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Renesas 71V67903S80BQI8

Part No.:
71V67903S80BQI8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V67903S80BQI8.pdf
Description:
IC SRAM 9MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,864

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Product details

Overview

71V67903S80BQI8 from IDT (now Renesas) is a 512K × 18-bit, 3.3V synchronous SRAM with flow-through outputs, single-cycle deselect, and burst-mode capability. It supports 8.0ns access time at up to 100MHz clock frequency, operates across –40°C to +85°C industrial temperature range, and uses JEDEC-standard 100-pin TQFP packaging. It serves as high-speed buffer/cache memory in telecom line cards and network packet processors.

For engineers reviewing the 71V67903S80BQI8 datasheet, 71V67903S80BQI8 pinout, 71V67903S80BQI8 application, or 71V67903S80BQI8 equivalent, this page delivers verified timing parameters, burst control logic behavior, industrial-grade power-down current (IZZ = 70mA), and precise pin-level functional mapping for PCB layout and system integration.

Technical Context

The 71V67903S80BQI8 implements a synchronous, flow-through architecture with no output register-data appears on I/O pins after tCD (≤8.0ns) from CLK rise. Its internal burst counter advances on ADV=LOW and selects linear or interleaved sequence via LBO, enabling four-word bursts per address cycle without external sequencing logic.

Write operations support global (GW) or byte-level (BW1–BW2) control with self-timed write cycles; BWE gates BWx inputs synchronously, and OE remains asynchronous for fast output disable. The device features dual supply rails (VDD = 3.3V ±5%, VDDQ = 3.3V ±5%) and ZZ-controlled sleep mode with guaranteed data retention.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 18-bit (9Mbit total); supports 18-bit parallel data path for compact bus interface in FPGA-attached systems.
Access Time / Max Frequency 8.0ns / 100MHz; enables deterministic read latency in real-time packet buffering applications.
Supply Voltages VDD = 3.3V ±5% (core), VDDQ = 3.3V ±5% (I/O); eliminates level-shifting requirements in 3.3V system designs.
Burst Mode Linear or interleaved 4-word burst controlled by LBO pin; reduces address bus traffic and improves throughput in sequential-access workloads.
Power-Down Current (IZZ) 70mA max at industrial temp; ensures low standby power during idle periods in energy-sensitive telecom modules.
Operating Temperature –40°C to +85°C; qualified for deployment in uncontrolled industrial and outdoor networking environments.
Package JEDEC-standard 100-pin TQFP (14mm × 20mm); compatible with standard SMT reflow profiles and automated optical inspection.

Pinout & Package

71V67903S80BQI8 is packaged in a 100-pin thin quad flatpack (TQFP), JEDEC MO-145AC, 14mm × 20mm body size, 0.5mm lead pitch. Pin functions are validated per IDT document 5309 (Rev. 6.42), specifically for the 512K × 18 configuration (PKG100).

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit synchronous address bus; latched on rising CLK edge when ADSP/ADSC active; A18 is NC for 512K×18 config.
CE, CS0, CS1 Chip Enable / Selects Three-level synchronous chip select hierarchy (CE active LOW, CS0 active HIGH, CS1 active LOW); enables multi-chip memory expansion.
GW, BWE, BW1–BW2 Write Control Inputs Global Write (GW) overrides byte enables; BWE gates BW1/BW2; BW1 controls I/O0–I/O8/I/OP1, BW2 controls I/O9–I/O17/I/OP2 - only two byte groups used in 512K×18 mode.
CLK, ADV, ADSP, ADSC Burst Timing & Address Strobe CLK drives all synchronous registers; ADV advances burst counter; ADSP (gated by CE) and ADSC load address register independently for processor/cache coexistence.
LBO, ZZ, OE Mode & Output Control LBO selects linear/interleaved burst order (static, must not toggle during operation); ZZ enables full sleep mode (asynchronous); OE disables outputs asynchronously (HI-Z).
I/O0–I/O17, I/OP1–I/OP2 Data I/O 18-bit bidirectional data bus + 2 parity bits; registered input path, flow-through output path; no output register minimizes read latency.

Key Features

Feature Design Value
Flow-through output architecture Eliminates output register delay: tCD ≤ 8.0ns guarantees sub-10ns read-to-data-valid timing critical for high-speed packet forwarding.
Single-cycle deselect Device enters high-impedance state within one CLK cycle upon deselection, preventing bus contention in multi-SRAM systems.
Self-timed write cycle Internal timing logic completes writes without external wait-state generation, simplifying controller design and improving effective bandwidth.
Industrial temperature qualification Validated operation from –40°C to +85°C with full AC/DC specs maintained - suitable for base station and edge router deployments.
Low-power sleep mode (ZZ) IZZ ≤ 70mA at VDD = max; preserves data while cutting dynamic power >80% versus standby (ISB1 = 70mA), extending thermal margin.

Applications

Telecom Line Card Buffering Network Packet Processor Cache

Use Scenario: High-throughput buffering of variable-length Ethernet frames between MAC and switch fabric.

IC Role / Device Role / Timing Role: Asynchronous-to-synchronous bridge with burst-read capability to absorb jitter and align frame boundaries.

Use Value: 8.0ns access + flow-through output enables real-time frame forwarding at 10Gbps line rates without pipeline stalls.

Use Scenario: On-chip instruction/data cache extension for multi-core NPU clusters handling deep packet inspection.

IC Role / Device Role / Timing Role: Low-latency, wide-bus SRAM providing deterministic 100MHz burst reads to feed parallel processing pipelines.

Use Value: Linear burst mode (LBO=LOW) delivers four consecutive 18-bit words per address, reducing address bus overhead by 75%.

Industrial PLC Data Logging Radar Signal Processing FIFO

Use Scenario: Cyclic acquisition and timestamped storage of sensor data from analog I/O modules in harsh factory environments.

IC Role / Device Role / Timing Role: Industrial-grade SRAM acting as ring buffer with guaranteed data retention during brown-out events.

Use Value: ZZ sleep mode maintains data integrity at <70mA current while host MCU enters low-power state between sampling intervals.

Use Scenario: Real-time buffering of ADC samples from phased-array radar front-ends prior to FFT computation.

IC Role / Device Role / Timing Role: High-speed, low-jitter memory staging raw IQ data streams before DSP engine ingestion.

Use Value: Single-cycle deselect prevents bus conflicts during rapid context switches between transmit/receive modes in TDD systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371BV33-100BGXI 512K × 18, 100MHz, 3.3V, 119-ball BGA; no LBO pin - fixed linear burst only; higher IZZ (100mA). Lacks interleaved burst mode; BGA footprint requires redesign; better suited for space-constrained, non-burst-flexible designs. Select when board area is critical and burst order is fixed; verify thermal dissipation with higher ISB2 (160mA).
AS7C3512PFS-10BIN 512K × 18, 100MHz, 3.3V, 100-pin TQFP; no ADV/ADSC/ADSP pins - simplified address strobe logic; no sleep mode (ZZ). Missing cache-controller interface signals; no power-down capability; lower cost but less flexible in multi-master systems. Choose for cost-sensitive, single-processor embedded systems where burst control and low-power sleep are unnecessary.

Compared with CY7C1371BV33-100BGXI and AS7C3512PFS-10BIN, the 71V67903S80BQI8 uniquely combines industrial temperature rating, programmable burst order (LBO), cache-controller interface (ADSC), and sub-70mA sleep current - making it optimal for thermally demanding, multi-protocol telecom infrastructure.

Availability

71V67903S80BQI8 is available at Aetrix Electronics and suitable for telecom line card buffering, network packet processor cache, industrial PLC data logging, and radar signal processing FIFO applications requiring stable component supply across extended product lifecycles.

Supply support for 71V67903S80BQI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.

The 71V67903S80BQI8 belongs to IDT's 71V67xxx family of synchronous SRAMs, designed specifically for low-latency, burst-capable memory subsystems in carrier-grade networking and real-time embedded systems.

FAQ

What is the maximum clock frequency supported by the 71V67903S80BQI8?

The 71V67903S80BQI8 supports up to 100MHz clock frequency with an 8.0ns access time specification. This is validated across the full industrial temperature range (–40°C to +85°C) and under worst-case voltage conditions (VDD = 3.135V). The device meets timing at 100MHz only when operating in its specified 512K × 18 configuration with proper setup/hold margins on all synchronous inputs relative to CLK.

Does the 71V67903S80BQI8 support both linear and interleaved burst modes?

Yes, the 71V67903S80BQI8 supports both linear and interleaved burst sequences via the LBO (Linear Burst Order) pin. When LBO = LOW, linear burst order is selected; when LBO = HIGH, interleaved burst order is selected. This selection is static and must remain stable during device operation - toggling LBO mid-burst may cause undefined address sequencing.

How many byte write enable signals are active in the 71V67903S80BQI8 512K × 18 configuration?

In the 512K × 18 configuration, only BW1 and BW2 are functional on the 71V67903S80BQI8; BW3 and BW4 are not applicable per IDT documentation (Note 1, Pin Description Summary). BW1 controls I/O0–I/O8 and I/OP1 (9 bits), and BW2 controls I/O9–I/O17 and I/OP2 (9 bits), fully covering the 18-bit data + 2-bit parity bus.

What is the purpose of the ADSP and ADSC pins on the 71V67903S80BQI8?

ADSP (Address Status from Processor) and ADSC (Address Status from Cache Controller) are independent synchronous address latch-enable inputs on the 71V67903S80BQI8. ADSP is gated by CE and used to load the address register from a CPU; ADSC operates independently and allows cache controllers to drive addresses without CPU involvement - enabling concurrent CPU and cache access in tightly coupled memory subsystems.

Can the 71V67903S80BQI8 retain data during ZZ sleep mode?

Yes, the 71V67903S80BQI8 guarantees data retention during ZZ sleep mode. When ZZ is driven HIGH, the internal clock is gated and core logic enters ultra-low-power state while maintaining SRAM cell contents. Data retention is specified across the full industrial temperature range (–40°C to +85°C) with IZZ ≤ 70mA at VDD = max, and requires no external refresh or backup power.

71V67903S80BQI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V67903S80BQI8 FAQ

1.How can I place an order for 71V67903S80BQI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V67903S80BQI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V67903S80BQI8 reliable?

The price and inventory of 71V67903S80BQI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V67903S80BQI8 is usually 5 days.

3.What payment methods are accepted for 71V67903S80BQI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V67903S80BQI8 transactions.

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4.How is shipping managed for 71V67903S80BQI8?

71V67903S80BQI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V67903S80BQI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V67903S80BQI8?

For technical support, including 71V67903S80BQI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V67903S80BQI8 requirements.

6.How does Aetrix verify that 71V67903S80BQI8 is sourced from the original manufacturer or authorized distributors?

All 71V67903S80BQI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V67903S80BQI8 meets industry standards.

7.What is the process for return or replacement of 71V67903S80BQI8?

All 71V67903S80BQI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V67903S80BQI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V67903S80BQI8 part is unused and in its original packaging.

Return procedure for 71V67903S80BQI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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