NXP Semiconductors 74ABT827D,602

Overview

74ABT827D,602 from NXP Semiconductors is a 10-bit non-inverting 3-state buffer/line driver in SO24 package, delivering ±32 mA/±64 mA output drive, 1.1 ns typical propagation delay (tPLH/tPHL), and operation across −40 °C to +85 °C. It serves as a high-speed bus interface for wide data/address paths or parity buses in microprocessor systems.

For engineers reviewing the 74ABT827D,602 datasheet, 74ABT827D,602 pinout, 74ABT827D,602 application, or 74ABT827D,602 equivalent, key selection criteria include dual NOR-type output enables (OE0/OE1), flow-through pinout architecture, power-up 3-state behavior, and BiCMOS process enabling low static/dynamic power with high fan-out capability.

Technical Context

The 74ABT827D,602 implements a dual-enable 10-bit transparent buffer with independent active-low OE0 and OE1 inputs controlling all ten outputs simultaneously. Its BiCMOS architecture integrates bipolar speed with CMOS input characteristics, supporting TTL-compatible input thresholds (VIL ≤ 0.8 V, VIH ≥ 2.0 V) and rail-to-rail output swing under load.

It features power-up 3-state behavior-outputs remain high-impedance until VCC stabilizes-and includes input disable during 3-state mode to minimize leakage. Latch-up protection exceeds 500 mA per JESD78B Class II Level A, and ESD robustness meets HBM >2000 V and MM >200 V.

Key Specifications

Pinout & Package

74ABT827D,602 uses SO24 (SOT137-1) package: plastic small outline, 24-lead, 7.5 mm body width, 1.27 mm lead pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 10-bit buffer applications.

Compared with SN74ABT827DBR and 74LVT827PW, the 74ABT827D,602 offers the widest operating voltage (4.5–5.5 V), highest sink current (+64 mA), and most robust industrial temperature range - making it the preferred choice for legacy 5 V bus interfacing where reliability and drive strength are critical.

Availability

74ABT827D,602 is available at Aetrix Electronics and suitable for industrial control systems, embedded computing platforms, and test equipment requiring stable component supply and long-term obsolescence management.

Supply support for 74ABT827D,602 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The 74ABT827D,602 belongs to NXP's ABT logic family - engineered for high-speed, low-power 5 V TTL-compatible bus interfacing in industrial and computing systems where signal integrity and thermal robustness are essential.

FAQ

What is the function of OE0 and OE1 on the 74ABT827D,602?

The 74ABT827D,602 features two active-low output enable inputs: OE0 (pin 1) and OE1 (pin 13). Both must be LOW for the 10-bit buffer to operate in transparent mode; if either is HIGH, all outputs (Y0–Y9) enter high-impedance state. This NOR logic configuration allows flexible bus arbitration and hierarchical enable control in multi-master systems. The 74ABT827D,602 datasheet confirms this behavior in Table 3 (Function Table).

Does the 74ABT827D,602 support hot insertion or live bus swapping?

Yes - the 74ABT827D,602 supports controlled hot insertion due to its power-up 3-state feature and robust input clamping (VIK = −1.2 V min). During power ramp-up, outputs remain in high-impedance until VCC stabilizes above ~2.1 V, preventing bus contention. Input clamping current (IIK = −18 mA) and ESD ratings (HBM >2000 V) further protect against transients. These characteristics are verified in Sections 7 and 9 of the 74ABT827D,602 datasheet.

What is the maximum capacitive load the 74ABT827D,602 can drive while maintaining timing specifications?

The 74ABT827D,602 is characterized for CL = 50 pF (Table 8), with propagation delays specified up to 4.8 ns (tPLH/tPHL max) and 6.9 ns (tPLZ/tPZL max) under those conditions. Driving loads beyond 50 pF increases delay nonlinearly and may violate setup/hold windows. For heavier loads (>75 pF), derating or adding series termination is recommended. All dynamic test data in Section 10 of the 74ABT827D,602 datasheet assumes 50 pF loading.

Is the 74ABT827D,602 pin-compatible with other 74ABT-series 10-bit buffers?

Yes - the 74ABT827D,602 shares identical pinout (SO24 SOT137-1), function table, and DC/AC specifications with the full 74ABT827 family (e.g., 74ABT827DB, 74ABT827PW), differing only in package type. Pin mapping for A0–A9, Y0–Y9, OE0, OE1, VCC, and GND is consistent across variants. This interoperability is confirmed in Table 1 (Ordering Information) and Figure 4 (Pin Configuration) of the 74ABT827D,602 datasheet.

What thermal considerations apply to continuous 64 mA output operation on the 74ABT827D,602?

Continuous 64 mA sink current per output (IOL) must be evaluated against junction temperature limits. At TA = 85 °C and worst-case power dissipation, θJA ≈ 70 °C/W (SO24) means sustained full-load operation risks exceeding the 150 °C max Tj. Derating is required: Table 6 shows ICC rises to 38 mA with all outputs LOW. For reliable 64 mA operation, limit concurrent active outputs and ensure PCB copper area ≥ 250 mm² per power pad. Thermal data is in Section 7 (Limiting Values) of the 74ABT827D,602 datasheet.