Renesas 72V73260BBG
- Part No.:
- 72V73260BBG
- Manufacturer:
- Renesas
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 144-BGA
- Datasheet:
-
72V73260BBG.pdf
- Description:
- IC MULTIPLEXER 1 X 32:32 144PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,827
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Product details
Overview
IDT72V73260BBG from Integrated Device Technology is a 3.3 V, 16,384 × 16,384 non-blocking time slot interchange (TSI) digital switch optimized for TDM voice and data applications. It supports 32 serial input/output streams at 32.768 Mb/s, offers per-channel variable or constant delay modes, and integrates JTAG test access and microprocessor interface for real-time path configuration in telecom switching systems.
For engineers reviewing the IDT72V73260BBG datasheet, IDT72V73260BBG pinout, IDT72V73260BBG application, or IDT72V73260BBG equivalent, this device serves as a high-density ST-BUS®/GCI-compatible TSI core requiring precise frame alignment control, low-latency channel routing, and deterministic throughput delay management in carrier-grade voice infrastructure.
Technical Context
The IDT72V73260BBG implements dual-mode TSI operation: Variable Delay Mode (MOD1-0 = 00) achieves minimum 3-time-slot latency for voice paths, while Constant Delay Mode (MOD1-0 = 01) guarantees fixed 513-time-slot delay (1 frame + 1 channel) to preserve frame integrity in wideband data. Input frame offset compensation supports ±7.5 C32i clock-cycle skew correction per RX stream via programmable Frame Offset Registers (FOR0–FOR7).
Its microprocessor interface emulates a 16-bit RAM with A0–A15 addressing, enabling direct random access to Data Memory (16K × 16), Connection Memory (16K × 16), Control Register, Frame Alignment Register, and eight Frame Offset Registers. Automatic ST-BUS®/GCI bus detection configures serial I/O timing-data latched on rising/falling edges respectively-and enables seamless integration into legacy and next-gen TDM backplanes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Switch Capacity | 16,384 × 16,384 non-blocking channels - supports full-mesh TDM interconnection without contention across all 32 RX/TX streams. |
| Data Rate | 32.768 Mb/s per serial stream - matches E1/T1 framing (512 channels/frame @ 8 kHz), enabling direct PCM time-slot mapping. |
| Delay Modes | Per-channel Variable Delay (min. 3 time-slots) or Constant Delay (513 time-slots) - selectable via MOD1-0 bits in Connection Memory for voice vs. data optimization. |
| Frame Alignment | ±7.5 C32i clock-cycle input offset adjustment (½-cycle resolution) - compensates for PCB trace skew and backplane propagation delays across 32 RX inputs. |
| Interface Support | Auto-sensed ST-BUS® and GCI protocols - eliminates manual configuration; timing compliance verified per Mitel ST-BUS® spec and GCI standard. |
| Supply & Temp | +3.3 V single supply; –40°C to +85°C industrial temperature range - suitable for fanless central office and remote terminal deployments. |
| JTAG Compliance | IEEE-1149.1 Test Access Port (TAP) with TCK/TMS/TDI/TDO/TRST - enables boundary-scan testing and in-system debug of serial data paths and memory blocks. |
Pinout & Package
Package: 144-pin Plastic Ball Grid Array (PBGA), 13 mm × 13 mm, 1.0 mm pitch (order code BB). Pinout validated per IDT DSC-5932/10 datasheet Figure 2 (PBGA top view) and Pin Description Table (Page 4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RX0–RX31 | Serial Data Input | 32 unidirectional CMOS inputs accepting 32.768 Mb/s bit-streams; each mapped to dedicated internal data memory banks. |
| TX0–TX15, TX16/OEI0–TX31/OEI15 | Serial Data Output / OE Indication | 32 three-state CMOS outputs; when OEI=1 in Control Register, TX16–TX31 become output enable status indicators (active/high-Z). |
| A0–A15, D0–D15, CS, R/W, DS, DTA | Microprocessor Interface | 16-bit address/data bus with standard RAM-like timing; DS+CS enable cycle, DTA signals completion for high-speed bus arbitration. |
| C32i, F32i, FE | Timing & Frame Control | C32i = 32.768 MHz master clock; F32i = auto-detected ST-BUS®/GCI frame pulse; FE = frame evaluation reference for skew measurement. |
| ODE, RESET, TRST, TCK, TMS, TDI, TDO | Control & Test | ODE globally enables/disables TX drivers; RESET clears registers and forces high-Z; JTAG pins support IEEE-1149.1 boundary scan and memory access. |
Key Features
| Feature | Design Value |
|---|---|
| Per-channel delay mode selection | MOD1-0 bits in Connection Memory configure each of 16,384 output channels for Variable Delay (voice), Constant Delay (data), Processor Mode (host-controlled), or high-Z. |
| Automatic ST-BUS®/GCI detection | Hardware-level protocol identification eliminates software configuration overhead and ensures correct edge-aligned serial I/O timing without host intervention. |
| Frame offset calibration | Eight Frame Offset Registers (FOR0–FOR7) allow independent +7.5-cycle skew compensation per RX stream, critical for distributed TDM systems with unequal trace lengths. |
| Memory block programming | Two-frame initialization of all Connection Memory bits 14–15 using BPD1-0 and MBP/BPE bits - accelerates boot-time path setup without sequential writes. |
| Output enable indication | Configurable TX16–TX31 pins reflect real-time active/high-Z state of corresponding outputs - enables external logic to gate downstream receivers synchronously. |
Applications
| Telecom Central Office Switching | Wireless Base Station Abis Interface |
|---|---|
|
Use Scenario: Aggregating 32 E1 lines (2.048 Mbps each) into a unified TDM fabric for call routing between PSTN and IP core networks. IC Role / Device Role / Timing Role: Time slot interchange switch performing non-blocking 16K×16K channel cross-connect with sub-frame latency control. Use Value: Enables dynamic reassignment of 64 kbps PCM channels across multiple E1 trunks while maintaining ETSI-compliant jitter and wander performance. |
Use Scenario: Interfacing BTS baseband processors with TRAU units over standardized Abis links carrying GSM traffic. IC Role / Device Role / Timing Role: TSI element aligning and remapping time slots between different TRX carriers and transcoder resources. Use Value: Supports per-channel Constant Delay Mode to preserve frame synchronization across multi-hop Abis transport, meeting 3GPP TS 101 515 timing requirements. |
| VoIP Gateway TDM Backplane | Industrial TDM Multiplexer |
|
Use Scenario: Bridging legacy PBX TDM interfaces to VoIP media gateways using HDLC-framed PCM data. IC Role / Device Role / Timing Role: Digital switch providing low-latency Variable Delay Mode routing for real-time voice packetization. Use Value: Achieves ≤3-time-slot end-to-end delay (≈586 ns) between RX and TX streams, minimizing mouth-to-ear latency in SIP trunking applications. |
Use Scenario: Consolidating telemetry, SCADA, and voice channels from remote substations onto a single fiber TDM link. IC Role / Device Role / Timing Role: Frame-aligned TSI managing fixed-delay channel insertion/extraction under IEC 61850-3 environmental stress. Use Value: Industrial temperature rating (–40°C to +85°C) and JTAG testability ensure reliable operation in unconditioned outdoor cabinets with minimal maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar time slot interchange applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V73250BBG | 16K × 8K capacity; 16 RX/TX streams; identical 32.768 Mb/s rate and PBGA package. | Half the channel count limits scalability in large-scale central office switches but reduces power and board area. | Select when system requires ≤16 input/output streams and lower gate count is prioritized over full 32-stream density. |
| Cypress CY7C68013A-56PVXC | USB 2.0 microcontroller with integrated FIFO; no native TSI logic, ST-BUS® support, or frame alignment features. | Requires external FPGA-based TSI logic and custom firmware - adds latency, complexity, and validation burden. | Consider only for prototyping or ultra-low-volume designs where USB host interface dominates over deterministic TDM switching. |
Compared with IDT72V73250BBG and CY7C68013A-56PVXC, the IDT72V73260BBG delivers full 32-stream non-blocking TSI with hardware-accelerated frame skew compensation and auto-protocol detection - eliminating FPGA glue logic and reducing BOM count in production telecom infrastructure.
Availability
IDT72V73260BBG is available at Aetrix Electronics and suitable for telecom central office switching, wireless base station Abis interfaces, VoIP gateway TDM backplanes, and industrial TDM multiplexers requiring stable component supply across extended product lifecycles.
Supply support for IDT72V73260BBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and high-performance interconnect solutions for communications and computing markets.
The IDT72V73260BBG belongs to IDT's legacy TSI digital switch family, designed specifically for carrier-grade TDM infrastructure requiring deterministic latency, frame integrity, and seamless ST-BUS®/GCI interoperability in voice-centric networks.
FAQ
What is the maximum frame alignment skew compensation supported by the IDT72V73260BBG?
The IDT72V73260BBG supports up to +7.5 C32i clock cycles (±3.75 cycles relative to nominal) of input frame offset adjustment per RX stream, with ½-cycle resolution. This is implemented via three-bit offset fields (OFn2–OFn0) in eight Frame Offset Registers (FOR0–FOR7), allowing precise skew correction across all 32 serial inputs without external delay lines or FPGA logic.
How does the IDT72V73260BBG handle automatic ST-BUS® versus GCI protocol detection?
The IDT72V73260BBG monitors the F32i frame pulse and C32i clock edges in real time to autonomously determine ST-BUS® (frame pulse falling edge synchronized) or GCI (rising edge synchronized) format. Once detected, it configures internal serial I/O timing accordingly - latching input data on the subsequent edge and driving output data on the defined edge - requiring no host software configuration or register writes.
Can the IDT72V73260BBG operate in both Variable and Constant Delay Modes simultaneously?
Yes - the IDT72V73260BBG supports per-channel delay mode selection via MOD1-0 bits in its Connection Memory. Each of the 16,384 output channels can be independently configured for Variable Delay Mode (MOD1-0 = 00), Constant Delay Mode (MOD1-0 = 01), Processor Mode (MOD1-0 = 10), or high-impedance (MOD1-0 = 11), enabling mixed-traffic systems to optimize voice latency and data frame integrity within a single device.
What is the function of the DTA (Data Transfer Acknowledgment) pin on the IDT72V73260BBG?
The DTA pin on the IDT72V73260BBG signals completion of a microprocessor bus cycle: it drives HIGH at the end of a read or write operation and then transitions to high-impedance. This allows faster bus turnaround when paired with a weak external pull-up resistor, reducing bus contention and improving throughput in systems with multiple peripherals sharing the same data/address bus.
Does the IDT72V73260BBG support JTAG boundary-scan testing of its serial data paths?
Yes - the IDT72V73260BBG implements full IEEE-1149.1 JTAG compliance with dedicated TCK, TMS, TDI, TDO, and TRST pins. Its TAP controller supports instruction register access and data register scanning, enabling boundary-scan verification of all serial I/O pins (RX0–RX31, TX0–TX31), control inputs (ODE, RESET, CS), and critical timing signals (C32i, F32i) during board-level test.
72V73260BBG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- 72V
- Package/Case:
- 144-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Multiplexer
- Circuit:
- 1 x 32:32
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 144-PBGA (13x13)
72V73260BBG FAQ
1.How can I place an order for 72V73260BBG through Aetrix?
Please submit a Request for Quotation (RFQ) for 72V73260BBG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 72V73260BBG reliable?
The price and inventory of 72V73260BBG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 72V73260BBG is usually 5 days.
3.What payment methods are accepted for 72V73260BBG?
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4.How is shipping managed for 72V73260BBG?
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Once your 72V73260BBG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 72V73260BBG?
For technical support, including 72V73260BBG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 72V73260BBG requirements.
6.How does Aetrix verify that 72V73260BBG is sourced from the original manufacturer or authorized distributors?
All 72V73260BBG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 72V73260BBG meets industry standards.
7.What is the process for return or replacement of 72V73260BBG?
All 72V73260BBG units undergo pre-shipment inspection (PSI). If there is an issue with 72V73260BBG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 72V73260BBG part is unused and in its original packaging.
Return procedure for 72V73260BBG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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