samples with precise clock-aligned readout for FFT preprocessing.

Use Value: Eliminates output register metastability risk and provides glitch-free sample handoff between sampling and processing domains.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1315KV18-100BZXI1M × 18-bit, 100 MHz, 165-ball fBGA; no LBO pin; fixed interleaved burst onlyLacks linear burst mode and TQFP option; requires PCB redesign for BGAChoose when higher density and BGA footprint are acceptable and burst order is fixed
AS7C331024B-10BIN1M × 18-bit, 100 MHz, 100-pin TQFP; asynchronous OE; no ADV/ADSP/ADSC interfaceMissing burst-address advance and cache-controller interface signals - limited to simple controller useChoose for cost-sensitive non-burst applications where ADV/ADSC functionality is unused

Compared with CY7C1315KV18-100BZXI and AS7C331024B-10BIN, the 71V67903S80BQ8 uniquely supports both linear and interleaved burst modes via LBO, retains full cache-controller interface (ADSP/ADSC/ADV), and delivers identical 8.0 ns timing in the same 100-pin TQFP package - making it optimal for upgrade paths in legacy designs.

Availability

71V67903S80BQ8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, and industrial motion control applications requiring stable component supply, long-term lifecycle support, and industrial-grade temperature performance.

Supply support for 71V67903S80BQ8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and communications markets.

The 71V67903S80BQ8 belongs to IDT's high-performance synchronous SRAM product line, designed specifically for low-latency, burst-capable memory subsystems in networking, telecom, and real-time control systems.

FAQ

What memory organization does the 71V67903S80BQ8 implement?

The 71V67903S80BQ8 implements a 512K × 18-bit organization (983,040 total bits), configured as an 18-bit-wide data bus with parity bits I/OP1 and I/OP2. This differs from the 256K × 36 variant (71V67703) and is optimized for systems requiring narrower, higher-frequency data paths. The 71V67903S80BQ8 uses A0–A17 for addressing and supports burst sequences of four consecutive 18-bit words.

Does the 71V67903S80BQ8 support byte write functionality, and which byte lanes are active?

Yes, the 71V67903S80BQ8 supports byte write control via BW1 and BW2, with BWE enabling their function. BW1 controls I/O0–I/O8 and I/OP1 (9 bits), and BW2 controls I/O9–I/OP2 (9 bits). Per datasheet note, BW3 and BW4 are not applicable for the 71V67903S80BQ8 - unlike the 71V67703 variant - making its byte-write granularity strictly dual-9-bit.

What is the role of the LBO pin on the 71V67903S80BQ8, and how does it affect burst behavior?

The LBO (Linear Burst Order) pin on the 71V67903S80BQ8 is an asynchronous static input that selects burst address sequencing: LBO = LOW enables linear order (0,1,2,3), while LBO = HIGH enables interleaved order (0,2,1,3). The 71V67903S80BQ8 requires LBO to remain stable during operation; changing it mid-burst causes undefined behavior. This feature allows alignment with specific processor cache-line layouts.

How does the 71V67903S80BQ8 achieve single-cycle deselect, and why is this important?

The 71V67903S80BQ8 achieves single-cycle deselect by driving all I/O pins to high-impedance within one CLK cycle after chip disable (CE/CS0/CS1 deasserted). This is implemented via synchronous output disable logic tied directly to chip-select decoding - no additional latency. It prevents bus contention in multi-SRAM systems and simplifies glue logic in high-density memory subsystems using the 71V67903S80BQ8.

What power-saving modes does the 71V67903S80BQ8 support, and what is the sleep current?

The 71V67903S80BQ8 supports two low-power states: CMOS standby (ISB1 = 70 mA, device deselected) and full sleep mode (IZZ = 70 mA, ZZ = HIGH). In sleep mode, the internal clock is gated, core logic is halted, and data retention is guaranteed across –40°C to +85°C. Unlike standby, sleep mode eliminates dynamic switching current - critical for intermittent-operation systems using the 71V67903S80BQ8.

71V67903S80BQ8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V67903S80BQ8 FAQ

1.How can I place an order for 71V67903S80BQ8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V67903S80BQ8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V67903S80BQ8 reliable?

The price and inventory of 71V67903S80BQ8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67903S80BQ8 is usually 5 days.

3.What payment methods are accepted for 71V67903S80BQ8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V67903S80BQ8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V67903S80BQ8?

71V67903S80BQ8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V67903S80BQ8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V67903S80BQ8?

For technical support, including 71V67903S80BQ8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67903S80BQ8 requirements.

6.How does Aetrix verify that 71V67903S80BQ8 is sourced from the original manufacturer or authorized distributors?

All 71V67903S80BQ8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67903S80BQ8 meets industry standards.

7.What is the process for return or replacement of 71V67903S80BQ8?

All 71V67903S80BQ8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67903S80BQ8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V67903S80BQ8 part is unused and in its original packaging.

Return procedure for 71V67903S80BQ8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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