Renesas 72V73263BBG
- Part No.:
- 72V73263BBG
- Manufacturer:
- Renesas
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 208-BGA
- Datasheet:
-
72V73263BBG.pdf
- Description:
- IC MULTIPLEXER 8 X 1:1 208PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IDT72V73263 from Integrated Device Technology is a 3.3 V, 208-pin PBGA time slot interchange (TSI) digital switch with non-blocking 16,384 × 16,384 channel capacity, supporting serial data rates up to 32.768 Mb/s across 64 RX and 64 TX streams, and featuring per-channel variable/constant delay modes for voice/data TDM applications in telecom infrastructure.
For engineers reviewing the IDT72V73263 datasheet, IDT72V73263 pinout, IDT72V73263 application, or IDT72V73263 equivalent, key selection considerations include ST-BUS®/GCI auto-sensing, JTAG IEEE-1149.1 test port, rate-matching across eight RX/TX stream groups, frame offset programming, and microprocessor-accessible Data/Connection Memory mapping via 16-bit address/data bus.
Technical Context
The IDT72V73263 implements a dual-mode TSI architecture with independent Data Memory (serial-to-parallel input buffering) and Connection Memory (per-stream/channel routing control), enabling both Processor Mode (microprocessor writes to TX time slots) and Connection Mode (stream-to-stream switching). Its 32.768 MHz master clock (C32i) synchronizes all operations, including automatic polarity detection for ST-BUS® and GCI serial interfaces.
Throughput delay is programmable per channel: Variable Delay Mode (MOD2–0 = 000) achieves minimum latency (≥3 channel periods at slower rate), while Constant Delay Mode (MOD2–0 = 001) guarantees frame integrity via double-buffered memory with fixed one-frame-plus-one-channel delay. Frame Offset allows ±7.5 clock-cycle alignment per RX stream relative to F32i.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Switch Capacity | 16,384 × 16,384 non-blocking channels at 32.768 Mb/s - enables full TDM cross-connect without contention in large-scale voice/data concentrators. |
| Serial I/O Count | 64 RX inputs and 64 TX outputs - supports dense aggregation of E1/T1/J1, PCM, or N×64 kbit/s streams in central office or access node equipment. |
| Data Rates | 2.048 / 4.096 / 8.192 / 16.384 / 32.768 Mb/s - matches standard telephony framing (32, 64, 128, 256, or 512 channels per 125 µs frame). |
| Delay Modes | Per-channel Variable (min latency) or Constant (frame-aligned) throughput - selectable via MOD2–0 bits in Connection Memory HIGH for mixed voice/data traffic. |
| Microprocessor Interface | 16-bit address (A0–A15) + 16-bit data (D0–D15) + R/W, CS, DS, DTA/BEH - maps internal memories as RAM-like space using MS1–0 bits in Control Register. |
| JTAG Support | IEEE-1149.1 compliant TAP (TCK, TMS, TDI, TDO, TRST) - enables boundary-scan testing and in-system debug without external logic analyzers. |
| Operating Temp | −40°C to +85°C industrial range - validated for deployment in uncontrolled telecom cabinets and outdoor base station enclosures. |
| Supply Voltage | 3.3 V ± 0.3 V - low-power operation compatible with modern telecom power distribution architectures and reduces thermal load in high-density line cards. |
Pinout & Package
Package: 208-pin Plastic Ball Grid Array (PBGA), 17 mm × 17 mm, 1.0 mm pitch (order code BB). Thermal and mechanical design optimized for telecom-grade board assembly and long-term reliability under thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| C32i | Master Clock Input | 32.768 MHz reference driving all internal timing; determines bit sampling edges for all serial rates via clock division. |
| F32i | Frame Pulse Input | 8 kHz (125 µs frame) sync signal; auto-identifies ST-BUS®/GCI polarity and anchors frame boundaries for Data Memory addressing. |
| RX0–RX63 | Serial Data Inputs | 64 differential-capable single-ended inputs accepting configurable data rates; each mapped to dedicated Data Memory rows. |
| TX0–TX63 / OEI0–OEI55 | Serial Outputs / Output Enable Indication | 64 TX outputs with optional OEI pins per group (e.g., TX8/OEI0); OEI reflects active/Hi-Z state when enabled in TDRSR. |
| A0–A15, D0–D15, R/W, CS, DS | Microprocessor Bus | Standard 16-bit parallel interface; supports synchronous (BEL/DTA/BEH) or asynchronous timing; enables direct read/write to all internal memories. |
| ODE, OSB | Output Driver Control | Global TX enable (ODE) and standby (OSB) pins - combined with CR bit OSB, they force all TX outputs into Hi-Z for safe initialization or fault isolation. |
| TCK, TMS, TDI, TDO, TRST | JTAG Test Port | Full IEEE-1149.1 boundary-scan interface - allows production test, in-circuit verification, and debug without halting system operation. |
Key Features
| Feature | Design Value |
|---|---|
| Rate Matching | Independent RX/TX data rate selection across eight groups of eight streams - eliminates need for external elastic stores in multi-rate TDM networks. |
| Per-Channel Delay Control | Variable or Constant mode selected per output channel via MOD2–0 bits - preserves voice latency requirements while ensuring data frame coherency. |
| Frame Offset Programming | ±7.5 C32i clock-cycle adjustment per RX stream - compensates for inter-stream skew in distributed clocking or cascaded TSI systems. |
| Block Memory Programming | Full or group-wise Connection Memory initialization in two frames - reduces microprocessor overhead during boot-up or dynamic reconfiguration. |
| ST-BUS®/GCI Auto-Sensing | Automatic detection of frame pulse polarity and protocol - simplifies integration into heterogeneous legacy and next-gen telecom platforms. |
| Bit Error Rate Testing | On-chip PRBS generator and BER counter accessible via BERR register - enables in-system link validation without external test equipment. |
Applications
| Telecom Central Office Switching | Wireless Base Station Backhaul |
|---|---|
Use Scenario: Aggregating and switching E1/T1 feeds between PSTN gateways, softswitches, and media gateways in Class 5 switches. IC Role / Device Role / Timing Role: Time slot interchange switch performing non-blocking 16k×16k channel mapping with frame-aligned constant delay for circuit-switched voice trunking. Use Value: Maintains strict 125 µs frame integrity across all switched paths, enabling seamless interworking with legacy SS7 and ISUP signaling stacks. | Use Scenario: Interfacing between remote radio units (RRUs) and baseband units (BBUs) in LTE/5G macro cells using CPRI or OBSAI over TDM transport. IC Role / Device Role / Timing Role: TSI device aligning and multiplexing multiple 2.048/8.192 Mb/s framer outputs into unified backhaul streams with sub-microsecond jitter control. Use Value: Enables precise time synchronization across distributed antenna systems by eliminating variable latency in TDM-based fronthaul timing recovery. |
| VoIP Media Gateway | Digital Loop Carrier (DLC) Systems |
Use Scenario: Bridging analog POTS lines to IP networks via TDM-over-IP gateways requiring real-time PCM time-slot manipulation. IC Role / Device Role / Timing Role: Low-latency TSI operating in Variable Delay Mode to minimize end-to-end voice path delay (< 5 ms) while supporting dynamic channel allocation. Use Value: Achieves MOS ≥ 4.0 by reducing algorithmic and transport delay contributions - critical for carrier-grade VoIP service SLAs. | Use Scenario: Concentrating subscriber line signals in rural or suburban DLC nodes where bandwidth-efficient TDM grooming is required before fiber backhaul. IC Role / Device Role / Timing Role: High-density TSI switching 64×64 streams at 2.048 Mb/s to consolidate 256+ POTS lines onto fewer E1 trunks. Use Value: Reduces required E1 ports by >40% through intelligent time-slot packing, lowering OPEX for copper plant maintenance and leased line costs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar time slot interchange applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V73262 | 16,384 × 16,384 capacity but limited to 16.384 Mb/s max data rate; lacks per-stream frame offset and enhanced block programming. | Suitable for cost-sensitive E1-only systems without GCI support or multi-rate aggregation needs. | Select IDT72V73262 only if 32.768 Mb/s operation and ST-BUS®/GCI auto-sensing are not required. |
| PMC-Sierra PM73120 | Same 64×64 I/O count and 32.768 Mb/s capability but uses different memory mapping and lacks integrated JTAG; requires external configuration EEPROM. | Better suited for legacy PMC designs with existing firmware toolchains and no requirement for on-chip BER testing. | Choose PM73120 only when migrating from prior PMC TSI platforms and JTAG debug is handled externally. |
Compared with IDT72V73262 and PM73120, the IDT72V73263 provides broader data rate support (up to 32.768 Mb/s), integrated frame offset calibration, and on-die JTAG/BERT - making it optimal for new deployments requiring flexibility, testability, and future-proofing in evolving TDM/IP hybrid networks.
Availability
IDT72V73263 is available at Aetrix Electronics and suitable for telecom central office switching, wireless base station backhaul, VoIP media gateway, and digital loop carrier systems requiring stable component supply, long lifecycle support, and traceable sourcing.
Supply support for IDT72V73263 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and high-performance interconnect solutions for communications and computing markets.
The IDT72V73263 belongs to IDT's TSI digital switch product line, engineered specifically for carrier-grade time-division multiplexing infrastructure where deterministic latency, frame integrity, and multi-protocol interoperability are mandatory.
FAQ
What is the maximum data rate supported by the IDT72V73263?
The IDT72V73263 supports serial data rates of 2.048 Mb/s, 4.096 Mb/s, 8.192 Mb/s, 16.384 Mb/s, and 32.768 Mb/s on both RX and TX streams. The highest rate - 32.768 Mb/s - enables 512 time slots per 125 µs frame and is used in high-density E4/STM-1 and CPRI applications. All rates derive from the 32.768 MHz master clock (C32i) with integer division.
How does the IDT72V73263 handle frame synchronization across mixed-rate streams?
The IDT72V73263 uses the F32i frame pulse input to anchor all internal timing. Each RX stream can be assigned an independent frame offset (±7.5 C32i cycles) via the FOR registers, allowing precise alignment of asynchronous incoming frames. This ensures consistent time-slot mapping even when aggregating streams from different clock domains or network elements.
Can the IDT72V73263 operate in both ST-BUS® and GCI modes simultaneously?
No - the IDT72V73263 automatically detects and locks to either ST-BUS® or GCI protocol based on the polarity of the F32i frame pulse at power-up or reset; it does not support concurrent dual-protocol operation. Once detected, the interface timing (data edge alignment relative to C32i) is fixed for that session until reinitialized.
What is the purpose of the ODE and OSB pins on the IDT72V73263?
The ODE (Output Drive Enable) and OSB (Output Standby) pins provide hardware-level control over TX driver states. When both ODE = 0 and OSB = 0, all 64 TX outputs enter high-impedance - essential for safe power-up initialization, hot-swap scenarios, or fault containment. Their status is mirrored in Control Register bit OSB for software coordination.
Does the IDT72V73263 support bit error rate testing without external equipment?
Yes - the IDT72V73263 integrates a PRBS generator and BER counter. Writing SBER = 1 in the Control Register initiates on-chip pattern transmission and error counting; results are stored in the BERR register. This enables in-system link validation during manufacturing test or field diagnostics without requiring external BERT instruments.
72V73263BBG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- 72V
- Package/Case:
- 208-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Multiplexer
- Circuit:
- 8 x 1:1
- Independent Circuits:
- -
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-PBGA (17x17)
72V73263BBG FAQ
1.How can I place an order for 72V73263BBG through Aetrix?
Please submit a Request for Quotation (RFQ) for 72V73263BBG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 72V73263BBG reliable?
The price and inventory of 72V73263BBG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 72V73263BBG is usually 5 days.
3.What payment methods are accepted for 72V73263BBG?
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Once your 72V73263BBG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 72V73263BBG?
For technical support, including 72V73263BBG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 72V73263BBG requirements.
6.How does Aetrix verify that 72V73263BBG is sourced from the original manufacturer or authorized distributors?
All 72V73263BBG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 72V73263BBG meets industry standards.
7.What is the process for return or replacement of 72V73263BBG?
All 72V73263BBG units undergo pre-shipment inspection (PSI). If there is an issue with 72V73263BBG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 72V73263BBG part is unused and in its original packaging.
Return procedure for 72V73263BBG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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