Renesas 72V73263BB
- Part No.:
- 72V73263BB
- Manufacturer:
- Renesas
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 208-BGA
- Datasheet:
-
72V73263BB.pdf
- Description:
- IC MULTIPLEXER 8 X 1:1 208PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IDT72V73263 from Integrated Device Technology is a 3.3 V, 208-pin PBGA time slot interchange (TSI) digital switch with non-blocking 16,384 × 16,384 channel capacity, supporting serial data rates up to 32.768 Mb/s across 64 RX and 64 TX streams, and featuring per-channel variable/constant delay modes for voice/data TDM applications in telecom infrastructure.
For engineers reviewing the IDT72V73263 datasheet, IDT72V73263 pinout, IDT72V73263 application, or IDT72V73263 equivalent, key selection considerations include ST-BUS®/GCI auto-sensing, JTAG test access, rate-matching across eight RX/TX stream groups, frame offset programming, and microprocessor-accessible Connection/Data Memory mapping via 16-bit address/data bus.
Technical Context
The IDT72V73263 implements a dual-memory architecture with serial-to-parallel conversion of RX streams into Data Memory and configurable routing via Connection Memory, enabling per-channel switching decisions. It supports two primary operational modes: Processor Mode (microprocessor writes directly to Connection Memory LOW) and Connection Mode (address-based routing from Data Memory).
Its timing engine uses a fixed 32.768 MHz master clock (C32i) to derive all serial data rates (2.048–32.768 Mb/s) with automatic edge alignment for ST-BUS® (falling-edge TX) and GCI (rising-edge TX) protocols. Delay behavior is programmable per channel via MOD2–0 bits: Variable Delay Mode (0-0-0) minimizes throughput latency for voice, while Constant Delay Mode (0-0-1) ensures frame integrity for data by enforcing a fixed n+2 frame readout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Switch Capacity | 16,384 × 16,384 non-blocking channels at 32.768 Mb/s - enables full TDM matrix switching without contention in high-density voice/data concentrators. |
| Serial I/O Count | 64 RX inputs and 64 TX outputs - supports multi-group TDM aggregation/distribution in E1/T1, STM-1, or GCI-based systems. |
| Data Rates | 2.048 / 4.096 / 8.192 / 16.384 / 32.768 Mb/s - matches standard PCM frame structures (32, 64, 128, 256, or 512 channels per 125 µs frame). |
| Delay Modes | Per-channel Variable (min. 3 channel periods) or Constant (1 frame + 1 channel) - allows coexistence of low-latency voice paths and synchronized data paths on same device. |
| Microprocessor Interface | 16-bit address (A0–A15), 16-bit data (D0–D15), CS/R/W/DS/DTA-BEH - behaves as RAM-mapped peripheral for seamless integration with ARM/MIPS/FPGA host controllers. |
| JTAG Support | IEEE-1149.1 compliant TAP (TCK/TMS/TDI/TDO/TRST) - enables boundary-scan testing, in-system debug, and production verification without external test fixtures. |
| Operating Temp | −40°C to +85°C - qualified for industrial-grade deployment in base station line cards, media gateways, and remote DSLAMs. |
| Supply Voltage | 3.3 V ±0.3 V - compatible with modern low-voltage logic families and reduces power consumption vs. legacy 5 V TSI devices. |
Pinout & Package
Package: 208-ball PBGA (17 mm × 17 mm, 1.0 mm pitch, order code BB). Pinout conforms to IDT's standardized layout with dedicated RX/TX banks, dual-byte microprocessor bus (D0–D15, A0–A15), JTAG test port, and output enable indication pins (OEI0–OEI55) multiplexed with TX outputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| C32i | Master Clock Input | 32.768 MHz reference driving all internal timing; determines bit sampling edges for all serial rates. |
| F32i | Frame Pulse Input | 8 kHz (125 µs frame sync); auto-identifies ST-BUS®/GCI polarity and aligns memory addressing. |
| ODE | Output Drive Enable | Global control: LOW forces all TX outputs to High-Z; overrides per-channel MOD2–0 settings when OSB = 0. |
| RX0–RX63 | Serial Data Inputs | 64 unidirectional CMOS inputs accepting configurable data rates; each mapped to independent receive data rate selection register (RDRSR). |
| TX0–TX63 / OEI0–OEI55 | Serial Outputs / OE Indication | Multiplexed pins: TXn active when corresponding OEIx reflects driver state; enables external buffer control in multi-chip matrices. |
| A0–A15, D0–D15, CS, R/W, DS, DTA/BEH | Microprocessor Bus | 16-bit address/data interface with synchronous/asynchronous mode selection (S/A pin); supports RAM-like random access to Connection/Data Memory. |
| TCK, TMS, TDI, TDO, TRST | JTAG Test Port | Full IEEE-1149.1 implementation for structural test, memory scan, and boundary-scan diagnostics during manufacturing and field service. |
Key Features
| Feature | Design Value |
|---|---|
| Automatic ST-BUS®/GCI Detection | Eliminates manual protocol configuration; detects frame pulse polarity and selects correct clock/data edge alignment on power-up. |
| Per-Stream Rate Matching | Eight independent RX/TX groups (8 streams each) support mixed data rates simultaneously-enables heterogeneous TDM network interworking. |
| Frame Offset Programming | Adjusts individual RX stream alignment in half-cycle increments up to +7.5 clocks-compensates for path skew in distributed switching fabrics. |
| Bit Error Rate Testing (BERT) | On-chip PRBS generator and error counter accessible via BER register-enables in-system link validation without external test equipment. |
| Group Block Programming | Accelerates Connection Memory initialization: programs entire stream/channel subsets in burst mode, freeing host CPU for real-time call control tasks. |
| RX/TX Internal Bypass | Configurable 1:1 passthrough mode (BYP=1) reduces latency to <5 ns-used for system bring-up, fault isolation, or transparent signal monitoring. |
Applications
| Voice Gateway TDM Switching | Multi-Standard Telecom Line Card |
|---|---|
Use Scenario: Aggregating 64 E1/T1 lines into a single high-capacity backplane interface for VoIP media gateways. IC Role / Device Role / Timing Role: Time slot interchange switch performing dynamic cross-connect between incoming/outgoing PCM frames. Use Value: Enables per-call channel assignment with sub-frame latency (<125 µs) using Variable Delay Mode and eliminates external glue logic via integrated microprocessor interface. | Use Scenario: Supporting simultaneous ST-BUS® and GCI interfaces in a carrier-class access node serving legacy and next-gen equipment. IC Role / Device Role / Timing Role: Protocol-agnostic TSI core handling frame-aligned switching across mixed-interface environments. Use Value: Auto-sensing eliminates manual configuration errors; per-stream rate matching allows concurrent 2.048 Mb/s (E1) and 32.768 Mb/s (STM-1) traffic on shared hardware. |
| DSLAM Channel Concentrator | Industrial TDM Backplane Router |
Use Scenario: Consolidating upstream/downstream ATM cells from multiple ADSL modems into synchronized TDM streams for central office aggregation. IC Role / Device Role / Timing Role: Rate-matching TSI bridging asynchronous DSL framing into synchronous PCM transport. Use Value: Frame offset programming compensates for variable DSL latency; Constant Delay Mode preserves cell alignment across switching stages. | Use Scenario: Providing deterministic time-slot routing in ruggedized railway signaling or power utility SCADA systems requiring −40°C to +85°C operation. IC Role / Device Role / Timing Role: Industrial-grade TSI ensuring jitter-free, frame-intact data forwarding under electromagnetic interference. Use Value: JTAG test access enables field-deployable diagnostics; PBGA package meets IPC-7351B mechanical reliability standards for vibration-prone environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar time slot interchange applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V73262 | Same architecture but 8,192 × 8,192 capacity; lacks OEI pins and group-level rate matching. | Suitable only for mid-density voice switches where full 16K×16K scale and output enable control are unnecessary. | Select IDT72V73262 if system requires lower channel count and reduced PCB routing complexity. |
| PMC-Sierra PM73120 | 16K×16K TSI with integrated framer/mapper; requires external clock synthesis; no JTAG TAP. | Better suited for single-chip framer+TSI solutions but increases BOM cost and reduces debug visibility. | Choose PM73120 only when combining framing and switching functions justifies loss of standalone testability and clock flexibility. |
Compared with IDT72V73262 and PM73120, the IDT72V73263 uniquely balances full-scale non-blocking switching, per-group rate agility, JTAG observability, and industrial temperature resilience-making it optimal for modular, field-serviceable telecom infrastructure where scalability and test access are critical.
Availability
IDT72V73263 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial TDM backplanes, and carrier-grade media gateway designs requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for IDT72V73263 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT) is a fabless semiconductor company specializing in timing, memory interface, RF, and high-performance interconnect solutions for communications and computing markets.
The IDT72V73263 belongs to IDT's TSI digital switch product line, engineered specifically for carrier-class time-division multiplexing systems requiring deterministic latency, protocol flexibility, and scalable channel density in voice and data transport networks.
FAQ
What is the maximum serial data rate supported by the IDT72V73263?
The IDT72V73263 supports serial data rates of 2.048 Mb/s, 4.096 Mb/s, 8.192 Mb/s, 16.384 Mb/s, and 32.768 Mb/s on both RX and TX streams. At 32.768 Mb/s, it achieves its full 16,384 × 16,384 non-blocking channel capacity. The device uses a fixed 32.768 MHz master clock (C32i) to derive all lower rates through internal clock division, maintaining precise bit alignment across modes.
How does the IDT72V73263 handle mixed data rates across its 64 input streams?
The IDT72V73263 divides its 64 RX streams into eight groups of eight, each independently configurable via the Receive Data Rate Selection Register (RDRSR). This allows simultaneous operation at different rates-for example, Group 0 at 2.048 Mb/s (E1) and Group 1 at 32.768 Mb/s (STM-1)-without cross-group interference. Rate matching is applied per group, preserving frame synchronization within each stream set.
What is the purpose of the OEI pins on the IDT72V73263, and how are they used?
The OEI (Output Enable Indication) pins (OEI0–OEI55) on the IDT72V73263 are multiplexed with TX outputs and reflect the real-time high-impedance or active state of their corresponding TX drivers. When enabled via TDRSR configuration, these pins allow external drivers or bus transceivers to be controlled synchronously with the IDT72V73263's output state-critical for building larger switching matrices using multiple IDT72V73263 devices without signal contention.
Can the IDT72V73263 operate in a bypass mode, and what is its latency impact?
Yes, the IDT72V73263 supports RX/TX internal bypass mode via the BYP bit in the Control Register. When activated, all RX inputs are directly routed to corresponding TX outputs, bypassing Connection/Data Memory and delay logic. This reduces end-to-end latency to under 5 ns-ideal for system initialization, loopback testing, or transparent signal monitoring-while retaining full JTAG and microprocessor accessibility.
Does the IDT72V73263 support automatic frame synchronization detection, and which protocols are recognized?
Yes, the IDT72V73263 automatically detects and adapts to ST-BUS® and GCI frame formats using the F32i frame pulse input. It identifies polarity and selects appropriate clock/data edge relationships-falling-edge TX for ST-BUS®, rising-edge TX for GCI-eliminating manual configuration. This detection occurs at power-up and remains active during normal operation, enabling plug-and-play interoperability across multi-vendor TDM networks.
72V73263BB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- 72V
- Package/Case:
- 208-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Multiplexer
- Circuit:
- 8 x 1:1
- Independent Circuits:
- -
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-PBGA (17x17)
72V73263BB FAQ
1.How can I place an order for 72V73263BB through Aetrix?
Please submit a Request for Quotation (RFQ) for 72V73263BB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 72V73263BB reliable?
The price and inventory of 72V73263BB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 72V73263BB is usually 5 days.
3.What payment methods are accepted for 72V73263BB?
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4.How is shipping managed for 72V73263BB?
72V73263BB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 72V73263BB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 72V73263BB?
For technical support, including 72V73263BB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 72V73263BB requirements.
6.How does Aetrix verify that 72V73263BB is sourced from the original manufacturer or authorized distributors?
All 72V73263BB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 72V73263BB meets industry standards.
7.What is the process for return or replacement of 72V73263BB?
All 72V73263BB units undergo pre-shipment inspection (PSI). If there is an issue with 72V73263BB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 72V73263BB part is unused and in its original packaging.
Return procedure for 72V73263BB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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