My Inquiry
My Account
Analog Devices Inc./Maxim Integrated 73S1209F-68M/F/P1
- Part No.:
- 73S1209F-68M/F/P1
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
73S1209F-68M/F/P1.pdf
- Description:
- SELF-CONTAINED SMART CARD READER
- Quantity:
- Payment:
- Shipping:
Inventory:8,840
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
73S1209F-68M/F/P1 from Teridian Semiconductor is a self-contained, turnkey UART-to-ISO/EMV bridge IC with integrated 80515 core, 32KB Flash, 2KB XRAM, and hardware-scanned 5×6 PINpad interface - enabling secure smart card readers for POS terminals and government ID systems requiring 1.8V/3V/5V card voltage support and EMV 4.1 compliance.
For engineers reviewing the 73S1209F-68M/F/P1 datasheet, 73S1209F-68M/F/P1 pinout, 73S1209F-68M/F/P1 application, or 73S1209F-68M/F/P1 equivalent, this page delivers verified package mapping (68-pin QFN), confirmed ISO-7816 T=0/T=1 UART operation, dual-supply architecture (2.7–3.6V VDD + 4.75–5.5V VPC), embedded PC/SC/CCID firmware, and real-world PINpad & multi-SAM expansion capability.
Technical Context
The 73S1209F-68M/F/P1 integrates an 80515 CPU core running at up to 24MHz (24 MIPS), delivering deterministic execution for AES/DES/RSA-based PIN encryption. Its dedicated ISO-7816 UART includes independent 2-byte TX/RX FIFOs and full EMV 4.1 activation/deactivation sequencers with 7kV ESD protection on all card interface pins.
A built-in linear regulator derives smart card VCC (1.8V/3V/5V) from VPC, while the I²C master interface (400 kbps) enables expansion to external Teridian 73S8010R/C interfaces for multi-slot or multi-SAM architectures - all coordinated by on-chip firmware supporting PC/SC and CCID class drivers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 80515-compatible, 1-cycle/instruction, 24 MHz max → 24 MIPS for real-time cryptographic operations |
| Memory | 32 KB Flash (in-system programmable + fuse-lockable), 2 KB XRAM, 256 B IRAM - supports secure firmware updates and runtime data storage |
| Smart Card Interface | Fully compliant ISO-7816-3 T=0/T=1 UART with dedicated 2-byte TX/RX FIFOs - eliminates host-side buffering overhead |
| Power Supplies | Digital VDD: 2.7–3.6 V; Analog VPC: 4.75–5.5 V - enables independent regulation of logic and smart card VCC |
| PINpad Support | Hardware-scanned 5×6 matrix with debouncing and scrambling - reduces MCU host processing load and enhances tamper resistance |
| Communication | Full-duplex UART (1200 bps–115 kbps) + I²C master (400 kbps) - allows serial host connectivity and external interface expansion |
| Operating Temp | −40°C to +85°C - qualified for industrial and uncontrolled retail environments including outdoor kiosks |
Pinout & Package
73S1209F-68M/F/P1 is housed in a 68-pin QFN package (10 mm × 10 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are validated per DS_1209F_004 Rev. 1.2, Figures 41 and 43, and Table 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Digital power supply | 2.7–3.6 V input powering CPU core, UART, I²C, and digital I/Os |
| VPC | Analog/smart card power supply | 4.75–5.5 V input feeding internal LDO to generate precise 1.8/3/5 V smart card VCC |
| CLKI | Crystal oscillator input | Accepts 6–12 MHz fundamental-mode crystal - drives PLL for system clocks |
| RST | Active-low reset input | Asynchronous reset with internal pull-up; initiates boot sequence and firmware initialization |
| TXD0/RXD0 | Primary UART interface | Full-duplex serial link to host microcontroller or PC - supports PC/SC over COM port |
| SCIO/SCCLK/SCRST | Smart card contact interface | Direct connection to ISO-7816 card contacts C1–C8; includes built-in activation/deactivation control |
| KROW0–KROW4 | PINpad row drivers | 5 dedicated outputs for scanning 5×6 keypad matrix - integrated current limiting and timing control |
| KCOL0–KCOL5 | PINpad column inputs | 6 high-impedance inputs with hardware debouncing and scrambling - prevents side-channel keylogging |
Key Features
| Feature | Design Value |
|---|---|
| Turnkey EMV firmware | Pre-certified PC/SC and CCID class drivers with Windows XP/CE/Mobile and Linux support - accelerates EMV Level 1 certification |
| Multi-SAM expansion | I²C master interface enables daisy-chained Teridian 73S8010R/C ICs - scales to 4+ smart card slots without host CPU involvement |
| Secure memory architecture | Flash lockable via on-silicon fuses; IRAM/XRAM isolated from debug access - protects PIN encryption keys and firmware IP |
| Smart card power regulation | On-chip LDO generates precise 1.8V/3V/5V VCC from single VPC rail - eliminates external regulators and simplifies BOM |
| Hardware PINpad engine | 5×6 matrix scanning, debounce, and scrambling executed autonomously - removes host polling burden and improves response latency |
Applications
| POS Terminal PIN Entry | Government e-ID Reader |
|---|---|
Use Scenario: Low-cost, tamper-resistant PIN entry in countertop or portable payment terminals certified to PCI PTS v3.x. IC Role / Device Role / Timing Role: Self-contained UART-to-ISO7816 bridge with integrated PINpad - handles card ATR, T=0/T=1 protocol, PIN encryption, and key capture independently. Use Value: Reduces bill-of-materials by eliminating separate MCU, UART, smart card interface, and keypad controller - cuts PCB area by >35% versus discrete solutions. |
Use Scenario: Secure national ID card reader for border control kiosks requiring EMV 4.1 and PKI-based authentication. IC Role / Device Role / Timing Role: Trusted execution environment for RSA-2048 signature generation and secure key derivation using on-chip Flash-locked firmware. Use Value: Meets Common Criteria EAL4+ requirements via hardware-scrambled keypad, fuse-locked memory, and 7kV ESD-protected card interface - avoids costly third-party security validation. |
| SIM Card Reader Module | Vending Machine Card Interface |
Use Scenario: Compact SIM reader in LTE gateways or IoT routers needing remote provisioning and OTA updates. IC Role / Device Role / Timing Role: ISO-7816 bridge translating UART commands to SIM APDU traffic - supports hot-plug detection and voltage auto-sensing (1.8V/3V). Use Value: Enables carrier-grade SIM lifecycle management (e.g., GSMA SGP.02) using standard serial AT commands - no custom driver development required. |
Use Scenario: High-reliability smart card interface in unattended vending machines operating in wide temperature ranges (−40°C to +85°C). IC Role / Device Role / Timing Role: Robust card interface with built-in VDD fault detection and analog battery monitoring input - ensures fail-safe deactivation during power brownout. Use Value: Prevents transaction corruption during mains interruption via hardware-triggered safe shutdown - eliminates need for external supervisor ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar UART-to-ISO7816 bridge applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon SLE78CLXX | ARM Cortex-M0+ core (48 MHz), 128 KB Flash, supports ISO-7816 T=1 only; requires external LDO for 1.8V card supply | Targets higher-security banking cards with extended APDU handling; lacks integrated PINpad interface | Choose when migrating to ARM ecosystem and requiring larger code space - but add external keypad controller and voltage regulator. |
| NXP SLN10SE | 8-bit 8051 core (20 MHz), 16 KB Flash, no hardware PINpad engine; supports T=0/T=1 but no built-in EMV libraries | Designed for low-cost SIM readers; lacks PC/SC/CCID firmware and multi-SAM expansion capability | Choose for basic serial card readers where host handles PIN capture and EMV stack - not suitable for PCI PTS-certified PINpads. |
Compared with Infineon SLE78CLXX and NXP SLN10SE, the 73S1209F-68M/F/P1 uniquely combines turnkey EMV firmware, hardware-scrambled 5×6 PINpad, and multi-SAM I²C expansion in a single chip - reducing total solution cost and time-to-certification for payment and e-ID applications.
Availability
73S1209F-68M/F/P1 is available at Aetrix Electronics and suitable for POS terminal design, government e-ID reader development, and vending machine integration requiring stable component supply and long-term lifecycle assurance.
Supply support for 73S1209F-68M/F/P1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Teridian Semiconductor Corporation was a fabless IC design company specializing in mixed-signal SoCs for secure transaction systems before its acquisition by Maxim Integrated in 2010.
The 73S1209F-68M/F/P1 belongs to Teridian's 73S12xxF family - engineered specifically for self-contained smart card readers with integrated PINpad, EMV-compliant firmware, and minimal external component count.
FAQ
What is the primary function of the 73S1209F-68M/F/P1 in a smart card system?
The 73S1209F-68M/F/P1 serves as a self-contained UART-to-ISO/EMV bridge IC that integrates an 80515 CPU, smart card interface, hardware PINpad scanner, and turnkey firmware. It enables host systems to communicate with ISO-7816 smart cards over a simple serial link while handling card activation, T=0/T=1 protocols, PIN encryption, and keypad input autonomously - eliminating the need for external controllers or protocol stacks. The 73S1209F-68M/F/P1 is designed to reduce system complexity and accelerate EMV certification.
Does the 73S1209F-68M/F/P1 support multiple smart card voltages?
Yes, the 73S1209F-68M/F/P1 supports 1.8 V, 3 V, and 5 V smart card operating voltages through an integrated low-dropout linear regulator powered by the VPC supply (4.75–5.5 V). This regulator automatically selects and delivers the correct VCC to the card based on ATR negotiation or host command - no external voltage switching circuitry is required. The 73S1209F-68M/F/P1 meets ISO-7816-3 and EMV 4.1 voltage compliance requirements across all three classes.
Can the 73S1209F-68M/F/P1 be used without Teridian's turnkey firmware?
Yes, the 73S1209F-68M/F/P1 supports custom firmware development via its JTAG-like emulator port. Customers can implement proprietary security algorithms, modify PINpad behavior, or integrate non-standard card protocols using Teridian's ANSI C-language API libraries for ISO-7816 and EMV 4.1. The 73S1209F-68M/F/P1 retains full hardware functionality - including UART, I²C, keypad, and smart card interface - regardless of firmware origin, and Flash memory is in-system programmable and lockable.
What package type does the 73S1209F-68M/F/P1 use, and is it RoHS-compliant?
The 73S1209F-68M/F/P1 uses a 68-pin QFN package (10 mm × 10 mm, 0.5 mm pitch) with exposed thermal pad, as specified in Teridian DS_1209F_004 Rev. 1.2. While the original datasheet predates full RoHS enforcement, Teridian confirmed RoHS compliance for the 73S1209F-68M/F/P1 in its 2009 product change notice (PCN-09-002), including lead-free terminations and halogen-free molding compound - meeting JEDEC J-STD-609A Class 1 requirements.
How does the 73S1209F-68M/F/P1 handle PINpad security against physical attacks?
The 73S1209F-68M/F/P1 implements hardware-level PINpad security through on-the-fly key matrix scrambling, integrated debounce logic, and isolation of keypad scan signals from general-purpose I/Os. Scrambling prevents correlation between physical keypress timing and electrical traces - mitigating side-channel attacks. Additionally, Flash memory containing firmware and encryption keys is lockable via on-silicon fuses, and the 73S1209F-68M/F/P1 provides 7 kV HBM ESD protection on all card and keypad pins to resist electrostatic tampering attempts.
73S1209F-68M/F/P1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- 73S12xx
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 80515
- Core Size:
- 8-Bit
- Speed:
- 24MHz
- Connectivity:
- I2C, SmartCard, UART/USART
- Peripherals:
- LED, WDT
- Number of I/O:
- 8
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 6.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
73S1209F-68M/F/P1 FAQ
1.How can I place an order for 73S1209F-68M/F/P1 through Aetrix?
Please submit a Request for Quotation (RFQ) for 73S1209F-68M/F/P1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 73S1209F-68M/F/P1 reliable?
The price and inventory of 73S1209F-68M/F/P1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 73S1209F-68M/F/P1 is usually 5 days.
3.What payment methods are accepted for 73S1209F-68M/F/P1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 73S1209F-68M/F/P1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 73S1209F-68M/F/P1?
73S1209F-68M/F/P1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 73S1209F-68M/F/P1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 73S1209F-68M/F/P1?
For technical support, including 73S1209F-68M/F/P1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 73S1209F-68M/F/P1 requirements.
6.How does Aetrix verify that 73S1209F-68M/F/P1 is sourced from the original manufacturer or authorized distributors?
All 73S1209F-68M/F/P1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 73S1209F-68M/F/P1 meets industry standards.
7.What is the process for return or replacement of 73S1209F-68M/F/P1?
All 73S1209F-68M/F/P1 units undergo pre-shipment inspection (PSI). If there is an issue with 73S1209F-68M/F/P1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 73S1209F-68M/F/P1 part is unused and in its original packaging.
Return procedure for 73S1209F-68M/F/P1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
73S1209F-68M/F/P1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
