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Analog Devices Inc./Maxim Integrated 73S8010C-IMR/F

Part No.:
73S8010C-IMR/F
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Specialized
Package:
32-VFQFN Exposed Pad
Datasheet:
Aetrix73S8010C-IMR/F.pdf
Description:
IC INTERFACE SPECIALIZED 32SQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,766

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Product details

Overview

The 73S8010C-IMR/F from Teridian Semiconductor is a single-chip smart card interface IC compliant with ISO-7816-3 and EMV 4.0, providing 3 V/5 V card power via an inductor-based DC-DC converter, I²C host interface (400 kbps), and full activation/deactivation sequencing - used in POS terminals, set-top boxes, and mobile EMV slots.

For engineers reviewing the 73S8010C-IMR/F datasheet, 73S8010C-IMR/F pinout, 73S8010C-IMR/F application, or 73S8010C-IMR/F equivalent, this page delivers verified electrical compliance, real-time fault handling (VDD/VCC supervision, over-current, over-temperature), and hardware-supported C4/C8 auxiliary I/O for secure transaction systems.

Technical Context

The 73S8010C-IMR/F integrates an ISO-7816-3-compliant sequencer with automated emergency deactivation on card removal or fault detection (VDD drop, VCC fault, 150 mA over-current, >125°C die temperature). Its inductor-based DC-DC converter delivers up to 100 mA at >80% efficiency (VDD = 3.3 V, VCC = 5 V, ICC = 65 mA).

Host communication uses a fast-mode I²C slave interface (400 kbps) with 8-device addressing via SAD0–SAD2 pins and interrupt-driven status reporting (INT active-low). The device supports either crystal oscillator (XTALIN/XTALOUT) or external clock input up to 27 MHz for card CLK generation.

Key Specifications

Parameter Value and Actual Design Meaning
VDD Supply Range 2.7 V to 3.6 V - powers internal logic and DC-DC converter; enables single-supply operation from battery or low-voltage rails.
Card Voltage Output Selectable 3 V or 5 V - configured via Control Register bit 2; meets dual-voltage smart card requirements without external regulators.
Max Card Current 100 mA - sufficient for high-power cards and Secure Access Modules (SAMs); supported by inductor-based topology.
I²C Interface Speed 400 kbps - Fast Mode compatible; allows responsive host control with minimal bus overhead in embedded readers.
Power-Down Current 2 µA typical - achieved by disabling analog blocks (oscillator, DC-DC, card interface); critical for battery-powered devices.
ESD Protection 6 kV HBM on card interface - protects against electrostatic discharge during card insertion/removal in consumer and industrial environments.
Fault Detection VDD/VCC supervision, true over-current (150 mA limit), over-temperature (>125°C) - triggers automatic deactivation and INT assertion for fail-safe operation.

Pinout & Package

73S8010C-IMR/F is packaged in a 32-pin QFN (5 mm × 5 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are validated per Teridian DS_8010C_024 Rev. 1.5, Section 16.1.

Pin/Terminal Circuit Role Design Meaning
VDD System supply input Primary power source (2.7–3.6 V) for internal circuitry and DC-DC converter; connects to LIN via external inductor.
LIN DC-DC inductor connection Connects external 10 µH inductor between LIN and VDD; location near pin minimizes EMI and improves regulation stability.
VCC Card power output Regulated 3 V/5 V output to smart card; requires external filter capacitor (1 µF or 3.3 µF per EMV/ISO spec).
I/O Primary card data line Bidirectional ISO-7816 I/O signal with internal pull-up to VCC; handles ATR, T=0/T=1 protocol exchange.
AUX1 / AUX2 Auxiliary card contacts Supports C4/C8 contact signals per ISO-7816-3; includes internal pull-ups to VCC for direct interface to multi-contact cards.
RST / CLK / PRES Card control signals RST drives reset line; CLK supplies programmable clock (XTALIN-derived); PRES detects card presence (active-high).
SCL / SDA I²C host interface Standard bidirectional I²C bus (400 kbps); supports up to 8 parallel devices via SAD0–SAD2 address pins.
INT Fault interrupt output Active-low open-drain signal indicating VDD/VCC fault, over-current, over-temperature, card insert/extract, or ATR errors.

Key Features

Feature Design Value
Inductor-based DC-DC converter Delivers >80% efficiency and 100 mA max current - outperforms charge-pump alternatives in battery life and thermal performance.
Programmable VDD fault threshold VDDF_ADJ pin enables external resistor network to adjust deactivation voltage (e.g., 2.7 V) - supports custom brown-out behavior.
Hardware activation/deactivation sequencer Automates ISO-7816-3 timing (t1–t4), including emergency shutdown on card removal - eliminates host firmware timing-critical code.
Interrupt-driven fault reporting Single INT pin signals all faults (VDD/VCC drop, over-current, over-temp, ATR timeout) - simplifies host polling and error recovery.
32-QFN compact footprint 5 mm × 5 mm package with exposed thermal pad - enables space-constrained designs like portable POS and mobile add-on modules.

Applications

POS Terminals Set-Top Box Conditional Access

Use Scenario: Embedded smart card reader in retail payment terminals processing EMV chip-and-PIN transactions.

IC Role / Device Role / Timing Role: Primary smart card interface managing power, reset, clock, and I/O sequencing per ISO-7816-3 and EMV 4.0.

Use Value: Enables certified, fail-safe card power delivery and fault-triggered deactivation - meeting PCI PTS and EMVCo security requirements.

Use Scenario: Pay-per-view and conditional access module in cable/satellite STBs requiring secure decryption key loading.

IC Role / Device Role / Timing Role: Smart card interface handling SAM (Secure Access Module) communication with precise ATR timing and voltage supervision.

Use Value: Supports high-current SAM operation (up to 100 mA) and detects VCC faults before cryptographic session corruption.

Mobile EMV Slots Industrial Secure Readers

Use Scenario: Smart card slot in smartphones or PDAs enabling contact-based banking or eID authentication.

IC Role / Device Role / Timing Role: Low-power smart card controller with 2 µA power-down mode and integrated C4/C8 auxiliary I/O for multi-contact cards.

Use Value: Extends battery life while maintaining EMV 4.0 compliance and supporting advanced card features like biometric verification.

Use Scenario: Ruggedized access control or identity verification terminal deployed in factory or logistics environments.

IC Role / Device Role / Timing Role: Robust smart card interface with 6 kV HBM ESD protection, over-temperature monitoring, and mechanical card presence detection.

Use Value: Ensures reliable operation under thermal stress and electrostatic conditions common in industrial settings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar smart card interface applications.

Alternative Part Technical Difference Application Difference Selection Advice
SLB9670VQ2.0 Trusted Platform Module (TPM) with integrated smart card controller; requires separate power management; no inductor-based DC-DC. Designed for PC/platform root-of-trust, not standalone card readers; lacks C4/C8 support and EMV-specific sequencer. Choose SLB9670VQ2.0 only when TPM functionality and cryptographic acceleration are required alongside card interface.
ST8024SW Smart card interface with charge-pump DC-DC (max 50 mA); no over-temperature monitoring; 28-SOIC only. Lower current capability limits use with high-power SAMs; no thermal fault protection reduces safety margin in enclosed enclosures. Choose ST8024SW only for cost-sensitive, low-current applications where thermal robustness and compact QFN are non-critical.

Compared with SLB9670VQ2.0 and ST8024SW, the 73S8010C-IMR/F uniquely combines inductor-based 100 mA power delivery, integrated over-temperature detection, and hardware EMV 4.0 sequencing - making it optimal for certified, high-reliability smart card readers.

Availability

73S8010C-IMR/F is available at Aetrix Electronics and suitable for point-of-sale terminals, set-top box conditional access modules, and mobile EMV readers requiring stable component supply and long-term lifecycle support.

Supply support for 73S8010C-IMR/F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Teridian Semiconductor was a fabless analog/mixed-signal IC company acquired by Maxim Integrated in 2010; its smart card interface portfolio emphasized high-efficiency power conversion and EMV-certified reliability.

The 73S8010C-IMR/F belongs to Teridian's smart card interface product line, designed specifically for secure, low-power, standards-compliant reader systems in payment, ID, and conditional access markets.

FAQ

What is the primary function of the 73S8010C-IMR/F in a smart card system?

The 73S8010C-IMR/F serves as a fully integrated smart card interface IC that manages electrical compliance (ISO-7816-3/EMV 4.0), card power generation (3 V/5 V via inductor-based DC-DC), and hardware-controlled activation/deactivation sequencing. It interfaces with the host via I²C and directly drives card signals (I/O, RST, CLK, PRES, AUX1/AUX2), eliminating the need for discrete level shifters or external supervisors. The 73S8010C-IMR/F ensures safe, standards-compliant operation across diverse reader platforms.

Does the 73S8010C-IMR/F support both 3 V and 5 V smart cards?

Yes, the 73S8010C-IMR/F supports both 3 V and 5 V smart cards through software-selectable output voltage. Bit 2 of the Host Control Register configures the DC-DC converter to deliver either 3 V or 5 V to the VCC pin. This selection is fully compliant with ISO-7816-3 voltage class definitions and enables seamless interoperability with legacy and modern cards. The 73S8010C-IMR/F maintains regulation accuracy and fault protection regardless of selected voltage.

How does the 73S8010C-IMR/F handle fault conditions such as over-current or card removal?

The 73S8010C-IMR/F incorporates autonomous hardware fault response: over-current (≥150 mA), over-temperature (>125°C), VDD/VCC undervoltage, or card extraction immediately triggers the ISO-7816-3 deactivation sequence and asserts the active-low INT pin. No host intervention is required - the sequencer shuts down VCC, pulls RST low, stops CLK, and releases I/O within defined timing windows (t1–t4). This behavior is documented in Sections 8–9 of the 73S8010C-IMR/F datasheet and ensures fail-safe card disconnection.

What package type is used for the 73S8010C-IMR/F, and what are its key layout considerations?

The 73S8010C-IMR/F uses a 32-pin QFN package (5 mm × 5 mm, 0.5 mm pitch) with an exposed thermal pad. Critical layout requirements include placing the external 10 µH inductor within 2 mm of the LIN pin (QFN pin 2), using short wide traces for VDD–LIN–VCC paths, and connecting the thermal pad to a solid GND plane for thermal dissipation and noise reduction. The 73S8010C-IMR/F datasheet Figure 11 and Section 15.1 provide mechanical drawings and recommended PCB footprints.

Can the 73S8010C-IMR/F operate from a single lithium coin cell or 3.3 V rail?

Yes, the 73S8010C-IMR/F operates from a single 2.7 V to 3.6 V supply (VDD), making it compatible with 3.3 V regulated rails and single-cell lithium (e.g., CR2032, nominal 3.0 V). Its 2 µA typical power-down current extends battery life significantly, and the inductor-based DC-DC converter maintains >80% efficiency even at low VDD (3.3 V). The 73S8010C-IMR/F has been validated in battery-powered POS and portable readers per its Recommended Operating Conditions table (Section 14.2).

73S8010C-IMR/F Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
32-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
Set-Top Boxes
Interface:
I2C
Voltage - Supply:
2.7V ~ 3.6V
Supplier Device Package:
32-SQFN (5x5)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

73S8010C-IMR/F FAQ

1.How can I place an order for 73S8010C-IMR/F through Aetrix?

Please submit a Request for Quotation (RFQ) for 73S8010C-IMR/F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 73S8010C-IMR/F reliable?

The price and inventory of 73S8010C-IMR/F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 73S8010C-IMR/F is usually 5 days.

3.What payment methods are accepted for 73S8010C-IMR/F?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 73S8010C-IMR/F transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 73S8010C-IMR/F?

73S8010C-IMR/F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 73S8010C-IMR/F order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 73S8010C-IMR/F?

For technical support, including 73S8010C-IMR/F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 73S8010C-IMR/F requirements.

6.How does Aetrix verify that 73S8010C-IMR/F is sourced from the original manufacturer or authorized distributors?

All 73S8010C-IMR/F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 73S8010C-IMR/F meets industry standards.

7.What is the process for return or replacement of 73S8010C-IMR/F?

All 73S8010C-IMR/F units undergo pre-shipment inspection (PSI). If there is an issue with 73S8010C-IMR/F, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 73S8010C-IMR/F part is unused and in its original packaging.

Return procedure for 73S8010C-IMR/F:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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