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Renesas 72225LB10TFG8
- Part No.:
- 72225LB10TFG8
- Manufacturer:
- Renesas
- Category:
- FIFOs Memory
- Package:
- 64-LQFP
- Datasheet:
-
72225LB10TFG8.pdf
- Description:
- IC FIFO SYNC 1KX18 6.5NS 64TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,367
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Product details
Overview
IDT72225LB10TFG8 from Integrated Device Technology is a 1,024 × 18-bit synchronous FIFO memory IC with dual-clock operation, 10 ns read/write cycle time, and industrial temperature support (–40°C to +85°C). It features programmable Almost-Empty/Almost-Full flags, Half-Full flag, and zero fall-through time architecture-used in LAN controllers, interprocessor communication, and optical disk interfaces.
For engineers reviewing the IDT72225LB10TFG8 datasheet, IDT72225LB10TFG8 pinout, IDT72225LB10TFG8 application, or IDT72225LB10TFG8 equivalent, key selection criteria include 18-bit data width, 10 ns timing grade, TQFP-64 package compatibility, and dual-port flag signaling for depth-expansible buffering in mixed-clock domain systems.
Technical Context
This device implements a dual-port, clocked RAM array with independent read/write pointers, offset-register-controlled programmable flags (PAE/PAF), and asynchronous flag assertion synchronized to respective clocks. Its dual-clock mode supports asynchronous WCLK/RCLK operation with skew tolerance (tSKEW1/tSKEW2 ≥ 5 ns).
The FIFO uses high-performance submicron CMOS technology and supports daisy-chain depth expansion via WXI/WXO and RXI/RXO pins. In single-device mode, FL, WXI, and RXI are grounded, enabling Half-Full flag (HF) output on WXO/HF pin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Depth × Width | 1,024 × 18-bit - provides 18.4 kbit buffer capacity for burst-mode data alignment between mismatched clock domains. |
| Cycle Time | 10 ns - enables up to 100 MHz clock frequency for high-throughput data streaming in real-time interfaces. |
| Supply Voltage | 4.5 V to 5.5 V - compatible with standard 5 V logic systems and tolerant of rail variation in industrial power environments. |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded systems requiring extended thermal reliability. |
| Flag Outputs | EF, FF, PAE, PAF, HF - five status signals enable precise buffer management without external monitoring logic. |
| Expansion Support | Daisy-chain depth expansion - allows stacking multiple IDT72225LB10TFG8 units to increase total depth while retaining 18-bit width. |
| Input/Output Enable | WEN/REN/OE control - enables selective write/read activation and tri-state output bus control for shared-bus applications. |
Pinout & Package
Package: 64-lead thin quad flatpack (TQFP/STQFP), order code TF, lead finish SnPb (EOL as of June 2018).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D0–D17 | Data Inputs | 18-bit parallel input bus accepting data on WCLK rising edge when WEN = LOW. |
| Q0–Q17 | Data Outputs | 18-bit parallel output bus driving data on RCLK rising edge when REN = LOW and OE = LOW. |
| WCLK, RCLK | Clock Inputs | Independent write/read clocks supporting coincident or asynchronous operation with defined skew margins. |
| WEN, REN, OE | Control Enables | Three separate enables allow granular control over write initiation, read initiation, and output bus drive state. |
| RS, LD, FL | Configuration Controls | Reset initializes pointers; Load enables offset register programming; First Load configures daisy-chain topology. |
| FF, EF, PAE, PAF, WXO/HF, RXO | Status & Expansion Outputs | Five flags provide real-time buffer occupancy state; WXO/HF and RXO support cascaded FIFO expansion. |
| VCC, GND | Power & Ground | Eight dedicated VCC and seven GND pins ensure stable power delivery and low-noise operation in high-speed switching. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-clock architecture | Enables seamless bridging between independent clock domains (e.g., CPU ↔ peripheral) without handshake logic. |
| Programmable Almost-Empty/Full offsets | Default 127-word offsets allow early flow control signaling before buffer exhaustion-critical for latency-sensitive protocols. |
| Half-Full flag (HF) | Provides mid-buffer occupancy signal in single-device mode, simplifying balanced read/write scheduling in streaming pipelines. |
| Zero fall-through time | Eliminates pipeline delay between write and subsequent read of same location-ensures deterministic latency for real-time buffers. |
| Daisy-chain expansion | WXI/WXO and RXI/RXO pins permit depth scaling across multiple devices without external glue logic or address decoding. |
Applications
| LAN Controller Buffering | Interprocessor Communication |
|---|---|
|
Use Scenario: Buffering packet payloads between Ethernet MAC and host processor with mismatched clock rates. IC Role / Device Role / Timing Role: Synchronous FIFO acting as elastic buffer to absorb jitter and rate differences between 25 MHz MAC clock and 50 MHz CPU bus. Use Value: Prevents packet loss during burst transfers by decoupling clock domains while maintaining 18-bit data path integrity. |
Use Scenario: Exchanging command/status messages between two microcontrollers operating at different frequencies. IC Role / Device Role / Timing Role: Dual-clock FIFO providing handshake-free data transfer with EF/FF flag signaling for autonomous read/write coordination. Use Value: Eliminates software polling overhead and reduces inter-core synchronization latency by 100% versus software-managed ring buffers. |
| Optical Disk Controller Interface | Digital Signal Processing Pipeline |
|
Use Scenario: Aligning sector data streams between CD/DVD read channel IC and DSP subsystem. IC Role / Device Role / Timing Role: 1,024-word depth FIFO absorbing variable-length servo bursts and fixed-length audio frames. Use Value: Maintains continuous data flow despite mechanical seek delays and rotational latency variations in disc rotation. |
Use Scenario: Feeding real-time ADC samples into a multi-stage FIR filter chain with pipeline stage rate mismatches. IC Role / Device Role / Timing Role: Clock-domain crossing buffer with PAE/PAF flags triggering DMA reloads before underflow/overflow. Use Value: Guarantees uninterrupted sample processing at 100 MSPS with <1 ns timing jitter introduced by the FIFO itself. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous FIFO applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72225LB15TFG8 | 15 ns cycle time (vs. 10 ns); lower max clock frequency (66.7 MHz vs. 100 MHz); identical pinout and feature set. | Suitable for cost-optimized designs where 100 MHz throughput is unnecessary; reduced power consumption at lower speed. | Select when system timing budget allows margin >5 ns per cycle and thermal/power constraints favor slower grade. |
| ON Semiconductor MC100EP129FA | ECL-based 1,024 × 18 FIFO; 3.3 V supply; faster access (2.8 ns tA) but requires negative voltage rails and level translation. | Used in ultra-low-latency telecom backplanes; incompatible with 5 V TTL logic without interface circuitry. | Choose only for ECL-system integration; not drop-in compatible due to voltage, logic family, and thermal requirements. |
Compared with IDT72225LB15TFG8 and MC100EP129FA, IDT72225LB10TFG8 delivers highest throughput in 5 V TTL systems with full pin and functional compatibility across the IDT722xxLB family, while avoiding ECL complexity and voltage translation overhead.
Availability
IDT72225LB10TFG8 is available at Aetrix Electronics and suitable for LAN controller design, interprocessor communication systems, and optical storage interfaces requiring stable component supply and long-term industrial temperature support.
Supply support for IDT72225LB10TFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, and high-speed interconnect solutions.
IDT72225LB10TFG8 belongs to the SyncFIFO™ family-designed specifically for deterministic, low-latency data buffering in mixed-clock-domain systems such as networking, storage, and industrial automation.
FAQ
What is the memory organization of the IDT72225LB10TFG8?
The IDT72225LB10TFG8 implements a 1,024 × 18-bit synchronous FIFO memory array, providing 18.4 kbit of buffer capacity. This configuration supports 18-bit parallel data paths and is optimized for applications requiring deep, clocked buffering between asynchronous subsystems. The IDT72225LB10TFG8 maintains this exact organization across all operating conditions and clock configurations.
Does the IDT72225LB10TFG8 support both single-clock and dual-clock operation?
Yes, the IDT72225LB10TFG8 supports both modes: RCLK can be tied to WCLK for single-clock operation, or run independently for true dual-clock buffering. Flag outputs (EF, FF, PAE, PAF) are synchronized to their respective clocks, and skew tolerances (tSKEW1/tSKEW2 ≥ 5 ns) ensure reliable status updates across clock boundaries. This behavior is intrinsic to the IDT72225LB10TFG8 architecture.
What are the default values for the programmable Almost-Empty and Almost-Full offsets in the IDT72225LB10TFG8?
The IDT72225LB10TFG8 defaults to 127-word offsets for both PAE and PAF after reset-meaning the Almost-Empty flag asserts when 127 words remain before empty, and the Almost-Full flag asserts when 127 words remain before full. These values are stored in dedicated 12-bit offset registers and can be reprogrammed via the LD/WEN/RCLK sequence. All IDT72225LB variants share this default.
Can the IDT72225LB10TFG8 be used in depth-expansion configurations?
Yes, the IDT72225LB10TFG8 supports daisy-chain depth expansion using WXI/WXO and RXI/RXO pins. In multi-device chains, FL is grounded on the first unit and HIGH on subsequent units. Each device retains its 18-bit width while aggregate depth scales linearly-e.g., two IDT72225LB10TFG8 units yield 2,048 × 18 capacity. Pin-level compatibility ensures no layout changes are needed.
Is the IDT72225LB10TFG8 still in active production?
The IDT72225LB10TFG8 uses SnPb lead finish and was marked End-of-Life (EOL) with Last Time Buy expiring June 15, 2018. However, Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle coordination support. RoHS-compliant alternatives exist within the IDT72Txx family, but IDT72225LB10TFG8 remains available for legacy industrial system repair and continuity programs.
72225LB10TFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- 7200
- Package/Case:
- 64-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Size:
- 18K (1K x 18)
- Function:
- Synchronous
- Data Rate:
- 100MHz
- Access Time:
- 6.5ns
- Voltage - Supply:
- 4.5 V ~ 5.5 V
- Current - Supply (Max):
- 60mA
- Bus Directional:
- Uni-Directional
- Expansion Type:
- Depth, Width
- Programmable Flags Support:
- Yes
- Retransmit Capability:
- No
- FWFT Support:
- No
- Operating Temperature:
- 0°C ~ 70°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-TQFP (10x10)
72225LB10TFG8 FAQ
1.How can I place an order for 72225LB10TFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 72225LB10TFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 72225LB10TFG8 reliable?
The price and inventory of 72225LB10TFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 72225LB10TFG8 is usually 5 days.
3.What payment methods are accepted for 72225LB10TFG8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 72225LB10TFG8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 72225LB10TFG8?
72225LB10TFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 72225LB10TFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 72225LB10TFG8?
For technical support, including 72225LB10TFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 72225LB10TFG8 requirements.
6.How does Aetrix verify that 72225LB10TFG8 is sourced from the original manufacturer or authorized distributors?
All 72225LB10TFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 72225LB10TFG8 meets industry standards.
7.What is the process for return or replacement of 72225LB10TFG8?
All 72225LB10TFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 72225LB10TFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 72225LB10TFG8 part is unused and in its original packaging.
Return procedure for 72225LB10TFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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