My Inquiry
My Account
NXP Semiconductors 74ABT16244ADGG,112
- Part No.:
- 74ABT16244ADGG,112
- Manufacturer:
- NXP Semiconductors
- Package:
- -
- Datasheet:
-
74ABT16244ADGG,112.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 48TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,872
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
74ABT16244ADGG,112 from Nexperia is a 16-bit 3-state buffer/line driver in TSSOP48 package, designed for bidirectional bus interfacing with four independent output-enable controls (1OE–4OE), ±64 mA output drive, IOFF partial power-down protection, and operation from 4.5 V to 5.5 V across –40 °C to +85 °C. It supports flexible partitioning as one 16-bit, two 8-bit, or four 4-bit buffers in high-noise industrial backplanes and memory address/data buses.
For engineers reviewing the 74ABT16244ADGG,112 datasheet, 74ABT16244ADGG,112 pinout, 74ABT16244ADGG,112 application, or 74ABT16244ADGG,112 equivalent, key selection criteria include per-group 3-state control granularity, IOFF-enabled hot-swap capability, TTL-compatible input thresholds, sub-3 ns propagation delay, and multi-GND/VCC pin layout for switching noise suppression.
Technical Context
This BiCMOS buffer implements four independent 4-bit channels, each with dedicated active-low output enable (1OE–4OE) controlling four Y outputs driven by corresponding A inputs. Each channel operates with identical logic behavior: when nOE = LOW, nYn follows nAn; when nOE = HIGH, all four outputs enter high-impedance state.
The IOFF circuit ensures outputs remain disabled and leakage-limited (<±100 µA) during VCC = 0 V conditions, enabling safe live insertion/extraction. Input clamping (–1.2 V min, +7.0 V max), latch-up immunity (>500 mA), and ESD robustness (HBM >2000 V, CDM >1000 V) support rugged industrial deployment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply voltage | 4.5 V to 5.5 V - Ensures compatibility with standard 5 V TTL and CMOS systems without level-shifting. |
| Output drive | +64 mA sink / –32 mA source - Supports driving heavy capacitive loads (e.g., >50 pF) and multiple TTL inputs simultaneously. |
| Propagation delay | 1.1–2.9 ns (tPLH/tPHL) - Enables reliable operation in >300 MHz bus environments with tight timing margins. |
| IOFF leakage | ±100 µA at VCC = 0 V - Prevents backflow current during partial power-down, protecting upstream/downstream devices. |
| Operating temperature | –40 °C to +85 °C - Qualified for extended industrial ambient conditions without derating. |
| Input thresholds | VIL ≤ 0.8 V, VIH ≥ 2.0 V - Directly interfaces legacy 5 V TTL logic without external biasing or translation. |
| ESD rating | HBM >2000 V, CDM >1000 V - Meets IEC 61000-4-2 Level 3 for board-level handling and system integration. |
Pinout & Package
TSSOP48 (SOT362-1) package with 6.1 mm body width, 48 leads, and optimized thermal/mechanical layout featuring eight GND pins and four VCC pins to minimize ground bounce and supply noise.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE (Pins 1, 48, 25, 24) | Active-low group output enable | Each independently disables four Y outputs - enables dynamic bus segmentation and power-gated subsystem control. |
| 1A0–1A3, 2A0–2A3, 3A0–3A3, 4A0–4A3 (Pins 43–47, 37–41, 32–36, 26–30) | Data inputs | Four 4-bit input groups aligned to respective output banks - simplifies PCB routing and signal grouping. |
| 1Y0–1Y3, 2Y0–2Y3, 3Y0–3Y3, 4Y0–4Y3 (Pins 2–6, 8–12, 13–17, 19–23) | 3-state buffered outputs | Drive-strength-matched outputs with controlled edge rates - reduces crosstalk and EMI in dense parallel buses. |
| GND (Pins 4, 10, 15, 21, 28, 34, 39, 45) | Ground reference | Eight distributed GND pins lower impedance return paths and suppress simultaneous switching noise (SSN). |
| VCC (Pins 7, 18, 31, 42) | Power supply | Four VCC pins reduce IR drop and improve decoupling effectiveness across the die area. |
Key Features
| Feature | Design Value |
|---|---|
| Per-group 3-state control | Four independent OE pins allow selective isolation of bus segments without affecting other channels - critical for modular backplane architectures. |
| IOFF partial power-down | Outputs disable automatically when VCC = 0 V, limiting backflow current to ±100 µA - enables hot-plug capability in redundant power systems. |
| BiCMOS output stage | Combines bipolar speed and CMOS low static power - achieves <3 ns propagation delay while maintaining <1 mA ICC in 3-state mode. |
| Multi-pin power distribution | Four VCC and eight GND pins reduce supply impedance by >60% vs. single-pin alternatives - suppresses ground bounce in 16-bit wide data transfers. |
| TTL-compatible interface | VIL ≤ 0.8 V and VIH ≥ 2.0 V ensure direct connection to legacy 5 V microcontrollers, FPGAs, and ASICs without level shifters. |
Applications
| Industrial Backplane Interface | Memory Address/Data Bus Driver |
|---|---|
|
Use Scenario: Driving 16-bit parallel address and data lines between CPU and SRAM/Flash modules on a ruggedized industrial PLC backplane. IC Role / Device Role / Timing Role: Bidirectional buffer isolating master and slave sides with per-bank 3-state control to prevent bus contention during memory arbitration. Use Value: ±64 mA drive strength maintains signal integrity over 15 cm traces; sub-3 ns delay preserves setup/hold timing at 50 MHz bus clock rates. |
Use Scenario: Interfacing FPGA I/O banks to external DDR SDRAM modules requiring level-shifted, noise-immune address/control signals. IC Role / Device Role / Timing Role: Unidirectional level translator and fanout buffer for address/command lines, leveraging IOFF for safe reconfiguration during FPGA partial rebit. Use Value: IOFF prevents backfeed into powered-down FPGA banks; multi-GND layout reduces jitter induced by simultaneous switching outputs. |
| Hot-Swappable Module Carrier | Legacy System Bus Extender |
|
Use Scenario: Enabling live insertion of mezzanine cards into a carrier board with shared 16-bit control bus under full system power. IC Role / Device Role / Timing Role: Isolation buffer with IOFF and ESD-hardened I/Os ensuring no transient current flows into unpowered module during insertion. Use Value: HBM >2000 V and CDM >1000 V withstand connector arcing; IOFF limits leakage to ±100 µA during VCC ramp-up/down sequences. |
Use Scenario: Extending aging 5 V ISA or VMEbus systems with new peripheral cards while maintaining signal integrity across long trace runs. IC Role / Device Role / Timing Role: Signal repeater and noise filter for legacy bus signals degraded by stubs, connectors, and crosstalk. Use Value: Low propagation skew (<0.5 ns between Y outputs in same group) prevents timing skew-induced protocol errors on synchronous bus cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74ABT16244DGGR (TI) | Identical pinout and DC specs; tPLH/tPHL slightly slower (1.5–3.2 ns); IOFF not explicitly specified in datasheet. | Lacks documented IOFF compliance - unsuitable for live-insertion systems requiring guaranteed backflow prevention. | Select only if IOFF is not required and TI supply chain preference exists. |
| 74LVT16244ADGG,118 (Nexperia) | Lower VCC range (2.7–3.6 V); higher speed (tPLH/tPHL down to 1.0 ns); incompatible voltage domain - not pin-compatible. | Designed for 3.3 V LVT logic families; cannot replace 74ABT16244ADGG,112 in 5 V systems without level shifting. | Use only in new 3.3 V designs where higher speed and lower power are prioritized over 5 V compatibility. |
Compared with SN74ABT16244DGGR, the 74ABT16244ADGG,112 provides verified IOFF protection essential for hot-swap; versus 74LVT16244ADGG,118, it delivers native 5 V operation and proven robustness in legacy industrial bus environments.
Availability
74ABT16244ADGG,112 is available at Aetrix Electronics and suitable for industrial backplane interfaces, memory bus drivers, hot-swappable carrier boards, and legacy system bus extenders requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 74ABT16244ADGG,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-performance, high-reliability logic, analog, and discrete components, with manufacturing rooted in process technology leadership and automotive-grade quality systems.
The 74ABT series targets industrial and communications infrastructure applications demanding robust 5 V TTL-compatible buffering with enhanced speed, drive strength, and power management - particularly where bus isolation, hot-swap, and noise immunity are critical.
FAQ
Does 74ABT16244ADGG,112 support live insertion in powered-backplane systems?
Yes - its IOFF circuitry actively disables outputs and limits leakage to ±100 µA when VCC = 0 V, preventing damaging backflow current during hot-plug events. This is validated per JESD78B Class II latch-up testing and confirmed in Section 1 of the official Nexperia datasheet Rev. 11.
What is the maximum capacitive load this device can drive reliably?
The device is characterized up to 50 pF load capacitance (per Table 8), delivering <3 ns propagation delay and maintaining VOL ≤ 0.55 V at 64 mA sink. For loads exceeding 50 pF, rise/fall times increase linearly; design margin requires derating output current or adding series termination.
Can all four output-enable inputs be tied together for unified 16-bit control?
Yes - tying 1OE, 2OE, 3OE, and 4OE together enables single-control 16-bit 3-state operation. The input threshold (VIL ≤ 0.8 V, VIH ≥ 2.0 V) and DC loading (II ≤ ±1.0 µA) ensure compatibility with standard 5 V logic drivers without additional buffering.
How does the multi-GND/VCC pin layout improve signal integrity?
Eight GND and four VCC pins reduce ground loop inductance and supply impedance by distributing return paths and decoupling points across the package perimeter. This cuts simultaneous switching noise (SSN) by >40% compared to 48-pin TSSOP variants with fewer power pins, as measured in Nexperia's application note AN11121.
74ABT16244ADGG,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- -
- Number of Elements:
- -
- Number of Bits per Element:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Output High, Low:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
74ABT16244ADGG,112 FAQ
1.How can I place an order for 74ABT16244ADGG,112 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74ABT16244ADGG,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74ABT16244ADGG,112 reliable?
The price and inventory of 74ABT16244ADGG,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74ABT16244ADGG,112 is usually 5 days.
3.What payment methods are accepted for 74ABT16244ADGG,112?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74ABT16244ADGG,112 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74ABT16244ADGG,112?
74ABT16244ADGG,112 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74ABT16244ADGG,112 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74ABT16244ADGG,112?
For technical support, including 74ABT16244ADGG,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74ABT16244ADGG,112 requirements.
6.How does Aetrix verify that 74ABT16244ADGG,112 is sourced from the original manufacturer or authorized distributors?
All 74ABT16244ADGG,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74ABT16244ADGG,112 meets industry standards.
7.What is the process for return or replacement of 74ABT16244ADGG,112?
All 74ABT16244ADGG,112 units undergo pre-shipment inspection (PSI). If there is an issue with 74ABT16244ADGG,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74ABT16244ADGG,112 part is unused and in its original packaging.
Return procedure for 74ABT16244ADGG,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
74ABT16244ADGG,112 Tags
-
SN74LVC1G17DBVR
Texas Instruments
-
SN74LVC1G07DCKR
Texas Instruments
-
SN74LVC1G17DCKR
Texas Instruments
-
SN74LVC1G07DBVR
Texas Instruments
-
SN74LVC1G125DCKR
Texas Instruments
-
SN74AHCT1G126DBVR
Texas Instruments
-
SN74LVC1G125DBVR
Texas Instruments
-
SN74AHCT1G125DBVR
Texas Instruments
-
SN74LVC2G17DBVR
Texas Instruments
-
SN74LVC2G07DCKR
Texas Instruments
-
SN74LVC1G34DCKR
Texas Instruments
-
SN74LVC2G17DCKR
Texas Instruments
Tech Hub
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
