Texas Instruments 74ABT16244ADGGRG4

Overview

74ABT16244ADGGRG4 from Texas Instruments is a 16-bit noninverting buffer/driver with 3-state outputs in a 48-pin TSSOP package, featuring –32-mA high-level and 64-mA low-level output drive, 3.2-ns typical propagation delay (tPLH), and operation across –40°C to 85°C. It serves as a high-density bus interface for memory address, clock distribution, and data bus driving in industrial control backplanes.

For engineers reviewing the 74ABT16244ADGGRG4 datasheet, 74ABT16244ADGGRG4 pinout, 74ABT16244ADGGRG4 application, or 74ABT16244ADGGRG4 equivalent, key selection criteria include guaranteed 3-state noise immunity, distributed VCC/GND pin architecture for EMI reduction, flow-through pinout for simplified PCB routing, and compatibility with 5-V TTL logic systems requiring high sink/source capability.

Technical Context

This device implements four independent 4-bit noninverting buffers, each with active-low 3-state enable (OE), supporting flexible partitioning as one 16-bit, two 8-bit, or four 4-bit drivers. Its EPIC-IIB™ BiCMOS process delivers low ground bounce (VOLP <1 V) and latch-up immunity exceeding 500 mA per JESD 70.

The input structure accepts TTL-compatible thresholds (VIL = 0.8 V, VIH = 2 V), while output stages are specified for 4.5–5.5-V supply operation with symmetrical drive strength and fast switching (tPHL/tPLH ≤ 3.7 ns at 5 V, CL = 50 pF). OE inputs require external pull-up to VCC during power sequencing to ensure defined high-impedance state.

Key Specifications

Pinout & Package

Package: 48-pin Thin Shrink Small-Outline Package (TSSOP), JEDEC MO-153 compliant, body dimensions 12.6 mm × 6.2 mm × 1.2 mm max, lead pitch 0.5 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit 3-state buffer applications.

Compared with 74ABT16244ADGGRG4, the DGVR offers space savings at the cost of marginally reduced thermal performance, while the DLR trades footprint for ease of assembly and inspection-neither is pin-compatible due to differing package outlines and land patterns.

Availability

74ABT16244ADGGRG4 is available at Aetrix Electronics and suitable for industrial control backplanes, memory subsystems, and clock distribution networks requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for 74ABT16244ADGGRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions with emphasis on reliability, scalability, and industrial-grade qualification.

The ABT logic family-including 74ABT16244ADGGRG4-is engineered for high-speed, high-drive 3-state bus interfacing in noise-sensitive industrial and telecom systems where signal integrity and thermal stability are critical.

FAQ

What is the recommended power-up sequence for 74ABT16244ADGGRG4 to avoid bus contention?

TI specifies that all OE inputs must be held high (via external pull-up resistors to VCC) during power-up and power-down to guarantee outputs remain in high-impedance state. For 74ABT16244ADGGRG4, connect each OE pin (1OE–4OE) to VCC through a resistor sized per the driver's sink capability-typically 4.7 kΩ suffices for most 5-V systems. This prevents undefined output states that could cause short-circuits on shared buses.

Does 74ABT16244ADGGRG4 support mixed-voltage interfacing, such as 3.3-V inputs driving a 5-V supply rail?

No-74ABT16244ADGGRG4 is a 5-V-only device with TTL-compatible input thresholds (VIH = 2.0 V min, VIL = 0.8 V max) and requires VCC = 4.5–5.5 V. While 3.3-V logic may meet the VIH threshold marginally, TI does not characterize or guarantee operation below VCC = 4.5 V. For true mixed-voltage translation, use dedicated level-shifters or ABT-family variants explicitly rated for 3.3-V input compatibility.

How many 74ABT16244ADGGRG4 devices can safely share a single 5-V, 2-A power supply in a densely populated PCB?

Based on worst-case ICC = 32 mA (all outputs enabled, driving low), each 74ABT16244ADGGRG4 draws ≤32 mA. With derating for transients and margin, a 2-A supply supports up to 50 units. However, practical limits are set by PCB copper area, thermal dissipation (θJA = 89°C/W), and simultaneous switching noise-TI recommends limiting concurrent switching to ≤50% of outputs per device and using local 100-nF ceramic decoupling at each VCC pin.

Is 74ABT16244ADGGRG4 pin-to-pin compatible with earlier 74ABT16244 variants like the SN54ABT16244WD?

No-74ABT16244ADGGRG4 uses a 48-pin TSSOP (DGG) package with 0.5-mm pitch, while SN54ABT16244WD is a 48-pin ceramic flatpack (WD) with 25-mil (0.635-mm) spacing and different mechanical outline. Pin functions match per logic diagram, but physical layout, solder paste stencil, and reflow profile differ significantly. Migration requires PCB redesign and validation of signal integrity under new parasitics.

What is the maximum capacitive load 74ABT16244ADGGRG4 can drive while maintaining specified tPLH/tPHL timing?

TI characterizes switching performance at CL = 50 pF. While the device can drive heavier loads (e.g., 100 pF), propagation delays increase nonlinearly-tPLH rises to ~5.5 ns at 100 pF. For designs requiring strict timing closure, limit net capacitance to ≤50 pF using series termination, shorter traces, or reduced fanout. The 74ABT16244ADGGRG4 datasheet provides load-dependent delay curves in Figure 1 for precise modeling.