Renesas 72V70810TFG
- Part No.:
- 72V70810TFG
- Manufacturer:
- Renesas
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 64-LQFP
- Datasheet:
-
72V70810TFG.pdf
- Description:
- IC MULTIPLEXER 1 X 8:8 64TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,847
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Product details
Overview
IDT72V70810TFG from Integrated Device Technology is a 3.3 V, 1,024 × 1,024 non-blocking time-slot interchange (TSI) digital switch optimized for ST-BUS®/GCI and wide frame pulse (WFP) telecommunication interfaces. It supports eight 8.192 Mb/s serial data streams, delivers per-channel variable or constant throughput delay, and features 5V-tolerant I/O with −40°C to +85°C industrial temperature operation - deployed in TDM voice/data concentrators and multi-port digital PBX systems.
For engineers reviewing the IDT72V70810TFG datasheet, IDT72V70810TFG pinout, IDT72V70810TFG application, or IDT72V70810TFG equivalent, key selection considerations include frame offset calibration capability, per-channel high-impedance control, Processor/Connection mode flexibility, ST-BUS®/GCI auto-detection, and compatibility with Intel/Motorola parallel microprocessor buses.
Technical Context
The IDT72V70810TFG implements a dual-mode serial interface supporting both ST-BUS®/GCI (auto-identified) and WFP frame alignment modes via the WFPS pin. Its internal architecture includes serial-to-parallel converters, 8 KHz frame-synchronized data memory, and connection memory mapped across 128 channels per stream.
It provides per-stream input frame offset programming (±4.5 CLK periods resolution), automatic frame evaluation using FE/HCLK, and loopback-enabled diagnostics at channel level. The device uses a 16.384 MHz master clock (CLK) and supports Motorola non-multiplexed/multiplexed and Intel multiplexed CPU bus protocols via IM, AS/ALE, DS/RD, and R/W/WR pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Switch Capacity | 1,024 × 1,024 PCM channels at 64 Kbit/s per channel - enables full TDM matrix routing in large-scale voice/data gateways. |
| Data Rate per Stream | 8.192 Mb/s - matches E1/T1 framing and supports 128 time-slots per 125 µs frame. |
| Master Clock | 16.384 MHz - required for synchronous serial I/O and memory access; exactly 2× data rate. |
| Supply Voltage | +3.3 V ±5% - compatible with modern low-voltage telecom subsystems; I/O pins tolerate up to 5 V. |
| Operating Temperature | −40°C to +85°C - qualified for industrial and outdoor telecom equipment deployment. |
| Interface Modes | ST-BUS®/GCI auto-detect or WFP mode - eliminates external glue logic for frame format adaptation. |
| Delay Modes | Per-channel variable (min. 3 time-slots) or constant (min. 1 frame) throughput delay - preserves voice latency or data frame integrity. |
Pinout & Package
Package: 64-pin Small Thin Quad Flatpack (STQFP), 10 mm × 10 mm, 0.50 mm pitch (order code TF).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Vcc | +3.3 V Power Supply | Primary power rail; decoupling required per high-speed switching current demands. |
| GND | Ground Reference | Common return path for analog/digital domains; must be low-inductance plane. |
| RX0–RX7 | Serial Input Streams | Eight 8.192 Mb/s TDM inputs; accept ST-BUS®, GCI, or WFP-aligned frames. |
| TX0–TX7 | Serial Output Streams | Three-state outputs; individually controllable via ODE pin and OSB/Connection Memory bits. |
| F0i | Frame Pulse Input | 8 KHz synchronization signal; polarity auto-detected for ST-BUS®/GCI; used as reference for frame offset measurement. |
| FE/HCLK | Frame Evaluation / HCLK Input | In ST-BUS®/GCI mode: frame measurement input; in WFP mode: 4.096 MHz clock for frame alignment. |
| CLK | Master Clock Input | 16.384 MHz clock driving all serial I/O and internal memory timing; must meet setup/hold requirements. |
| RESET | Active-Low Reset | Schmitt-triggered; holds TX outputs in high-impedance and clears registers; min. 100 ns pulse width required. |
| WFPS | Wide Frame Pulse Select | High = WFP mode enabled; Low = ST-BUS®/GCI auto-detect mode active. |
| IM | CPU Interface Mode | High = multiplexed bus; Low = non-multiplexed Motorola bus; configures AD0–AD7 function. |
| CS | Chip Select | Active-low enable for microprocessor port access; required for register/memory read/write cycles. |
| DS/RD & R/W/WR | Bus Control Signals | Configurable for Intel/Motorola timing; resolves control signal differences without external logic. |
| AD0–AD7 & D8–D15 | Address/Data Bus | 8-bit multiplexed address/data (AD0–AD7) plus 8-bit data (D8–D15); supports 16-bit parallel microport. |
| DTA | Data Transfer Acknowledge | Active-low open-drain output signaling completion of microprocessor bus cycle; enables faster timing with weak pull-up. |
| CCO | Connection Control Output | 16.384 Mb/s serial output carrying CCO bits from connection memory; synchronized to TX streams. |
| ODE | Output Drive Enable | Global TX output enable; overrides per-channel OE bits when low; works with OSB bit for standby control. |
Key Features
| Feature | Design Value |
|---|---|
| Per-channel high-impedance control | Each TX output can be independently disabled via connection memory OE bit - enables dynamic channel shutdown without affecting others. |
| Automatic ST-BUS®/GCI identification | Detects frame polarity and format on F0i without configuration - reduces firmware initialization overhead and eliminates manual mode setting. |
| Per-stream frame delay offset programming | Compensates for inter-stream skew up to ±4.5 CLK periods - critical for aligning multiple backplane-connected switches in distributed systems. |
| Processor and Connection Mode operation | Microprocessor writes directly to TX streams (Processor Mode) or configures static routing tables (Connection Mode) - supports both real-time control and fixed-path applications. |
| Internal loopback per channel | LPBK bit routes TXn,m → RXn,m internally - enables per-channel diagnostic testing without external hardware or loop cables. |
| Memory block programming | Loads 5-bit pattern into bits 11–15 of all 1,024 connection memory locations in two frames - accelerates boot-time initialization of large routing tables. |
Applications
| Telecom Digital PBX | TDM Voice Gateway |
|---|---|
Use Scenario: Centralized call switching across 32 E1 trunks with dynamic time-slot allocation for VoIP transcoding and conferencing. IC Role / Device Role / Timing Role: Time-slot interchange fabric managing 1,024 × 1,024 bidirectional PCM channel mappings with sub-frame latency control. Use Value: Enables per-channel variable delay mode to minimize voice round-trip latency while maintaining frame sync across mixed-rate streams. | Use Scenario: Aggregating 8 T1/E1 lines into a single high-density VoIP media gateway with echo cancellation and transcoding. IC Role / Device Role / Timing Role: Non-blocking TSI switch providing ST-BUS®-aligned serial I/O and processor-mode control for real-time channel reassignment. Use Value: Auto-detection of ST-BUS® vs. GCI frame formats eliminates board-level jumpers and simplifies firmware support for multi-standard deployments. |
| Multi-Port Radio Base Station | Distributed Telecom Switch Fabric |
Use Scenario: Front-haul interface between remote radio units and baseband units in LTE/5G macro cells requiring precise TDM timing alignment. IC Role / Device Role / Timing Role: Frame-aligned serial switch synchronizing 8.192 Mb/s CPRI-like data streams with 125 µs frame boundaries. Use Value: Frame offset calibration compensates for PCB trace length mismatches across 8 RX inputs - ensures deterministic channel alignment at system level. | Use Scenario: Cascaded switching architecture where multiple IDT72V70810TFG devices route traffic across geographically separated nodes. IC Role / Device Role / Timing Role: Distributed TSI node supporting per-stream input delay compensation and constant-delay mode for concatenated data payloads. Use Value: Constant throughput delay preserves frame integrity across multi-hop paths - essential for leased-line data services and circuit emulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar time-slot interchange applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V70805TFG | 512 × 512 capacity; same 8.192 Mb/s stream rate and ST-BUS®/GCI support; identical STQFP-64 package. | Lower channel count suits smaller-scale voice concentrators or cost-sensitive edge nodes. | Select when full 1,024 × 1,024 routing density is unnecessary and BOM cost reduction is prioritized. |
| MC145506FN | 512 × 512 TSI; 2.5 V core / 3.3 V I/O; no WFP mode; requires external frame sync logic; SOIC-28 package. | Limited to legacy 2.5 V systems; lacks auto-detect and per-stream offset calibration - increases design complexity. | Consider only for brownfield upgrades where footprint and voltage constraints preclude IDT72V70810TFG adoption. |
Compared with IDT72V70810TFG, IDT72V70805TFG offers half the switching capacity in identical packaging and feature set, while MC145506FN trades scalability and integration for legacy voltage compatibility and smaller footprint - making IDT72V70810TFG the optimal choice for new high-density TDM infrastructure designs.
Availability
IDT72V70810TFG is available at Aetrix Electronics and suitable for telecom digital PBX, TDM voice gateways, multi-port radio base stations, and distributed telecom switch fabric requiring stable component supply across extended product lifecycles.
Supply support for IDT72V70810TFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.
The IDT72V70810TFG belongs to IDT's time-slot interchange digital switch family, engineered specifically for carrier-grade TDM infrastructure requiring deterministic latency, multi-format frame alignment, and scalable channel density.
FAQ
What is the primary function of the IDT72V70810TFG in a TDM system?
The IDT72V70810TFG serves as a non-blocking time-slot interchange digital switch that routes 64 Kbit/s PCM channels between eight 8.192 Mb/s serial streams. It enables dynamic, per-channel time-slot mapping with programmable delay modes - essential for voice/data concentration, digital PBX switching, and TDM-over-packet gateways. Its ST-BUS®/GCI auto-detection and frame offset calibration ensure robust interoperability in heterogeneous telecom environments.
Does the IDT72V70810TFG support both variable and constant throughput delay modes?
Yes, the IDT72V70810TFG supports both delay modes on a per-channel basis via the V/C bit in connection memory. Variable delay (V/C = 0) minimizes latency - ideal for voice - with minimum 3 time-slots delay. Constant delay (V/C = 1) preserves frame integrity for data applications, guaranteeing 1-frame (125 µs) throughput delay regardless of source/destination channel pairing. This dual-mode capability is implemented entirely in hardware without external control logic.
How does the IDT72V70810TFG handle frame synchronization across different standards?
The IDT72V70810TFG automatically identifies ST-BUS® or GCI frame formats on the F0i input using edge-detection logic, eliminating manual configuration. When WFPS is high, it operates in wide frame pulse (WFP) mode requiring FE/HCLK at 4.096 MHz. In either mode, it maintains strict 125 µs frame alignment and supports per-stream frame offset calibration to compensate for inter-stream skew - ensuring deterministic timing in multi-chip switch fabrics.
Can the IDT72V70810TFG interface directly with common microprocessors like Intel 80C188 or Motorola 68000?
Yes, the IDT72V70810TFG provides native compatibility with both Intel multiplexed (e.g., 80C188) and Motorola non-multiplexed/multiplexed (e.g., 68000) buses via its IM pin and configurable control signals (DS/RD, R/W/WR, AS/ALE). The device resolves signal protocol differences internally - no glue logic is needed. Address/data bus width, strobe timing, and read/write handshaking conform to published timing diagrams in the datasheet for direct connection to these processors.
What is the role of the ODE and OSB pins in controlling the IDT72V70810TFG's TX outputs?
The ODE (Output Drive Enable) pin is a global enable for TX0–TX7 drivers: when low, all outputs enter high-impedance unless overridden by OSB. The OSB (Output Standby) bit in the IMS register controls whether ODE=0 disables outputs (OSB=0) or allows normal operation (OSB=1). Together, they provide hierarchical control - ODE enables/disables globally, while per-channel OE bits in connection memory allow fine-grained, software-defined channel shutdown without affecting others.
72V70810TFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- 72V
- Package/Case:
- 64-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Multiplexer
- Circuit:
- 1 x 8:8
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-TQFP (10x10)
72V70810TFG FAQ
1.How can I place an order for 72V70810TFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 72V70810TFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 72V70810TFG reliable?
The price and inventory of 72V70810TFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 72V70810TFG is usually 5 days.
3.What payment methods are accepted for 72V70810TFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 72V70810TFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 72V70810TFG?
72V70810TFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 72V70810TFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 72V70810TFG?
For technical support, including 72V70810TFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 72V70810TFG requirements.
6.How does Aetrix verify that 72V70810TFG is sourced from the original manufacturer or authorized distributors?
All 72V70810TFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 72V70810TFG meets industry standards.
7.What is the process for return or replacement of 72V70810TFG?
All 72V70810TFG units undergo pre-shipment inspection (PSI). If there is an issue with 72V70810TFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 72V70810TFG part is unused and in its original packaging.
Return procedure for 72V70810TFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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