Renesas 72V223L6BC
- Part No.:
- 72V223L6BC
- Manufacturer:
- Renesas
- Category:
- FIFOs Memory
- Package:
- 100-LBGA
- Datasheet:
-
72V223L6BC.pdf
- Description:
- IC FIFO SYNC 1KX9 4NS 100CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
72V223L6BC from Integrated Device Technology is a 3.3 V, high-density SuperSync II™ narrow bus FIFO memory with 512 × 18 or 1,024 × 9 organization, supporting independent read/write clocks up to 166 MHz, x9/x18 bus-matching, and FWFT/IDT Standard timing modes - deployed in telecom data buffering and network packet alignment systems.
For engineers reviewing the 72V223L6BC datasheet, 72V223L6BC pinout, 72V223L6BC application, or 72V223L6BC equivalent, key selection considerations include its TQFP-80 package, industrial temperature range (–40°C to +85°C), programmable almost-empty/full flags, zero-latency retransmit capability, and JTAG boundary-scan support for BGA variants (not applicable to this L6BC variant).
Technical Context
The 72V223L6BC implements dual-clock asynchronous FIFO architecture with fully independent RCLK and WCLK domains, eliminating frequency-ratio constraints between clocks. It supports configurable bus-matching via IW/OW pins during master reset, enabling x9↔x9, x9↔x18, x18↔x9, or x18↔x18 data width translation.
Its flag logic includes EF/OR, FF/IR, HF, PAE, and PAF outputs with selectable synchronous/asynchronous timing for PAE/PAF via PFM, and programmable offsets loaded serially (SEN+LD) or in parallel (WEN+LD). Retransmit (RT) with zero-latency mode (RM-controlled) enables deterministic replay without pointer corruption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Depth × Width | 512 × 18 or 1,024 × 9 - defines maximum data words storable per configuration; determines buffer capacity for burst-mode packet handling. |
| Max Clock Frequency | 166 MHz - sets upper limit on RCLK/WCLK toggle rate; enables sub-6 ns cycle time for high-throughput streaming interfaces. |
| Supply Voltage | 3.3 V ± 0.15 V - requires tight-regulated 3.3 V rail; compatible with JEDEC JESD8-A logic families and mixed-voltage system interfacing. |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments including base station equipment and ruggedized networking hardware. |
| Input Tolerance | 5 V tolerant inputs - allows direct connection to legacy 5 V control logic without level-shifting circuitry. |
| First Word Latency | Fixed and low - eliminates variable latency seen in prior FIFO generations; ensures predictable timing for real-time data path synchronization. |
| Power Modes | Auto power-down in idle - reduces ICC2 standby current to ≤15 mA; critical for energy-constrained embedded systems with intermittent traffic. |
Pinout & Package
72V223L6BC is packaged in an 80-pin Thin Quad Flat Pack (TQFP), PN80 footprint, with lead finish SnPb (end-of-life as of June 2018). Pin functions are defined per IDT DSC-4666/18 specification and validated for commercial and industrial temperature operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC (pins 1, 20, 22–29, 31–34, 36–40, 42, 44–47, 49–52, 54–57, 59–60, 62–65, 67–70, 72–75, 77–80) | Power supply input | 3.3 V core and I/O rail; multiple pins reduce IR drop and improve noise immunity across high-speed switching. |
| GND (pins 2, 19, 21, 30, 35, 41, 43, 48, 53, 58, 61, 66, 71, 76) | Ground reference | Dedicated ground pins distributed around perimeter minimize ground bounce during simultaneous switching of 18-bit data buses. |
| D0–D17 (pins 37–39, 41, 43–45, 47–49, 51–53, 55–57, 59–60) | Data input bus | Configurable 9- or 18-bit write port; unused bits (e.g., D9–D17 in x9 mode) must be tied LOW to prevent floating inputs. |
| Q0–Q17 (pins 3, 5–7, 9–11, 13–15, 17–18, 68–70, 72–74, 76–78) | Data output bus | Configurable 9- or 18-bit read port; unused outputs (e.g., Q9–Q17 in x9 mode) must remain unconnected to avoid contention. |
| WCLK (pin 67), RCLK (pin 79) | Clock inputs | Independent synchronous timing sources; no frequency ratio constraint - enables flexible clock domain bridging (e.g., PCIe ↔ Ethernet PHY). |
| WEN (pin 66), REN (pin 75) | Enable controls | Active-Low gating for write/read operations; required for synchronous mode; tied LOW for asynchronous operation (not supported in TQFP). |
| OE (pin 2) | Output enable | Three-state control of Q0–Q17; essential for bus sharing in multi-FIFO depth-expansion configurations. |
| MRS (pin 63), PRS (pin 64) | Reset controls | MRS clears pointers and flags; PRS resets pointers only - preserves flag offsets and timing mode for mid-operation recovery. |
| EF/OR, FF/IR, HF, PAE, PAF (pins 4, 6, 8, 10, 12) | Status flags | Real-time FIFO occupancy monitoring; PAE/PAF thresholds programmable via serial/parallel load - enables adaptive flow control in packet-switched networks. |
| IW (pin 36), OW (pin 71) | Bus-width config | Set during MRS to define x9/x18 width per port; enables seamless interface between mismatched subsystems (e.g., 16-bit CPU ↔ 8-bit peripheral). |
| FWFT/SI (pin 65) | Timing mode select | LOW at MRS selects IDT Standard mode; HIGH selects First Word Fall Through - determines initial word visibility and chaining behavior. |
| RT (pin 69), RM (pin 77) | Retransmit control | RT triggers pointer reset on rising RCLK edge; RM = LOW at MRS enables zero-latency retransmit - critical for error-recovery protocols. |
| LD (pin 62), FSEL0/FSEL1 (pins 61, 78) | Flag programming | Configure default PAE/PAF offsets during MRS; LD enables serial (SEN) or parallel (WEN) offset loading post-initialization. |
Key Features
| Feature | Design Value |
|---|---|
| Flexible bus-matching | Supports x9↔x9, x9↔x18, x18↔x9, x18↔x18 configurations via IW/OW pins - eliminates external glue logic in heterogeneous data-path interconnects. |
| Zero-latency retransmit | RT assertion places first word on Q-bus within same RCLK cycle - enables deterministic retry in time-critical protocols like IEEE 1588 PTP or deterministic Ethernet. |
| Programmable flag offsets | PAE/PAF thresholds set via 8 default presets or custom values loaded serially/parallel - allows fine-grained flow control tuning for varying packet size distributions. |
| Auto power-down | ICC2 ≤15 mA in idle state - reduces thermal load and extends uptime in fanless industrial gateways and remote telemetry units. |
| 5 V tolerant inputs | VIH up to 5.5 V - permits direct interface with legacy 5 V microcontrollers or FPGA I/O banks without voltage translators. |
| Fixed first-word latency | Deterministic 3-cycle delay from WEN assertion to Q-output availability - simplifies timing closure in high-speed ASIC/FPGA designs with strict setup/hold budgets. |
Applications
| Telecom Line Card Buffering | Industrial Protocol Gateway |
|---|---|
Use Scenario: Aggregating variable-length ATM or SONET frames across multiple line interfaces before forwarding to a switch fabric. IC Role / Device Role / Timing Role: Asynchronous FIFO bridging disparate clock domains (e.g., OC-48 PHY clock vs. backplane bus clock) while absorbing jitter and burstiness. Use Value: 512×18 depth provides sufficient margin for worst-case frame bursts; FWFT mode ensures immediate payload visibility for header parsing. | Use Scenario: Translating Modbus RTU (serial) to EtherNet/IP (Ethernet) in factory-floor PLC gateways with mixed-voltage I/O. IC Role / Device Role / Timing Role: Data width converter (x9 serial → x18 Ethernet MAC interface) with independent RCLK/WCLK for protocol timing isolation. Use Value: Bus-matching eliminates external multiplexers; 5 V tolerant D/Q pins simplify connection to RS-485 transceivers and 3.3 V MAC controllers. |
| Video Frame Synchronizer | Test Equipment Data Capture |
Use Scenario: Aligning unsynchronized HD-SDI video streams from multiple cameras into a synchronized processing pipeline. IC Role / Device Role / Timing Role: Dual-clock FIFO absorbing pixel-clock phase differences between sources; HF/PAF flags trigger DMA fetches at optimal fill levels. Use Value: Programmable PAF at 75% depth prevents overflow during transient skew; industrial temp rating ensures reliability in broadcast truck enclosures. | Use Scenario: Capturing high-speed digital stimulus-response waveforms in automated test equipment (ATE) with variable sampling clocks. IC Role / Device Role / Timing Role: High-bandwidth data capture buffer decoupling pattern generator clock (WCLK) from analysis processor clock (RCLK). Use Value: 166 MHz operation supports >1 Gbps sustained throughput; zero-latency RT enables repeatable waveform replay without host intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FIFO memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V233L6BC | 1,024 × 18 / 2,048 × 9 depth - double the memory capacity of 72V223L6BC; identical pinout and feature set. | Suitable for systems requiring deeper buffering (e.g., longer packet queues or larger video line buffers) without layout change. | Select when ≥1K-word depth is required; shares same TQFP-80 footprint and timing characteristics. |
| ON Semiconductor NB3N502MNR4G | 3.3 V, 256 × 18 sync FIFO; lower density, no FWFT mode, no programmable flags, no JTAG; SOIC-28 package. | Limited to basic clock-domain bridging in cost-sensitive consumer electronics where advanced features are unnecessary. | Choose only for simple, low-depth buffering with minimal feature requirements; not suitable for telecom or industrial use cases demanding configurability. |
Compared with IDT72V233L6BC, the 72V223L6BC offers half the depth but identical timing, power, and interface flexibility - ideal for space-constrained designs where 512-word buffering suffices. Versus NB3N502MNR4G, the 72V223L6BC delivers superior configurability, industrial qualification, and robust flag management essential for mission-critical infrastructure.
Availability
72V223L6BC is available at Aetrix Electronics and suitable for telecom line card buffering, industrial protocol gateway design, video frame synchronization, and test equipment data capture requiring stable component supply across extended product lifecycles.
Supply support for 72V223L6BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology, Inc. (IDT) is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning solutions for communications, computing, and industrial markets.
The 72V223L6BC belongs to IDT's SuperSync II™ FIFO product line, engineered for high-density, low-latency, multi-clock-domain data buffering in network infrastructure and real-time embedded systems.
FAQ
What memory organization does the 72V223L6BC support?
The 72V223L6BC supports two memory organizations: 512 × 18 or 1,024 × 9, selected via Input Width (IW) and Output Width (OW) pins during Master Reset. This dual-configuration enables flexible bus-matching between 9-bit and 18-bit subsystems without external logic. The 72V223L6BC does not support deeper densities like 2,048 × 9 - those require higher-numbered variants such as 72V233L6BC.
Does the 72V223L6BC support asynchronous read/write ports?
No, the 72V223L6BC in TQFP-80 package (L6BC suffix) does not support asynchronous read/write ports. Asynchronous operation (ASYR/ASYW) is exclusive to the BGA package variants (e.g., BC100). The 72V223L6BC operates strictly in synchronous mode using RCLK and WCLK, with REN and WEN enabling controlled data transfer on clock edges.
What is the purpose of the FWFT/SI pin on the 72V223L6BC?
The FWFT/SI pin on the 72V223L6BC serves a dual function: during Master Reset, its state selects between First Word Fall Through (FWFT) mode (HIGH) and IDT Standard mode (LOW); after reset, it acts as Serial Input (SI) for loading programmable flag offsets. FWFT mode enables immediate visibility of the first written word on Q outputs, simplifying chaining in depth-expanded FIFO systems.
Can the 72V223L6BC be used in industrial temperature applications?
Yes, the 72V223L6BC is qualified for industrial temperature operation from –40°C to +85°C, as confirmed in the IDT DSC-4666/18 datasheet. Its design uses high-performance submicron CMOS technology and meets JEDEC JESD8-A compliance, making it suitable for deployment in base stations, factory automation controllers, and outdoor networking equipment.
How is the retransmit function implemented on the 72V223L6BC?
The retransmit function on the 72V223L6BC is triggered by asserting RT LOW on a rising edge of RCLK, which resets the read pointer to zero without disturbing the write pointer or programmable settings. When RM is LOW during Master Reset, zero-latency retransmit is enabled - placing the first word on Q outputs synchronously with the same RCLK edge that asserted RT. This behavior is confirmed in Figures 13–14 of the 72V223L6BC datasheet.
72V223L6BC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- 72V
- Package/Case:
- 100-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Size:
- 9K (512 x 18)(1K x 9)
- Function:
- Synchronous
- Data Rate:
- 166MHz
- Access Time:
- 4ns
- Voltage - Supply:
- 3.15 V ~ 3.45 V
- Current - Supply (Max):
- 35mA
- Bus Directional:
- Uni-Directional
- Expansion Type:
- Depth, Width
- Programmable Flags Support:
- Yes
- Retransmit Capability:
- Yes
- FWFT Support:
- Yes
- Operating Temperature:
- 0°C ~ 70°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-CABGA (11x11)
72V223L6BC FAQ
1.How can I place an order for 72V223L6BC through Aetrix?
Please submit a Request for Quotation (RFQ) for 72V223L6BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 72V223L6BC reliable?
The price and inventory of 72V223L6BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 72V223L6BC is usually 5 days.
3.What payment methods are accepted for 72V223L6BC?
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4.How is shipping managed for 72V223L6BC?
72V223L6BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 72V223L6BC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 72V223L6BC?
For technical support, including 72V223L6BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 72V223L6BC requirements.
6.How does Aetrix verify that 72V223L6BC is sourced from the original manufacturer or authorized distributors?
All 72V223L6BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 72V223L6BC meets industry standards.
7.What is the process for return or replacement of 72V223L6BC?
All 72V223L6BC units undergo pre-shipment inspection (PSI). If there is an issue with 72V223L6BC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 72V223L6BC part is unused and in its original packaging.
Return procedure for 72V223L6BC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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