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NXP Semiconductors 74ABT16827ADL,512
- Part No.:
- 74ABT16827ADL,512
- Manufacturer:
- NXP Semiconductors
- Package:
- 56-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
74ABT16827ADL,512.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 56SSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,176
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Product details
Overview
74ABT16827ADL,512 from NXP Semiconductors (formerly Philips) is a 20-bit non-inverting 3-state buffer/line driver in 56-pin SSOP package, delivering ±64 mA output drive, 1.4–1.7 ns propagation delay at 5 V, and operation across –40 °C to +85 °C for high-speed bus interface applications in industrial control backplanes.
For engineers reviewing the 74ABT16827ADL,512 datasheet, 74ABT16827ADL,512 pinout, 74ABT16827ADL,512 application, or 74ABT16827ADL,512 equivalent, key selection criteria include dual active-low output enables (1OE0/1OE1, 2OE0/2OE1), bus-hold-free input architecture, live insertion capability, and compatibility with 5 V TTL/CMOS logic systems requiring robust signal integrity and noise immunity.
Technical Context
The 74ABT16827ADL,512 implements two independent 10-bit buffered channels (1A0–1A9 → 1Y0–1Y9 and 2A0–2A9 → 2Y0–2Y9), each controlled by paired NOR-type output enable inputs (nOE1/nOE2 per side). Its BiCMOS process enables low static current (500 µA in 3-state) while sustaining high-speed switching under 50 pF load.
It supports hot-plug operation via power-up 3-state behavior and multiple VCC/GND pins to suppress simultaneous switching noise. Unlike the 74ABTH16827A variant, it lacks bus-hold circuitry-requiring external pull-ups on unused inputs for defined logic states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Function | 20-bit non-inverting 3-state buffer with dual 10-bit channels and independent output enables |
| Supply Voltage | 4.5 V to 5.5 V - compatible with standard 5 V TTL/CMOS logic rails without level translation |
| Propagation Delay | 1.4 ns (tPHL) / 1.7 ns (tPLH) at VCC = 5 V, CL = 50 pF - enables >500 MHz data throughput in wide-bus systems |
| Output Drive | +64 mA sink / –32 mA source - drives heavy capacitive loads and multiple TTL inputs without buffering |
| Input Capacitance | 4 pF - minimizes loading on upstream drivers and preserves signal edge integrity |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial-grade embedded and automation equipment |
| Quiescent Current (3-State) | 500 µA at VCC = 5.5 V - reduces system-level standby power in power-sensitive designs |
Pinout & Package
Package: 56-pin Plastic Shrink Small Outline Package (SSOP), body width 7.5 mm, SOT371-1 footprint, lead pitch 0.5 mm, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 28, 29, 56 | 1OE0, 1OE1, 2OE0, 2OE1 | Active-LOW enable inputs controlling respective 10-bit output groups - NOR logic allows flexible gating of bus segments |
| 2–3, 5–6, 8–10, 12–14, 15–17, 19–21, 23–24, 26–27 | 1Y0–1Y9, 2Y0–2Y9 | Non-inverting 3-state outputs - high-impedance state isolates bus segments during contention or idle cycles |
| 30–31, 33–34, 36–38, 40–43, 45–49, 51–52, 54–55 | 1A0–1A9, 2A0–2A9 | Data inputs - no internal bus-hold; external pull-up/down required for floating inputs to prevent metastability |
| 4, 11, 18, 25, 32, 39, 46, 53 | GND | Eight dedicated ground pins - reduce ground bounce and improve noise margin in high-speed parallel interfaces |
| 7, 22, 35, 50 | VCC | Four dedicated VCC pins - minimize supply rail droop and decouple switching transients across the die |
Key Features
| Feature | Design Value |
|---|---|
| Multiple VCC/GND pins | Reduces simultaneous switching noise by distributing power/ground paths across 4 VCC and 8 GND terminals |
| Live insertion/extraction support | Enables hot-swap capability in modular backplane systems without powering down adjacent slots |
| Power-up 3-State | Outputs remain in high-impedance state until VCC stabilizes - prevents bus contention during power ramp |
| High-current drive asymmetry | +64 mA sink / –32 mA source optimizes for driving TTL loads and terminating stubs in multidrop buses |
| Latch-up protection | Exceeds 500 mA per JEDEC Std 17 - ensures robustness against transient overcurrent events |
Applications
| Industrial Backplane Interface | Memory Address Buffering |
|---|---|
|
Use Scenario: Isolating and driving 20-bit address/data lines between CPU module and I/O expansion cards in DIN-rail mounted PLC chassis. IC Role / Device Role / Timing Role: Non-inverting 3-state buffer providing bidirectional bus isolation with precise timing control via dual OE inputs. Use Value: Enables deterministic bus arbitration and eliminates signal reflections through matched 64 mA sink drive into 50 Ω trace impedances. |
Use Scenario: Buffering 20-bit memory address bus between microcontroller and SRAM/Flash in real-time motion controller. IC Role / Device Role / Timing Role: Low-propagation-delay (1.4 ns) driver ensuring setup/hold timing margins for 25 ns access time memories. Use Value: Maintains sub-2 ns skew across all 20 bits, preventing address decode errors during burst read/write cycles. |
| Test Equipment Bus Driver | Digital I/O Expansion Module |
|
Use Scenario: Driving 20-bit parallel digital stimulus signals from FPGA-based pattern generator to DUT interface board. IC Role / Device Role / Timing Role: High-drive line driver translating FPGA LVTTL outputs to robust 5 V CMOS levels with noise-immune routing. Use Value: Delivers clean edges into 100+ pF capacitive loads (cable + connector + DUT input), preserving rise/fall times below 2.5 ns. |
Use Scenario: Expanding GPIO count of ARM Cortex-M7 MCU in factory automation HMI panel with isolated 20-bit parallel I/O. IC Role / Device Role / Timing Role: Level-shifting and fan-out buffer enabling direct connection of MCU GPIOs to industrial sensors/actuators. Use Value: Eliminates need for discrete pull-up networks via integrated 3-state control, simplifying BOM and PCB layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 20-bit non-inverting buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74ABTH16827ADGG | Includes bus-hold inputs; TSSOP-56 package; same AC/DC specs except input leakage and hold current | Eliminates external pull-ups on unused inputs; suited for sparse or dynamically reconfigured buses | Select when input pin states must remain stable without external components - not pin-compatible due to different package (TSSOP vs SSOP) |
| SN74ALVC16835DGGR | 3.3 V only (1.65–3.6 V); lower drive (±24 mA); 3.5 ns max tPD; 48-pin TSSOP | Designed for low-voltage mixed-signal systems; incompatible with 5 V logic domains without level shifters | Select for cost-sensitive 3.3 V applications where speed and drive requirements are relaxed - not a drop-in replacement |
Compared with 74ABT16827ADL,512, the 74ABTH16827ADGG adds bus-hold but requires package redesign, while SN74ALVC16835DGGR shifts voltage domain and sacrifices speed/drive - making 74ABT16827ADL,512 optimal for legacy 5 V industrial backplanes needing maximum noise immunity and hot-swap reliability.
Availability
74ABT16827ADL,512 is available at Aetrix Electronics and suitable for industrial backplane interfaces, memory address buffering, test equipment bus drivers, and digital I/O expansion modules requiring stable component supply and long-term lifecycle assurance.
Supply support for 74ABT16827ADL,512 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors, formerly Philips Semiconductors, is a global leader in high-performance logic and interface ICs, with deep heritage in automotive, industrial, and communications silicon.
The 74ABT family was engineered for 5 V high-speed bus interfacing in industrial control and telecom infrastructure, emphasizing noise immunity, live insertion, and robust latch-up/ESD performance.
FAQ
What is the operating voltage range for the 74ABT16827ADL,512?
The 74ABT16827ADL,512 operates from 4.5 V to 5.5 V DC supply voltage, fully compliant with standard 5 V TTL logic families. It is not rated for 3.3 V operation, and applying voltages outside this range may cause permanent damage or undefined behavior. The 74ABT16827ADL,512 draws 500 µA quiescent current in 3-state mode at 5.5 V, supporting low-power system design within its specified rail.
Does the 74ABT16827ADL,512 include bus-hold circuitry on its inputs?
No, the 74ABT16827ADL,512 does not incorporate bus-hold functionality. This distinguishes it from the 74ABTH16827A variant. Unused inputs on the 74ABT16827ADL,512 must be externally terminated with pull-up or pull-down resistors to prevent floating states and potential oscillation. The absence of bus-hold reduces input leakage current but increases external component count in sparse-bus configurations.
What is the maximum output drive capability of the 74ABT16827ADL,512?
The 74ABT16827ADL,512 delivers +64 mA sink current and –32 mA source current per output, verified under recommended operating conditions (VCC = 4.5 V, IOL = 64 mA, VOL ≤ 0.55 V). This asymmetric drive strength is optimized for driving TTL loads and terminating transmission lines in multidrop bus topologies. Exceeding these limits risks exceeding absolute maximum ratings and degrading long-term reliability.
Can the 74ABT16827ADL,512 be used in hot-swap applications?
Yes, the 74ABT16827ADL,512 supports live insertion and extraction per its datasheet features, enabled by power-up 3-state behavior and robust ESD/latch-up protection (≥2000 V HBM, ≥500 mA latch-up immunity). During power ramp, outputs remain in high-impedance state until VCC stabilizes, preventing bus contention. This makes the 74ABT16827ADL,512 suitable for modular industrial backplanes requiring field-replaceable modules.
What package type is used for the 74ABT16827ADL,512?
The 74ABT16827ADL,512 uses a 56-pin Plastic Shrink Small Outline Package (SSOP) with 7.5 mm body width and 0.5 mm lead pitch, designated SOT371-1. It is distinct from the TSSOP-56 package used in the 74ABT16827ADGG variant. The SSOP package provides enhanced thermal dissipation and mechanical rigidity for industrial PCBs, with eight GND and four VCC pins to minimize noise coupling.
74ABT16827ADL,512 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74ABT
- Package/Case:
- 56-BSSOP (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 10
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-SSOP
74ABT16827ADL,512 FAQ
1.How can I place an order for 74ABT16827ADL,512 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74ABT16827ADL,512 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74ABT16827ADL,512 reliable?
The price and inventory of 74ABT16827ADL,512 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74ABT16827ADL,512 is usually 5 days.
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74ABT16827ADL,512 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74ABT16827ADL,512 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74ABT16827ADL,512?
For technical support, including 74ABT16827ADL,512 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74ABT16827ADL,512 requirements.
6.How does Aetrix verify that 74ABT16827ADL,512 is sourced from the original manufacturer or authorized distributors?
All 74ABT16827ADL,512 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74ABT16827ADL,512 meets industry standards.
7.What is the process for return or replacement of 74ABT16827ADL,512?
All 74ABT16827ADL,512 units undergo pre-shipment inspection (PSI). If there is an issue with 74ABT16827ADL,512, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74ABT16827ADL,512 part is unused and in its original packaging.
Return procedure for 74ABT16827ADL,512:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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