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NXP Semiconductors 74ABT16827ADGG,112
- Part No.:
- 74ABT16827ADGG,112
- Manufacturer:
- NXP Semiconductors
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
74ABT16827ADGG,112.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 56TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,505
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Product details
Overview
74ABT16827ADGG,112 from NXP Semiconductors (formerly Philips) is a 20-bit non-inverting 3-state buffer/line driver in TSSOP56 package, operating from 4.5 V to 5.5 V, with ±64 mA/–32 mA output drive, 1.4–1.7 ns propagation delay (CL = 50 pF), and –40 °C to +85 °C temperature range. It serves as a high-speed bus interface for wide data/address paths in industrial control backplanes.
For engineers reviewing the 74ABT16827ADGG,112 datasheet, 74ABT16827ADGG,112 pinout, 74ABT16827ADGG,112 application, or 74ABT16827ADGG,112 equivalent, this page delivers verified electrical specs, functional pin mapping, real-world use cases, and validated alternative options for bus buffering in noise-sensitive, high-density PCB designs.
Technical Context
This BiCMOS device integrates low static/dynamic power with high-speed switching and robust output drive. Its dual NOR-type output enables (nOE1/nOE2) support independent control of two 10-bit banks, enabling flexible bus segmentation and hot-swap capability.
The 74ABT16827ADGG,112 lacks bus-hold inputs-unlike the 74ABTH16827A variant-requiring external pull-up/pull-down resistors on unused inputs. It features live insertion/extraction support, latch-up protection >500 mA (JESD17), and ESD immunity >2000 V (HBM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5 V to 5.5 V - Ensures compatibility with standard 5 V TTL/CMOS systems while tolerating rail droop. |
| Propagation Delay | 1.4 ns (tPHL) / 1.7 ns (tPLH) at CL = 50 pF - Enables sub-2 ns timing margins in high-speed parallel bus interfaces. |
| Output Drive | +64 mA sink / –32 mA source - Drives heavy capacitive loads (e.g., multi-drop buses) without signal degradation. |
| Input Capacitance | 4 pF - Minimizes loading on upstream drivers and preserves signal integrity in fan-out-critical paths. |
| Quiescent Current (3-State) | 500 µA at VCC = 5.5 V - Supports low-power standby modes in power-managed systems. |
| Operating Temperature | –40 °C to +85 °C - Qualified for industrial-grade embedded applications including PLCs and motor drives. |
| Package | TSSOP56 (SOT364-1), 6.1 mm body width - Surface-mount compatible with automated assembly and high-density routing. |
Pinout & Package
74ABT16827ADGG,112 uses a 56-pin plastic thin shrink small outline package (TSSOP56, SOT364-1), 6.1 mm body width, with exposed thermal pad not electrically connected. Pin numbering follows standard counter-clockwise layout starting from pin 1 (1OE1) at top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 56, 28, 29 | 1OE0, 1OE1, 2OE0, 2OE1 | Active-LOW enable inputs controlling two independent 10-bit output banks; enables partial bus isolation. |
| 55–54, 52–51, 49–48, 47–45, 44–43, 42–41, 40–38, 37–36, 34–33, 31–30 | 1A0–1A9, 2A0–2A9 | 20-bit non-inverting data inputs; no bus-hold - requires external termination for floating inputs. |
| 2–3, 5–6, 8–10, 12–14, 15–17, 19–21, 23–24, 26–27 | 1Y0–1Y9, 2Y0–2Y9 | 20-bit buffered outputs with 3-state capability; supports bidirectional bus sharing when paired with complementary devices. |
| 4, 11, 18, 25, 32, 39, 46, 53 | GND | Eight dedicated ground pins - reduce ground bounce and improve noise immunity in high-speed switching. |
| 7, 22, 35, 50 | VCC | Four dedicated VCC pins - minimize supply voltage drop and decouple switching transients across the die. |
Key Features
| Feature | Design Value |
|---|---|
| Multiple VCC/GND pins | 4 VCC + 8 GND pins reduce simultaneous switching noise and improve signal integrity in 20-bit parallel paths. |
| Live insertion/extraction | Supports hot-plug operation in modular backplane systems without damaging the device or host controller. |
| Power-up 3-State | Outputs remain in high-impedance state during power ramp-up - prevents bus contention at system startup. |
| High-current drive | +64 mA sink / –32 mA source per output meets stringent drive requirements for legacy TTL loads and long traces. |
| Latch-up protection | Exceeds 500 mA per JEDEC Std 17 - ensures robustness against transient overcurrent events in industrial environments. |
Applications
| Industrial Backplane Interface | Memory Expansion Subsystem |
|---|---|
|
Use Scenario: Buffering 20-bit address/data lines between CPU module and peripheral slots in modular PLC chassis. IC Role / Device Role / Timing Role: Non-inverting 3-state bus driver providing level-shifting and fan-out expansion with precise propagation delay matching. Use Value: Enables deterministic timing closure across 150 mm backplane traces while supporting hot-swap of I/O modules. |
Use Scenario: Isolating and driving extended memory address bus in FPGA-based data acquisition systems with multiple SRAM banks. IC Role / Device Role / Timing Role: High-drive buffer ensuring clean signal edges across 12 cm PCB traces to prevent setup/hold violations. Use Value: Eliminates need for discrete resistor networks and reduces board area by consolidating 20 signals into one TSSOP56 package. |
| Test Equipment Bus Controller | Legacy System Interfacing |
|
Use Scenario: Driving DUT interface bus in automated test equipment where multiple instruments share a common 20-bit control bus. IC Role / Device Role / Timing Role: 3-state-enabled line driver allowing dynamic bus arbitration and conflict-free multi-instrument communication. Use Value: Provides ±64 mA drive to overcome 50 Ω termination losses and maintain logic thresholds across 2 m ribbon cables. |
Use Scenario: Bridging modern microcontroller GPIOs to legacy 5 V parallel peripherals (e.g., dot-matrix displays, stepper controllers). IC Role / Device Role / Timing Role: Level-tolerant buffer translating 3.3 V logic outputs to full 5 V swing while preserving timing margins. Use Value: Delivers 1.7 ns max tPLH - sufficient for 200 MHz bus clocking with 2 ns skew budget in mixed-voltage systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 20-bit non-inverting buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74ABTH16827ADGG | Includes bus-hold inputs on all A-pins; eliminates need for external pull resistors on unused inputs. | Better suited for systems with variable I/O configuration or unpopulated slots where input floating is likely. | Select 74ABTH16827ADGG if bus-hold functionality is required; otherwise 74ABT16827ADGG,112 offers identical timing and drive with lower input leakage. |
| SN74ALVC16835DGGR | 3.3 V only (1.65–3.6 V), lower drive (±24 mA), smaller TSSOP56 footprint (4.4 mm width), no bus-hold. | Designed for low-voltage portable/embedded systems; incompatible with 5 V buses without level translation. | Choose SN74ALVC16835DGGR only for new 3.3 V designs; 74ABT16827ADGG,112 remains optimal for 5 V industrial backplanes. |
Compared with 74ABTH16827ADGG, the 74ABT16827ADGG,112 trades bus-hold capability for reduced input leakage and identical speed/drive, while SN74ALVC16835DGGR offers voltage scalability at the cost of drive strength and 5 V compatibility - making 74ABT16827ADGG,112 the preferred choice for legacy 5 V bus integrity.
Availability
74ABT16827ADGG,112 is available at Aetrix Electronics and suitable for industrial backplane interfaces, memory expansion subsystems, and legacy system interfacing requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for 74ABT16827ADGG,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors, formerly Philips Semiconductors, is a global leader in high-performance logic and interface ICs, with deep expertise in automotive, industrial, and communications silicon.
The 74ABT family was designed for high-speed, low-noise 5 V bus interfacing in industrial control and instrumentation systems - emphasizing robust drive, precise timing, and thermal reliability.
FAQ
What is the maximum output current rating for 74ABT16827ADGG,112?
The 74ABT16827ADGG,112 supports a maximum output sink current of +64 mA and source current of –32 mA per output pin under recommended operating conditions (VCC = 4.5 V to 5.5 V). These values are specified at VO = 0.5 V (sink) and VO = 2.5 V (source), and must not be exceeded simultaneously across all outputs to avoid exceeding total package power limits.
Does 74ABT16827ADGG,112 include bus-hold circuitry on its inputs?
No, the 74ABT16827ADGG,112 does not incorporate bus-hold inputs. This feature is exclusive to the 74ABTH16827A variant. For 74ABT16827ADGG,112, unused data inputs (1A0–1A9, 2A0–2A9) must be externally terminated with pull-up or pull-down resistors to prevent floating states and potential noise-induced switching.
What is the propagation delay specification for 74ABT16827ADGG,112 at 5 V supply?
At VCC = 5.0 V and CL = 50 pF, the 74ABT16827ADGG,112 exhibits a typical propagation delay of 1.4 ns (tPHL) and 1.7 ns (tPLH) from input (nAx) to output (nYx). The maximum values across the –40 °C to +85 °C range are 2.3 ns (tPHL) and 2.7 ns (tPLH), ensuring timing predictability in industrial thermal environments.
Can 74ABT16827ADGG,112 be used in hot-swap applications?
Yes, the 74ABT16827ADGG,112 supports live insertion and extraction per its datasheet specifications. Its power-up 3-state behavior ensures outputs remain high-impedance during power ramp-up, and its robust ESD (2000 V HBM) and latch-up (>500 mA) protections make it suitable for modular backplane systems requiring field-replaceable modules.
What package type and dimensions does 74ABT16827ADGG,112 use?
The 74ABT16827ADGG,112 uses a plastic thin shrink small outline package (TSSOP56) per drawing SOT364-1, with 56 leads and a 6.1 mm body width. It is RoHS-compliant, lead-free, and designed for fine-pitch surface-mount assembly with standard reflow profiles.
74ABT16827ADGG,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74ABT
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 10
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
74ABT16827ADGG,112 FAQ
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The price and inventory of 74ABT16827ADGG,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74ABT16827ADGG,112 is usually 5 days.
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5.How can I obtain technical support or documentation for 74ABT16827ADGG,112?
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6.How does Aetrix verify that 74ABT16827ADGG,112 is sourced from the original manufacturer or authorized distributors?
All 74ABT16827ADGG,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74ABT16827ADGG,112 meets industry standards.
7.What is the process for return or replacement of 74ABT16827ADGG,112?
All 74ABT16827ADGG,112 units undergo pre-shipment inspection (PSI). If there is an issue with 74ABT16827ADGG,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74ABT16827ADGG,112 part is unused and in its original packaging.
Return procedure for 74ABT16827ADGG,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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