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NXP Semiconductors 74ABT823DB,112
- Part No.:
- 74ABT823DB,112
- Manufacturer:
- NXP Semiconductors
- Category:
- Flip Flops
- Package:
- 24-SSOP (0.209", 5.30mm Width)
- Datasheet:
-
74ABT823DB,112.pdf
- Description:
- IC FF D-TYPE SNGL 9BIT 24SSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,504
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Product details
Overview
74ABT823DB,112 from NXP Semiconductors is a 9-bit positive-edge-triggered D-type flip-flop register with master reset (MR), clock enable (CE), and 3-state output enable (OE), designed for high-speed parity bus interfacing in multi-microprocessor systems. It operates from 4.5 V to 5.5 V, delivers ±32 mA/±64 mA output drive, and achieves up to 200 MHz maximum clock frequency across −40 °C to +85 °C.
For engineers reviewing the 74ABT823DB,112 datasheet, 74ABT823DB,112 pinout, 74ABT823DB,112 application, or 74ABT823DB,112 equivalent, this device serves as a buffered 9-bit register for wide data/address paths carrying parity - critical for reliable bus buffering in industrial control backplanes and legacy computing architectures where fan-in expansion and low-propagation-delay latching are required.
Technical Context
The 74ABT823DB,112 implements nine independent edge-triggered D-type flip-flops sharing a common rising-edge clock (CP), active-low master reset (MR), active-low clock enable (CE), and active-low 3-state output enable (OE). Its BiCMOS architecture enables simultaneous high speed (tPLH/tPHL ≤ 6.8 ns at 5.0 V) and strong output drive (+64 mA sink, −32 mA source).
All inputs meet TTL-compatible thresholds (VIL ≤ 0.8 V, VIH ≥ 2.0 V), and outputs support hot-insertion via power-on 3-state and power-on reset behavior. The device features latch-up immunity >500 mA per JESD78B Class II Level A and ESD protection exceeding 2000 V HBM and 200 V MM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Function | 9-bit edge-triggered D-type flip-flop register with MR, CE, and 3-state OE |
| Supply Voltage | 4.5 V to 5.5 V - compatible with standard 5 V TTL/CMOS logic rails |
| Max Clock Frequency | 200 MHz - supports high-throughput data latching in fast parallel buses |
| Propagation Delay | tPLH/tPHL ≤ 6.8 ns - ensures tight timing margins in synchronous bus designs |
| Output Drive | +64 mA sink / −32 mA source - drives heavy capacitive loads or multiple TTL inputs |
| Operating Temperature | −40 °C to +85 °C - qualified for industrial-grade embedded and control applications |
| ESD Protection | HBM > 2000 V, MM > 200 V - robust handling during board assembly and field service |
Pinout & Package
74ABT823DB,112 is housed in a plastic shrink small outline package (SSOP24) with 24 leads and 5.3 mm body width (SOT340-1), optimized for high-density PCB layouts while maintaining mechanical compatibility with SO24 footprints via pitch-matched 0.65 mm lead spacing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (OE) | Output enable input | Active-low control for 3-state output bus isolation; enables shared-bus arbitration |
| 2–10 (D0–D8) | Data inputs | Asynchronous parallel data inputs sampled on rising CP edge; support parity bit injection |
| 11 (MR) | Master reset input | Active-low synchronous clear of all Q outputs to logic LOW; overrides clock and CE |
| 12 (GND) | Ground reference | 0 V return path for all internal logic and I/O; requires low-inductance PCB connection |
| 13 (CP) | Clock pulse input | Rising-edge-triggered sampling point; determines register update timing across all 9 bits |
| 14 (CE) | Clock enable input | Active-low gate for CP propagation; allows selective register updates without clock gating noise |
| 15–23 (Q8–Q0) | Data outputs | Registered, 3-state outputs; driven HIGH/LOW when OE = LOW, high-Z when OE = HIGH |
| 24 (VCC) | Positive supply | +4.5 V to +5.5 V power rail; decoupling capacitor required within 1 cm of pin |
Key Features
| Feature | Design Value |
|---|---|
| Positive-edge-triggered D flip-flops | Nine synchronized registers updated only on rising CP edge - eliminates metastability in multi-bit transfers |
| Power-on 3-state and reset | Outputs enter high-Z and Q = LOW at power-up - prevents bus contention during system initialization |
| High-output drive capability | +64 mA sink / −32 mA source - directly interfaces with legacy TTL loads without external buffers |
| Latch-up immunity | Exceeds 500 mA per JESD78B Class II Level A - ensures reliability in noisy industrial environments |
| TTL-compatible input thresholds | VIH ≥ 2.0 V, VIL ≤ 0.8 V - seamless integration with 5 V microprocessor address/data buses |
Applications
| Industrial Backplane Bus Buffering | Multi-MPU Parity Interface |
|---|---|
Use Scenario: Buffering 9-bit parity signals across a 16-slot industrial backplane with mixed MPU vendors and varying trace lengths. IC Role / Device Role / Timing Role: Synchronizes and isolates parity bits between asynchronous MPU domains using shared CP and MR lines. Use Value: Eliminates discrete buffer ICs by providing 9-bit registered drive with matched tPLH/tPHL < 6.8 ns - reduces BOM count and layout complexity. |
Use Scenario: Adding hardware parity checking to a dual-8086-based real-time control system with legacy ISA-style addressing. IC Role / Device Role / Timing Role: Captures and holds parity bits generated by separate XOR networks before CPU read cycles. Use Value: Leverages CE and OE to gate latching and bus release independently - avoids timing conflicts during interrupt-driven I/O bursts. |
| Legacy Computing Memory Expansion | Test Equipment Data Capture |
Use Scenario: Extending data bus width in a Z80-based retro-computing expansion card requiring 9-bit address parity validation. IC Role / Device Role / Timing Role: Registers parity bits alongside address lines, synchronized to Z80 MREQ and RD signals via CP and CE. Use Value: MR input allows global parity reset on power-on or error recovery - critical for deterministic boot sequences in non-volatile memory systems. |
Use Scenario: Capturing parallel digital waveforms from a 9-channel logic analyzer front-end before serial transmission. IC Role / Device Role / Timing Role: Acts as a high-speed acquisition latch, freezing 9-bit samples on trigger-clock rising edge with sub-7 ns skew. Use Value: 200 MHz fmax and 0.2 ns typical setup/hold margin enable accurate capture of 100+ Mbps parallel streams without external clock conditioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 9-bit registered buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74ABT823D,118 | SO24 package (7.5 mm width); identical electrical specs and pinout | Better thermal dissipation but occupies 40% more PCB area than SSOP24 | Select for manual assembly or thermal-limited environments where footprint size is secondary |
| SN74ABT823N | DIP-24 package; same logic function but no MR pin - uses asynchronous clear instead | Lacks synchronous master reset; incompatible with systems requiring coordinated parity reset | Choose only if MR functionality is unused and through-hole mounting is mandatory |
Compared with 74ABT823DB,112, the SO24 variant offers superior heat spreading but higher board area cost, while the DIP version sacrifices MR synchronization for legacy socket compatibility - making 74ABT823DB,112 optimal for space-constrained, multi-MPU industrial backplanes requiring deterministic reset behavior.
Availability
74ABT823DB,112 is available at Aetrix Electronics and suitable for industrial backplane buffering, multi-microprocessor parity interfacing, and legacy computing memory expansion requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across temperature extremes.
Supply support for 74ABT823DB,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 50 years of logic IC heritage and ISO 9001-certified manufacturing.
The 74ABT823DB,112 belongs to NXP's ABT-series advanced BiCMOS logic family, engineered specifically for high-speed, high-drive parallel register applications in industrial control, test equipment, and legacy computing infrastructure.
FAQ
What is the primary function of the 74ABT823DB,112?
The 74ABT823DB,112 is a 9-bit positive-edge-triggered D-type flip-flop register with master reset (MR), clock enable (CE), and 3-state output enable (OE). It captures and holds parallel data on the rising edge of the clock signal, enabling synchronized latching for parity bus interfacing in multi-microprocessor systems. Its design eliminates need for extra buffering ICs in wide data and address paths carrying parity information.
Does the 74ABT823DB,112 support 3.3 V operation?
No, the 74ABT823DB,112 is specified only for 4.5 V to 5.5 V supply operation per its Recommended Operating Conditions table. It does not guarantee functionality or timing at 3.3 V, and applying 3.3 V may result in undefined logic states or failure to meet propagation delay specifications. For 3.3 V systems, consider logic-level translation or alternative families such as LVT or ALVC.
How does the master reset (MR) interact with clock enable (CE) in the 74ABT823DB,112?
In the 74ABT823DB,112, MR is asynchronous and dominant: when MR is asserted LOW, all Q outputs are forced LOW immediately, regardless of CE or CP state. CE only gates CP propagation when MR is deasserted HIGH. This hierarchy ensures deterministic reset behavior during power-up or fault recovery, independent of clock activity or enable status.
What is the purpose of the power-on 3-state feature in the 74ABT823DB,112?
The 74ABT823DB,112 enters 3-state (high-impedance) output mode at power-up until VCC stabilizes, preventing bus contention during system initialization. This behavior is inherent to the device's internal power-on circuitry and requires no external sequencing - ensuring safe insertion into live backplanes or shared data buses without risk of short-circuit or data corruption.
Can the 74ABT823DB,112 be used in place of the 74F823 or 74AS823?
Yes, the 74ABT823DB,112 is a functional and pin-compatible upgrade to 74F823 and 74AS823, offering lower power consumption, higher output drive (+64 mA sink vs. +20 mA), improved noise immunity, and enhanced ESD/latch-up protection. All timing parameters and pin functions match, allowing direct replacement without PCB changes - provided the 4.5–5.5 V supply range is maintained.
74ABT823DB,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74ABT
- Package/Case:
- 24-SSOP (0.209", 5.30mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Function:
- Master Reset
- Type:
- D-Type
- Output Type:
- Tri-State, Non-Inverted
- Number of Elements:
- 1
- Number of Bits per Element:
- 9
- Clock Frequency:
- 200 MHz
- Max Propagation Delay @ V, Max CL:
- 6.1ns @ 5V, 50pF
- Trigger Type:
- Positive Edge
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Current - Quiescent (Iq):
- 250 µA
- Input Capacitance:
- 4 pF
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SSOP
74ABT823DB,112 FAQ
1.How can I place an order for 74ABT823DB,112 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74ABT823DB,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74ABT823DB,112 reliable?
The price and inventory of 74ABT823DB,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74ABT823DB,112 is usually 5 days.
3.What payment methods are accepted for 74ABT823DB,112?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74ABT823DB,112 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74ABT823DB,112?
74ABT823DB,112 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74ABT823DB,112 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74ABT823DB,112?
For technical support, including 74ABT823DB,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74ABT823DB,112 requirements.
6.How does Aetrix verify that 74ABT823DB,112 is sourced from the original manufacturer or authorized distributors?
All 74ABT823DB,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74ABT823DB,112 meets industry standards.
7.What is the process for return or replacement of 74ABT823DB,112?
All 74ABT823DB,112 units undergo pre-shipment inspection (PSI). If there is an issue with 74ABT823DB,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74ABT823DB,112 part is unused and in its original packaging.
Return procedure for 74ABT823DB,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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