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Renesas 72V73273BBG

Part No.:
72V73273BBG
Manufacturer:
Renesas
Category:
Signal Switches, Multiplexers, Decoders
Package:
208-BGA
Datasheet:
Aetrix72V73273BBG.pdf
Description:
IC MULTIPLEXER 8 X 1:1 208PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,921

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Product details

Overview

IDT72V73273BBG from Integrated Device Technology is a 3.3 V, 208-pin PBGA time slot interchange (TSI) digital switch with non-blocking 32,768 × 32,768 channel capacity, supporting serial data rates up to 32.768 Mb/s across 64 RX and 64 TX streams, and featuring per-channel variable/constant delay modes for voice/data TDM applications in telecom infrastructure.

For engineers reviewing the IDT72V73273BBG datasheet, IDT72V73273BBG pinout, IDT72V73273BBG application, or IDT72V73273BBG equivalent, key selection considerations include ST-BUS®/GCI auto-sensing, JTAG test access, rate-matching across eight RX/TX stream groups, microprocessor-controlled connection memory, and frame offset programming for skew compensation.

Technical Context

The IDT72V73273BBG implements a dual-memory architecture with separate Data Memory (for serial-to-parallel input storage) and Connection Memory (LOW/HIGH for path mapping and per-channel control), synchronized to a 32.768 MHz master clock (C32i). It supports both Processor Mode (microprocessor writes to TX time slots) and Connection Mode (stream-to-stream switching via address mapping).

Its serial interface handles ST-BUS® and GCI protocols with automatic frame polarity detection, and provides independent RX/TX data rate selection (2.048–32.768 Mb/s) per group of eight streams. Delay behavior is programmable per channel: Variable Delay Mode minimizes latency (≥3 channel periods), while Constant Delay Mode ensures frame integrity (n+2 frame readout).

Key Specifications

Parameter Value and Actual Design Meaning
Switch Capacity32,768 × 32,768 non-blocking channels at 32.768 Mb/s - enables full TDM matrix switching without contention in E1/T1/J1 backplanes.
Serial I/O Count64 RX inputs and 64 TX outputs - supports dense TDM aggregation in multi-port voice gateways and SS7 signaling nodes.
Data Rate Support2.048 / 4.096 / 8.192 / 16.384 / 32.768 Mb/s per stream group - matches E1 (2.048 Mb/s), T1 (1.544 Mb/s via derived timing), and wideband data framing.
Delay ModesPer-channel Variable Delay (min latency) or Constant Delay (frame-aligned n+2 output) - selectable via MOD2–0 bits in Connection Memory HIGH.
Microprocessor Interface16-bit address (A0–A15), 16-bit data (D0–D15), CS/R/W/DS/DTA-BEH/S-A - maps to Control Register, TDRSR/RDRSR, FOR, BER, and 32K-word Connection/Data Memory.
JTAG ComplianceIEEE-1149.1 Test Access Port (TCK/TMS/TDI/TDO/TRST) - enables boundary scan testing and in-system debug of interconnect integrity.
Operating Temperature−40°C to +85°C - qualified for industrial-grade telecom equipment deployed in uncontrolled environments.
Package208-ball PBGA, 17 mm × 17 mm, 1.0 mm pitch - compatible with standard SMT reflow profiles and high-density PCB layouts.

Pinout & Package

208-ball Plastic Ball Grid Array (PBGA), 17 mm × 17 mm, 1.0 mm pitch, RoHS-compliant. Thermal pad exposed on underside for enhanced heat dissipation in sustained switching operation.

Pin/Terminal Circuit Role Design Meaning
A0–A15Address InputsSelect internal register or memory location (Control, TDRSR, RDRSR, FOR, BER, CM LOW/HIGH, DM) per Table 1 mapping.
D0–D15Bidirectional Data BusTransfers configuration data, connection paths, and status values; BEH/BEH or DTA function depends on S/A mode.
C32iMaster Clock Input32.768 MHz reference driving all serial I/O timing; determines bit period resolution (1–16 clocks/bit depending on data rate).
F32iFrame Pulse Input8 kHz (125 µs frame) sync signal; auto-identified as ST-BUS® (active-high) or GCI (active-low) for protocol alignment.
RX0–RX63Serial Data Inputs64 differential-capable single-ended inputs accepting 2.048–32.768 Mb/s streams; each group of 8 supports independent rate selection.
TX0–TX63 / OEI0–OEI55Serial Outputs / Output Enable Indication64 TX outputs with optional OEI pins reflecting per-group driver state (active/Hi-Z); OEI function enabled via TDRSR configuration.
ODEGlobal Output Drive EnableActive-low control: when ODE = LOW and OSB = LOW, all TX drivers enter Hi-Z - used during initialization and safe power sequencing.
RESETHardware ResetActive-low asynchronous reset clearing internal registers, counters, and forcing TX/DATA bus into Hi-Z; minimum pulse width 20 ns.
TCK/TMS/TDI/TDO/TRSTJTAG Test PortFull IEEE-1149.1 boundary scan support; TRST initializes TAP controller; TDO is Hi-Z when scan disabled.

Key Features

Feature Design Value
Per-channel delay mode selectionMOD2–0 bits in Connection Memory HIGH configure Variable Delay (000), Constant Delay (001), BERT (101), or Hi-Z (111) per output channel.
Rate matching across 8 stream groupsRX/TX data rates independently configurable in eight groups of eight streams - enables mixed-rate TDM interworking (e.g., E1 ↔ T1 gateway).
Frame offset programmingPer-stream frame delay offset adjustable in half-cycle increments up to +7.5 cycles - compensates for physical trace skew between line cards.
Microprocessor-accessible memoriesDirect random access to 32K-word Connection Memory (LOW/HIGH) and Data Memory via standard RAM-like interface - eliminates polling overhead.
TX/RX internal bypass modeBYP bit in Control Register shorts RX to TX with <5 ns latency - validates signal integrity and simplifies bring-up by making TSI transparent.
Automatic ST-BUS®/GCI detectionF32i polarity sensing identifies protocol without external configuration - reduces firmware complexity and supports hot-plug line card interoperability.

Applications

Voice Gateway TDM Switching SS7 Signaling Node

Use Scenario: Aggregating 64 E1 trunks (2.048 Mb/s) into a centralized voice switch fabric with dynamic time-slot reassignment.

IC Role / Device Role / Timing Role: Time slot interchange (TSI) core performing non-blocking 32k×32k channel switching with per-channel constant delay mode to preserve frame alignment.

Use Value: Enables carrier-grade call routing with guaranteed 125 µs frame boundaries and zero packetization jitter across all switched paths.

Use Scenario: Interfacing multiple SS7 MTP2 links operating at 512 kb/s–2.048 Mb/s to a central signal transfer point (STP).

IC Role / Device Role / Timing Role: Protocol-transparent TDM switch providing rate-matched bridging between heterogeneous signaling links using per-group RX/TX rate selection.

Use Value: Eliminates external rate adaptation logic and allows single-chip handling of mixed-speed SS7 traffic with deterministic latency.

Multi-Service Access Platform VoIP Media Gateway

Use Scenario: Consolidating legacy TDM voice, ISDN PRI, and leased-line data onto IP backhaul using TDM-over-IP encapsulation.

IC Role / Device Role / Timing Role: TSI acting as front-end concentrator with frame offset compensation to align skewed line-card inputs before packetization.

Use Value: Reduces end-to-end jitter by synchronizing up to 64 asynchronous TDM sources to a common 8 kHz clock domain prior to RTP timestamping.

Use Scenario: Bridging PSTN TDM interfaces (E1/T1) to VoIP DSP resources requiring precise time-slot extraction and insertion.

IC Role / Device Role / Timing Role: Per-channel variable delay mode routes low-latency voice time slots directly to codec buffers while delaying control channels for processing.

Use Value: Achieves sub-1 ms one-way voice path latency for real-time telephony while maintaining separation between media and signaling planes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar time slot interchange applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V73272BBGSame architecture but 16,384 × 16,384 channel capacity; identical pinout and register map; lower maximum data rate (16.384 Mb/s).Suitable for smaller-scale E1-only systems with ≤32 RX/TX streams and no 32.768 Mb/s requirement.Select IDT72V73272BBG only if full 32k×32k scale and 32.768 Mb/s support are unnecessary - reduces cost and power without changing layout.
PMC432-208208-pin PBGA TSI with 32,768 × 32,768 capacity; supports same data rates but lacks JTAG, BERT, and per-stream frame offset; uses parallel microprocessor interface with different address mapping.Targeted at cost-sensitive industrial TDM muxes where testability and fine-grained skew control are secondary.Choose PMC432-208 only when JTAG debug, Bit Error Rate testing, or sub-cycle frame alignment are not required - verify microprocessor interface compatibility before substitution.

Compared with IDT72V73273BBG, IDT72V73272BBG offers identical feature set at reduced scale and cost, while PMC432-208 trades advanced diagnostics and timing precision for simpler integration - neither is pin-compatible nor drop-in, requiring firmware and layout review.

Availability

IDT72V73273BBG is available at Aetrix Electronics and suitable for telecom infrastructure, SS7 signaling nodes, and multi-service access platforms requiring stable component supply, long lifecycle support, and industrial temperature operation.

Supply support for IDT72V73273BBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory interface, and RF products for communications, computing, and industrial markets.

IDT72V73273BBG belongs to IDT's TSI digital switch family, engineered specifically for carrier-class TDM time-slot interchange in voice/data telecom systems with emphasis on non-blocking scalability, protocol flexibility, and system-level debugability.

FAQ

What is the maximum data rate supported by the IDT72V73273BBG on individual serial streams?

The IDT72V73273BBG supports serial data rates of 2.048 Mb/s, 4.096 Mb/s, 8.192 Mb/s, 16.384 Mb/s, and 32.768 Mb/s per stream group. The 32.768 Mb/s rate corresponds to 512 channels per 125 µs frame and requires the C32i master clock at exactly 32.768 MHz. All rates are independently selectable for RX and TX groups via the Receive/Transmit Data Rate Selection Registers (RDRSR/TDRSR).

How does the IDT72V73273BBG handle frame synchronization across mixed-rate streams?

The IDT72V73273BBG uses the F32i frame pulse input to establish an 8 kHz (125 µs) reference for all internal memory addressing and switching operations. It automatically detects ST-BUS® (active-high) or GCI (active-low) frame polarity and supports per-stream frame offset programming in half-cycle increments up to +7.5 cycles - enabling precise alignment of skewed inputs from different line cards or protocols.

Can the IDT72V73273BBG operate in a fully transparent bypass mode?

Yes. When the BYP bit (bit 14) in the Control Register is set to 1, the IDT72V73273BBG activates RX/TX internal bypass mode, electrically shorting each RX input directly to its corresponding TX output with less than 5 ns propagation delay. This mode disables all internal switching logic and memory access, making the device functionally invisible for signal integrity validation and system bring-up.

What memory resources are accessible via the microprocessor interface of the IDT72V73273BBG?

The IDT72V73273BBG exposes three main memory spaces via its 16-bit address/data bus: Control Register (0x00XX), Transmit/Receive Data Rate Selection Registers (TDRSR/RDRSR), Frame Offset Registers (FOR0–FOR15), Bit Error Rate registers (BER/BERR), and two 32K-word blocks - Connection Memory LOW (path addresses) and Connection Memory HIGH (per-channel mode/control bits) - selected using MS1–0 bits in the Control Register.

Does the IDT72V73273BBG support JTAG boundary scan testing?

Yes. The IDT72V73273BBG integrates a full IEEE-1149.1 compliant JTAG Test Access Port with dedicated TCK, TMS, TDI, TDO, and TRST pins. This enables boundary scan testing of PCB interconnects, visibility into internal register states, and in-system programming of configuration registers - critical for high-reliability telecom equipment validation and field diagnostics.

72V73273BBG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
72V
Package/Case:
208-BGA
Packaging:
Tray
Product Status:
Active
Type:
Multiplexer
Circuit:
8 x 1:1
Independent Circuits:
-
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-PBGA (17x17)

72V73273BBG FAQ

1.How can I place an order for 72V73273BBG through Aetrix?

Please submit a Request for Quotation (RFQ) for 72V73273BBG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 72V73273BBG reliable?

The price and inventory of 72V73273BBG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 72V73273BBG is usually 5 days.

3.What payment methods are accepted for 72V73273BBG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 72V73273BBG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 72V73273BBG?

72V73273BBG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 72V73273BBG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 72V73273BBG?

For technical support, including 72V73273BBG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 72V73273BBG requirements.

6.How does Aetrix verify that 72V73273BBG is sourced from the original manufacturer or authorized distributors?

All 72V73273BBG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 72V73273BBG meets industry standards.

7.What is the process for return or replacement of 72V73273BBG?

All 72V73273BBG units undergo pre-shipment inspection (PSI). If there is an issue with 72V73273BBG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 72V73273BBG part is unused and in its original packaging.

Return procedure for 72V73273BBG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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