Renesas 72235LB10PFG
- Part No.:
- 72235LB10PFG
- Manufacturer:
- Renesas
- Category:
- FIFOs Memory
- Package:
- 64-LQFP
- Datasheet:
-
72235LB10PFG.pdf
- Description:
- IC FIFO SYNC 2KX18 6.5NS 64TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,259
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Product details
Overview
IDT72235LB10PFG from Integrated Device Technology (IDT) is a 2,048 × 18-bit synchronous FIFO memory IC with dual-clock operation, 10 ns read/write cycle time, and industrial temperature range (–40°C to +85°C). It features programmable Almost-Empty/Almost-Full flags, Half-Full flag, and depth/width expandability-used in LAN controllers, interprocessor communication, and optical disk interfaces.
For engineers reviewing the IDT72235LB10PFG datasheet, IDT72235LB10PFG pinout, IDT72235LB10PFG application, or IDT72235LB10PFG equivalent, key selection considerations include its 18-bit bidirectional data bus, asynchronous clock domain support, fixed EF/FF flags with programmable offsets, and TQFP-64 packaging for high-density PCB layouts.
Technical Context
This FIFO implements a dual-port zero fall-through time architecture with independent read/write pointer logic, offset register control via LD/WEN/REN, and synchronized status flag generation (EF on RCLK, FF on WCLK). Its submicron CMOS process enables low-power active operation (≤60 mA ICC1) while maintaining 100 MHz clock capability.
The device supports three operational modes: single-device (FL/WXI/RXI grounded), width expansion (parallel data bus widening), and daisy-chain depth expansion (via WXO/RXO signaling). Programmable PAE/PAF offsets default to 127 words from empty/full boundaries, configurable via D0–D11 during LD assertion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Depth × Width | 2,048 × 18-bit - provides 36,864 bits of buffered storage for burst-mode data alignment between mismatched clock domains. |
| Cycle Time | 10 ns - enables 100 MHz maximum clock frequency for high-throughput data streaming in real-time systems. |
| Supply Voltage | 4.5 V to 5.5 V - compatible with standard +5 V logic rails and tolerant of ±10% regulation variation. |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments including factory automation and telecom infrastructure. |
| Flag Timing | EF/FF updated on RCLK/WCLK rising edge - ensures deterministic status reporting aligned to respective clock domains. |
| Power Consumption | ≤60 mA ICC1 (active), ≤5 mA ICC2 (standby) - balances performance and thermal management in power-constrained designs. |
| Input/Output Capacitance | 10 pF max - minimizes signal integrity degradation and simplifies trace routing at high frequencies. |
Pinout & Package
Package: 64-lead thin quad flatpack (TQFP-64), lead finish SnPb (EOL as of June 15, 2018).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D0–D17 | Data Input Bus | 18-bit parallel input path; latched on WCLK rising edge when WEN = LOW. |
| Q0–Q17 | Data Output Bus | 18-bit parallel output path; driven on RCLK rising edge when REN = LOW and OE = LOW. |
| WCLK / RCLK | Independent Clock Inputs | Asynchronous or coincident clocks; enable dual-clock domain bridging without external synchronization logic. |
| WEN / REN / OE | Control Enables | WEN/REN gate write/read operations; OE places Q-bus in high-Z state for bus sharing. |
| RS / LD / FL | Configuration & Reset | RS resets pointers and flags; LD loads offset registers; FL selects single-device vs. daisy-chain mode. |
| EF / FF / PAE / PAF / HF | Status Flags | EF/FF are fixed boundary indicators; PAE/PAF are programmable thresholds; HF signals half-full condition. |
| WXI / WXO / RXI / RXO | Expansion Interface | Enable depth expansion via daisy-chain: WXO pulses on last write, RXO pulses on last read. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-clock domain operation | Enables seamless data transfer between independent clock domains (e.g., CPU ↔ peripheral) without metastability risk. |
| Programmable Almost-Empty/Full flags | Offset registers allow custom buffer watermarking (default 127 words), enabling adaptive flow control in variable-rate systems. |
| Zero fall-through time architecture | Eliminates pipeline delay between write and subsequent read of same location-critical for latency-sensitive buffering. |
| Depth/width expandability | Supports system-level capacity scaling: width expansion via parallel devices; depth expansion via daisy-chained WXO→WXI. |
| Industrial temperature qualification | Guaranteed operation from –40°C to +85°C ensures reliability in harsh environments like motor drives and base stations. |
Applications
| LAN Controller Buffering | Interprocessor Communication |
|---|---|
|
Use Scenario: Buffering packet payloads between MAC and PHY layers in 10/100 Mbps Ethernet controllers. IC Role / Device Role / Timing Role: Synchronous FIFO decouples transmit/receive clock domains while preserving packet integrity and order. Use Value: 2,048-word depth accommodates full Ethernet frame bursts; 10 ns cycle time supports line-rate throughput without backpressure. |
Use Scenario: Exchanging command/status data between two microcontrollers operating on independent clocks. IC Role / Device Role / Timing Role: Acts as a handshake-free, clock-domain-crossing buffer with EF/FF flag signaling for autonomous read/write coordination. Use Value: Programmable PAE/PAF allows dynamic threshold adjustment based on processing load, reducing polling overhead. |
| Optical Disk Controller Interface | Real-Time Data Acquisition System |
|
Use Scenario: Temporarily storing sector-aligned data streams from CD/DVD read heads before host DMA transfer. IC Role / Device Role / Timing Role: Provides jitter-tolerant buffering between high-speed spindle servo timing and slower host interface clocks. Use Value: Half-Full flag (HF) triggers early DMA request, minimizing buffer underrun risk during variable-speed disc rotation. |
Use Scenario: Capturing sensor samples from multiple ADCs running at different sampling rates into a unified stream. IC Role / Device Role / Timing Role: Aggregates asynchronous inputs into a synchronized output stream using dual-clock FIFO arbitration. Use Value: 18-bit width supports multi-channel 16-bit ADC outputs plus status bits; industrial temp rating ensures field deployment stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FIFO memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 72235L10PFG | Same 2,048×18 organization and 10 ns speed grade, but uses Pb-free (RoHS-compliant) lead finish instead of SnPb. | Required for new designs targeting RoHS compliance; identical timing and pinout to IDT72235LB10PFG. | Select when environmental compliance is mandatory and legacy SnPb assembly is not permitted. |
| 72V235L10PFG | 3.3 V supply variant (VCC = 3.15–3.45 V), lower power (ICC1 ≤ 45 mA), same 2,048×18 depth and 10 ns timing. | Suitable for mixed-voltage systems with 3.3 V I/O domains; requires level-shifting if interfacing with 5 V logic. | Choose for power-sensitive or 3.3 V-native designs where voltage translation is acceptable. |
Compared with IDT72235LB10PFG, the 72235L10PFG offers identical functionality with RoHS compliance, while the 72V235L10PFG reduces supply voltage and active current-enabling lower thermal design power in modern embedded systems.
Availability
IDT72235LB10PFG is available at Aetrix Electronics and suitable for LAN controllers, interprocessor communication links, optical disk interfaces, and real-time data acquisition systems requiring stable component supply across extended product lifecycles.
Supply support for IDT72235LB10PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT) was a U.S.-based semiconductor company specializing in timing, memory interface, RF, and high-performance interconnect solutions before its acquisition by Renesas Electronics in 2019.
IDT72235LB10PFG belongs to the SyncFIFO™ family-designed specifically for high-speed, low-latency data buffering in clock-domain crossing applications across networking, storage, and industrial control systems.
FAQ
What is the memory organization and speed grade of IDT72235LB10PFG?
IDT72235LB10PFG is a 2,048 × 18-bit synchronous FIFO with a 10 ns read/write cycle time, supporting up to 100 MHz clock operation. Its organization delivers 36,864 bits of buffer space, optimized for burst-mode data alignment between asynchronous subsystems. The "10" in the part number explicitly denotes the 10 ns speed grade.
Does IDT72235LB10PFG support both single-clock and dual-clock operation?
Yes, IDT72235LB10PFG supports both configurations: tying RCLK to WCLK enables single-clock operation, while independent clock sources enable true dual-clock domain bridging. The device's architecture ensures deterministic flag behavior-EF synchronized to RCLK, FF to WCLK-regardless of clock relationship.
What are the default values for the programmable Almost-Empty and Almost-Full offsets in IDT72235LB10PFG?
IDT72235LB10PFG defaults to 127-word offsets for both PAE and PAF after reset-meaning PAE asserts when 127 words remain before empty, and PAF asserts when 127 words remain before full. These values are stored in dedicated 12-bit offset registers and can be reloaded via D0–D11 during LD assertion.
How is depth expansion implemented using IDT72235LB10PFG in a daisy-chain configuration?
Depth expansion uses WXO and RXO outputs connected to WXI and RXI inputs of the next device. In a chain, FL is grounded only on the first device; subsequent devices have FL = HIGH. WXO pulses on last write, triggering the next device's write; RXO pulses on last read, advancing the chain's read pointer-enabling seamless concatenation of FIFO depth.
Is IDT72235LB10PFG still in active production, and what is its lead finish status?
IDT72235LB10PFG uses SnPb lead finish and entered End-of-Life (EOL) per IDT's June 2018 notice. Last Time Buy expired June 15, 2018. Aetrix Electronics maintains legacy inventory with full traceability; for new designs, consider the RoHS-compliant 72235L10PFG or 3.3 V 72V235L10PFG alternatives.
72235LB10PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- 7200
- Package/Case:
- 64-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Size:
- 36K (2K x 18)
- Function:
- Synchronous
- Data Rate:
- 100MHz
- Access Time:
- 6.5ns
- Voltage - Supply:
- 4.5 V ~ 5.5 V
- Current - Supply (Max):
- 60mA
- Bus Directional:
- Uni-Directional
- Expansion Type:
- Depth, Width
- Programmable Flags Support:
- Yes
- Retransmit Capability:
- No
- FWFT Support:
- No
- Operating Temperature:
- 0°C ~ 70°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-TQFP (14x14)
72235LB10PFG FAQ
1.How can I place an order for 72235LB10PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 72235LB10PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 72235LB10PFG reliable?
The price and inventory of 72235LB10PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 72235LB10PFG is usually 5 days.
3.What payment methods are accepted for 72235LB10PFG?
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4.How is shipping managed for 72235LB10PFG?
72235LB10PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 72235LB10PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 72235LB10PFG?
For technical support, including 72235LB10PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 72235LB10PFG requirements.
6.How does Aetrix verify that 72235LB10PFG is sourced from the original manufacturer or authorized distributors?
All 72235LB10PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 72235LB10PFG meets industry standards.
7.What is the process for return or replacement of 72235LB10PFG?
All 72235LB10PFG units undergo pre-shipment inspection (PSI). If there is an issue with 72235LB10PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 72235LB10PFG part is unused and in its original packaging.
Return procedure for 72235LB10PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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