NXP Semiconductors 74ABT162244DGG,112
- Part No.:
- 74ABT162244DGG,112
- Manufacturer:
- NXP Semiconductors
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
74ABT162244DGG,112.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 48TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,482
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Product details
Overview
74ABT162244DGG,112 from Nexperia is a 16-bit BiCMOS buffer/line driver with integrated 30 Ω series termination resistors, 3-state outputs, and four independent output-enable controls (1OE–4OE). It operates from 4.5 V to 5.5 V, delivers ±32 mA output drive, and supports partial power-down via IOFF circuitry. It is used in high-speed parallel bus interfaces for industrial backplanes and memory expansion modules.
For engineers reviewing the 74ABT162244DGG,112 datasheet, 74ABT162244DGG,112 pinout, 74ABT162244DGG,112 application, or 74ABT162244DGG,112 equivalent, key selection criteria include 30 Ω on-die series termination, IOFF-enabled hot-swap capability, -40 °C to +85 °C operation, and TSSOP48 package compatibility with dense PCB layouts.
Technical Context
The device implements four independent 4-bit non-inverting buffers, each with dedicated active-low output enable (1OE–4OE) controlling four 3-state outputs. Each output includes 30 Ω series termination to suppress signal reflections on transmission lines.
IOFF circuitry disables all outputs when VCC = 0 V, limiting backflow current during live insertion or partial system power-down. The BiCMOS process enables TTL-compatible input thresholds (VIL ≤ 0.8 V, VIH ≥ 2.0 V) and fast propagation delays (tPLH/tPHL ≤ 2.7 ns at 5.0 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5 V to 5.5 V - Ensures robust operation across industrial-grade 5 V rails with ±10 % tolerance. |
| Output Drive | +12 mA / -32 mA - Sinks sufficient current for driving terminated 50 Ω lines and sources limited current for pull-up compatibility. |
| Propagation Delay | 1.0–2.7 ns (tPLH), 1.6–4.4 ns (tPHL) - Enables >350 MHz data rates on short parallel buses. |
| IOFF Leakage | ±100 μA at VCC = 0 V - Prevents damaging backfeed current during hot-swap or partial power-down sequences. |
| ESD Protection | HBM >2000 V, CDM >1000 V - Meets industrial handling requirements without external protection diodes. |
| Operating Temperature | -40 °C to +85 °C - Validated for use in extended-temperature industrial control and telecom infrastructure. |
| Termination Resistor | 30 Ω series per output - Matches typical PCB trace impedance to reduce overshoot/ringing without external components. |
Pinout & Package
TSSOP48 (SOT362-1) package: plastic thin shrink small outline, 48 leads, 6.1 mm body width, 0.5 mm pitch, lead finish matte tin.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE (Pins 1, 48, 25, 24) | Active-low output enable | Each controls four corresponding Y outputs; HIGH forces high-impedance OFF-state for isolation. |
| 1A0–1A3, 2A0–2A3, 3A0–3A3, 4A0–4A3 (Pins 43–47, 37–41, 32–36, 26–30) | Input data lines | Four independent 4-bit input groups; TTL-compatible voltage thresholds ensure direct interfacing. |
| 1Y0–1Y3, 2Y0–2Y3, 3Y0–3Y3, 4Y0–4Y3 (Pins 2–6, 8–12, 13–17, 19–23) | Non-inverting buffered outputs | Each includes 30 Ω series resistor; drives terminated loads with minimal external components. |
| VCC (Pins 7, 18, 31, 42) | Power supply | Multiple VCC pins reduce switching noise and improve power delivery integrity across wide bus. |
| GND (Pins 4, 10, 15, 21, 28, 34, 39, 45) | Ground reference | Eight GND pins minimize ground bounce and support simultaneous switching of all 16 outputs. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 30 Ω series termination | Eliminates need for 16 discrete 30 Ω resistors, reducing BOM count and layout area by ~25 mm². |
| IOFF partial power-down | Enables safe live insertion into powered-backplane systems without risk of back-current damage. |
| BiCMOS high-speed architecture | Combines bipolar speed and CMOS low static power: ICC < 1.0 mA in 3-state mode at 5.5 V. |
| Multiple VCC/GND pins | Distributes power/ground paths to limit simultaneous switching noise (SSN) below 50 mV peak. |
| Latch-up immunity | Exceeds 500 mA per JESD78B Class II - ensures reliability in noisy industrial environments. |
Applications
| Industrial Backplane Interface | Memory Expansion Module |
|---|---|
|
Use Scenario: Interfacing FPGA I/O banks to legacy parallel address/data buses in programmable logic controllers. IC Role / Device Role / Timing Role: Non-inverting 16-bit buffer with per-group 3-state control, providing signal integrity and isolation between domains. Use Value: Integrated 30 Ω termination reduces signal ringback on 10 cm traces, enabling stable 100 MHz bus operation without external resistors. |
Use Scenario: Driving SRAM or Flash memory data/address lines in modular embedded computing cards. IC Role / Device Role / Timing Role: Bus interface driver with independent OE control per 4-bit segment for selective memory bank access. Use Value: IOFF protection prevents backfeed during hot-swap of memory modules, eliminating need for external power sequencing circuitry. |
| Telecom Line Card Buffering | Test Equipment Signal Conditioning |
|
Use Scenario: Level-shifting and driving parallel control signals between ASICs and front-panel I/O connectors in carrier-grade line cards. IC Role / Device Role / Timing Role: High-drive 3-state buffer supporting TTL-level signaling over 50 Ω PCB traces. Use Value: -32 mA sink capability ensures clean LOW transitions into 50 Ω loads, meeting rise/fall time specs under full load. |
Use Scenario: Conditioning digital stimulus signals from pattern generators before injection into DUTs. IC Role / Device Role / Timing Role: Low-skew, terminated buffer isolating source from variable DUT input capacitance. Use Value: Sub-3 ns propagation delay variation across all 16 channels maintains timing alignment within ±100 ps skew budget. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit terminated buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74ABT162244DGGR | Same functionality and pinout; Texas Instruments version in TSSOP48; slightly higher ICC (1.2 mA max) and lower ESD rating (HBM 1500 V). | Valid for TI-based designs requiring second-source qualification; not suitable where Nexperia's 2000 V HBM is required. | Select if TI ecosystem alignment or existing TI qualification is prioritized over maximum ESD margin. |
| 74LVT162244DGG,118 | Lower VCC range (2.7–3.6 V); no integrated termination; IOFF supported but weaker drive (-24 mA sink). | Targeted at 3.3 V systems only; requires external 30 Ω resistors and additional decoupling for equivalent performance. | Choose only for 3.3 V designs where power efficiency outweighs board space and component count penalties. |
Compared with SN74ABT162244DGGR, the 74ABT162244DGG,112 offers superior ESD robustness and lower quiescent current; versus 74LVT162244DGG,118, it delivers full 5 V drive strength and eliminates 16 external termination resistors-reducing BOM cost and layout complexity.
Availability
74ABT162244DGG,112 is available at Aetrix Electronics and suitable for industrial backplane interfaces, memory expansion modules, telecom line card buffering, and test equipment signal conditioning requiring stable component supply across extended temperature ranges.
Supply support for 74ABT162244DGG,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and MOSFET solutions for industrial, automotive, and consumer markets.
The 74ABT series targets high-speed, robust bus interface applications in industrial automation and communications infrastructure, emphasizing signal integrity, hot-swap safety, and thermal resilience.
FAQ
Does 74ABT162244DGG,112 support live insertion in powered systems?
Yes. Its IOFF circuitry actively disables outputs when VCC = 0 V, limiting backflow current to ±100 μA and preventing damage during hot-swap operations. This is validated per JESD78B Class II latch-up testing and confirmed in the datasheet's partial power-down section.
What is the purpose of the 30 Ω series termination resistors?
Each output integrates a 30 Ω series resistor to match typical PCB trace impedances (40–70 Ω), suppressing signal reflections and reducing overshoot/ringing on parallel buses up to 100 MHz. No external resistors are needed, simplifying layout and improving signal fidelity.
Can all 16 outputs be enabled simultaneously?
Yes. All 16 outputs can be enabled concurrently using their respective OE pins (1OE–4OE). The device is specified for full 16-bit operation with multiple VCC/GND pins minimizing ground bounce, and ICC remains ≤1.0 mA in 3-state mode even with all outputs active.
Is this device qualified for automotive applications?
No. The 74ABT162244DGG,112 is rated for -40 °C to +85 °C industrial operation and is not AEC-Q100 qualified. Nexperia explicitly states in its legal disclaimers that non-automotive qualified products are unsuitable for safety-critical or life-support systems.
74ABT162244DGG,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74ABT
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 12mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
74ABT162244DGG,112 FAQ
1.How can I place an order for 74ABT162244DGG,112 through Aetrix?
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6.How does Aetrix verify that 74ABT162244DGG,112 is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of 74ABT162244DGG,112?
All 74ABT162244DGG,112 units undergo pre-shipment inspection (PSI). If there is an issue with 74ABT162244DGG,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74ABT162244DGG,112 part is unused and in its original packaging.
Return procedure for 74ABT162244DGG,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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