Renesas 71V67903S80BQI
- Part No.:
- 71V67903S80BQI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V67903S80BQI.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,840
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Product details
Overview
71V67903S80BQI from IDT (now Renesas) is a 512K × 18-bit, 3.3V synchronous SRAM with flow-through outputs, single-cycle deselect, and burst-mode operation. It supports 8.0 ns access time at up to 100 MHz clock frequency, operates across industrial temperature (–40°C to +85°C), and uses JEDEC-standard 100-pin TQFP packaging. It serves as high-speed buffer/cache memory in networking line cards and telecom baseband processors.
For engineers reviewing the 71V67903S80BQI datasheet, 71V67903S80BQI pinout, 71V67903S80BQI application, or 71V67903S80BQI equivalent, key selection criteria include burst order control via LBO, self-timed write with GW/BWE/BWx, flow-through output timing, ZZ sleep mode entry, and compatibility with 3.3V I/O systems requiring deterministic read latency.
Technical Context
The 71V67903S80BQI implements a synchronous, clock-driven architecture with registered address, control, and data inputs, but unregistered (flow-through) data outputs - enabling predictable tCD = 8.0 ns clock-to-data delay. Its internal burst counter advances on ADV low and selects linear or interleaved sequence per LBO state, supporting four-word bursts per address.
Write operations are fully synchronous and support global (GW) or byte-level (BW1–BW2) control; BWE gates BWx signals, and CE/CS0/CS1 jointly enable chip selection. The device enters low-power sleep mode asynchronously via ZZ high, reducing supply current to ≤70 mA while retaining data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18-bit (9Mbit); configured for 18-bit data bus width with A0–A18 addressing |
| Access Time / Max Frequency | 8.0 ns access time; supports up to 100 MHz system clock with tCYC = 10 ns |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains ensure signal integrity |
| Burst Mode | Linear or interleaved 4-word burst initiated by ADV low; LBO selects order statically before operation |
| Output Architecture | Flow-through (no output register); data appears at I/O pins within tCD = 8.0 ns of CLK rising edge |
| Power Management | ZZ input enables full sleep mode (IZZ ≤70 mA); asynchronous entry with guaranteed data retention |
| Temperature Range | Industrial grade: –40°C to +85°C; validated across full range for telecom and industrial control use |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 marked via corner notch; pin 14 is VSS-compatible (VIL < 0.8 V acceptable); pin 64 is NC and may float.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous address latching on rising CLK edge when ADSP/ADSC active; defines 512K-word space |
| CE, CS0, CS1 | Chip Enable / Selects | Three-input decode: CE low + CS0 high + CS1 low enables device; supports multi-chip memory banks |
| GW, BWE, BW1–BW2 | Write Control Inputs | GW enables full 18-bit write; BWE gates BW1/BW2; BW1 controls I/O0–I/O8/I/OP1, BW2 controls I/O9–I/O17/I/OP2 |
| ADV, LBO, ZZ | Burst & Power Control | ADV low initiates/advances burst; LBO static select (LOW = linear, HIGH = interleaved); ZZ high forces sleep mode |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O | 18-bit bidirectional data bus + 2 parity bits; flow-through outputs disable during write or OE high |
| CLK, OE, ADSP, ADSC | Timing & Interface Control | CLK drives all synchronous registers; OE asynchronously disables outputs; ADSP/ADSC load address register on falling edge |
Key Features
| Feature | Design Value |
|---|---|
| Single-cycle deselect | Device transitions to high-Z output state within one CLK cycle after deselection, minimizing bus contention in multi-SRAM systems |
| Self-timed write cycle | Internal timing logic eliminates external write pulse generation; GW or BWx assertion on CLK edge triggers complete write internally |
| Flow-through output architecture | Zero-output-register latency ensures tCD = 8.0 ns is purely propagation delay - critical for real-time DSP buffering |
| Asynchronous sleep mode (ZZ) | ZZ high immediately gates internal clock and reduces IDD to ≤70 mA without requiring clock stop or state save |
| Configurable burst order | LBO pin statically selects linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence - matches CPU cache line layouts |
Applications
| Baseband Processing | Network Packet Buffering |
|---|---|
Use Scenario: Real-time channelization and modulation/demodulation in 4G/LTE base stations. IC Role / Device Role / Timing Role: High-bandwidth, low-latency data buffer between FPGA-based signal processors and ADC/DAC interfaces. Use Value: 8.0 ns tCD and flow-through outputs enable deterministic sample-to-output timing; 100 MHz burst reads sustain >1.4 Gbps sustained throughput. | Use Scenario: Temporary storage of variable-length Ethernet/IP packets in switching ASICs. IC Role / Device Role / Timing Role: Dual-port-accessible packet memory supporting concurrent ingress/egress traffic with zero-cycle deselect. Use Value: Single-cycle deselect prevents bus turnaround delays; 512K×18 organization maps efficiently to 128-byte packet descriptors with parity. |
| Industrial PLC Motion Control | Radar Signal Preprocessing |
Use Scenario: Interpolation table storage and real-time trajectory calculation in CNC motion controllers. IC Role / Device Role / Timing Role: Deterministic-access lookup table memory synchronized to servo loop clock (≤100 MHz). Use Value: Industrial temp rating (–40°C to +85°C) and ZZ sleep mode support unattended operation in harsh enclosures with thermal cycling. | Use Scenario: Chirp storage and FFT window buffering in automotive radar front-ends. IC Role / Device Role / Timing Role: Low-jitter, burst-capable memory feeding pipeline FFT engines with precise clock-aligned data delivery. Use Value: Linear burst mode (LBO = LOW) delivers consecutive chirp samples in natural order; tCD = 8.0 ns enables sub-10 ns timing closure in 100 MHz radar clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1372D-100AXC | 512K × 18, 100 MHz, 3.3V, but uses QCC (PLCC) package; no ZZ sleep mode; tCD = 10 ns | Lacks asynchronous sleep mode; requires external power management; slower access limits real-time DSP use | Select only if PLCC footprint is mandated and sleep mode is unnecessary |
| AS7C3512PFS-10BIN | 512K × 18, 100 MHz, 3.3V, TQFP-100, but no burst mode or LBO; flow-through outputs retained | No burst addressing - requires four separate read cycles for same data; higher software overhead in cache-like roles | Prefer when deterministic single-word access dominates and burst efficiency is not required |
Compared with CY7C1372D-100AXC and AS7C3512PFS-10BIN, the 71V67903S80BQI uniquely combines industrial temperature support, ZZ sleep mode, and configurable linear/interleaved burst - making it optimal for thermally constrained, power-aware, high-throughput embedded systems where deterministic multi-word access is essential.
Availability
71V67903S80BQI is available at Aetrix Electronics and suitable for baseband processing, network packet buffering, and industrial motion control applications requiring stable component supply, long-term lifecycle assurance, and industrial-grade reliability.
Supply support for 71V67903S80BQI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology, IDT) is a global semiconductor leader specializing in high-performance memory, timing, and interface solutions for communications, computing, and industrial markets.
The 71V67903S80BQI belongs to IDT's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-capable buffering in telecom infrastructure, test equipment, and real-time control systems demanding deterministic timing and industrial environmental resilience.
FAQ
What is the maximum operating frequency supported by the 71V67903S80BQI?
The 71V67903S80BQI supports up to 100 MHz clock frequency, corresponding to a minimum clock cycle time (tCYC) of 10 ns and an access time of 8.0 ns. This rating is guaranteed over the full industrial temperature range (–40°C to +85°C) with VDD and VDDQ at 3.3 V ±5%. Operation beyond 100 MHz is not characterized or supported.
Does the 71V67903S80BQI support both linear and interleaved burst modes?
Yes, the 71V67903S80BQI supports both linear and interleaved burst sequences via the LBO (Linear Burst Order) input. When LBO is driven LOW, the device executes linear burst order; when LBO is HIGH, it executes interleaved burst order. LBO is a static configuration pin and must remain stable during operation - it is not sampled dynamically.
How many byte-write enable signals does the 71V67903S80BQI provide?
The 71V67903S80BQI provides two individual byte-write enable inputs: BW1 and BW2. BW1 controls I/O0–I/O8 and I/OP1 (9 bits); BW2 controls I/O9–I/O17 and I/OP2 (9 bits). Per documentation, BW3 and BW4 are not applicable to the 71V67903S80BQI - they are reserved for the 256K × 36 variant (71V67703).
What is the function of the ZZ pin on the 71V67903S80BQI?
The ZZ pin on the 71V67903S80BQI is an asynchronous sleep mode input. When driven HIGH, it gates the internal clock and places the device into full sleep mode, reducing supply current to ≤70 mA while guaranteeing data retention. ZZ requires no setup/hold timing relative to CLK and can be asserted at any time - no prior deselection or sequencing is needed.
Is the 71V67903S80BQI pin-compatible with the 71V67703 series?
No, the 71V67903S80BQI is not pin-compatible with the 71V67703 series. While both share the same 100-pin TQFP package, pin functions differ significantly: the 71V67903S80BQI omits BW3/BW4 and repurposes several pins (e.g., A10–A18 mapping differs), and its 512K × 18 organization uses fewer address lines than the 256K × 36 variant. PCB layout must be designed specifically for the 71V67903S80BQI.
71V67903S80BQI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V67903S80BQI FAQ
1.How can I place an order for 71V67903S80BQI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V67903S80BQI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V67903S80BQI reliable?
The price and inventory of 71V67903S80BQI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67903S80BQI is usually 5 days.
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71V67903S80BQI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V67903S80BQI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V67903S80BQI?
For technical support, including 71V67903S80BQI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67903S80BQI requirements.
6.How does Aetrix verify that 71V67903S80BQI is sourced from the original manufacturer or authorized distributors?
All 71V67903S80BQI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67903S80BQI meets industry standards.
7.What is the process for return or replacement of 71V67903S80BQI?
All 71V67903S80BQI units undergo pre-shipment inspection (PSI). If there is an issue with 71V67903S80BQI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V67903S80BQI part is unused and in its original packaging.
Return procedure for 71V67903S80BQI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V67903S80BQI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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