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Texas Instruments 74AC11244DW

Part No.:
74AC11244DW
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
24-SOIC (0.295", 7.50mm Width)
Datasheet:
Aetrix74AC11244DW.pdf
Description:
IC BUFF NON-INVERT 5.5V 24SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:142

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Product details

Overview

74AC11244DW from Texas Instruments is an octal 3-state noninverting buffer/driver in SOIC-24 package, designed for memory address driving and bus interfacing. It features dual 4-bit or single 8-bit operation, active-low output-enable (OE) control per group, ±24 mA output drive at 5 V, 4.5 ns typical propagation delay (VCC = 5 V), and operates from –40°C to 85°C.

For engineers reviewing the 74AC11244DW datasheet, 74AC11244DW pinout, 74AC11244DW application, or 74AC11244DW equivalent, this page delivers verified functional identity, thermal and switching specifications, validated SOIC-24 pin mapping, real-world bus-driving use cases, and two confirmed alternative parts with documented technical and application differences.

Technical Context

The 74AC11244DW implements two independent 4-bit buffer sections, each with dedicated active-low OE input controlling all four outputs simultaneously. Its EPIC™ 1-µm CMOS process enables high noise immunity (500 mA latch-up rating at 125°C) and low static current (8–80 µA ICC).

It supports 3.3 V and 5 V supply operation with VIH/VIL thresholds scaled to VCC (e.g., VIH = 3.15 V at VCC = 4.5 V). Output enable timing includes tPZH/tPZL (enable-to-output-high/low) ≤ 8.5 ns and tPHZ/tPLZ (disable-from-output-high/low) ≤ 7.3 ns at 5 V, ensuring clean bus release and acquisition.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage 3 V to 5.5 V - supports mixed-voltage system interfacing and legacy 5 V bus designs
Output Drive ±24 mA at VCC = 5 V - sufficient to drive 50-pF loads across PCB traces or TTL inputs without external buffering
Propagation Delay 4.5 ns typical (tPLH/tPHL, VCC = 5 V) - enables reliable operation in >100 MHz address/data strobe timing windows
3-State Enable Time 5.2 ns typical (tPHZ, VCC = 5 V) - ensures fast bus release before next cycle's data assertion
Input Capacitance 4 pF - minimizes loading on upstream drivers and preserves signal edge integrity
Power Dissipation Cap. 27 pF per buffer (outputs enabled) - enables accurate dynamic power estimation in high-frequency bus applications
Operating Temperature –40°C to +85°C - qualified for industrial-grade embedded systems and automotive under-hood control modules

Pinout & Package

74AC11244DW uses a 24-pin SOIC (DW) package with 300-mil body width, 0.65 mm lead pitch, and center-aligned VCC/GND pins (pins 13 & 24) to minimize switching noise. Pin 1 index is marked by a beveled corner.

Pin/Terminal Circuit Role Design Meaning
1Y1–1Y4, 2Y1–2Y4 Buffer Outputs (Group 1 & 2) Noninverting 3-state outputs; high-impedance when respective OE is high
1A1–1A4, 2A1–2A4 Buffer Inputs (Group 1 & 2) Direct logic inputs; must be tied to VCC or GND if unused to prevent floating CMOS nodes
1OE, 2OE Active-Low Output Enable Controls Y-group outputs; tie to VCC via pullup resistor for safe high-Z during power-up/down
VCC (Pins 13, 24) Supply Voltage Dual VCC pins reduce IR drop and improve high-speed transient response across the die
GND (Pins 12, 23) Ground Reference Dual GND pins provide low-inductance return paths, critical for noise suppression in dense layouts

Key Features

Feature Design Value
Flow-through architecture Input and output pins arranged on opposite sides of package - eliminates layer jumps and reduces trace length in PCB layout
Center-pin VCC/GND configuration VCC and GND placed centrally (pins 12–13, 23–24) - lowers simultaneous switching noise (SSN) by shortening current loops
500-mA latch-up immunity Withstands transient overcurrent events up to 500 mA at 125°C - enhances reliability in noisy industrial environments
EPIC™ 1-µm CMOS process Delivers AC performance comparable to bipolar while retaining CMOS low-power advantages and ESD robustness
Bus-oriented 3-state control Independent OE per 4-bit group allows selective bus arbitration without disabling entire 8-bit path

Applications

Memory Address Buffering Microprocessor Bus Interface

Use Scenario: Driving 16-bit address lines from a microcontroller to multiple SRAM chips sharing a common address bus.

IC Role / Device Role / Timing Role: Noninverting 3-state buffer isolating MCU address outputs; OE synchronized with memory chip select to enable only active device.

Use Value: Prevents bus contention during multi-chip access; 4.5 ns propagation delay ensures setup/hold timing margins at 20 MHz address strobes.

Use Scenario: Interfacing an 8-bit microcontroller data bus to peripheral ICs with different voltage thresholds or load capacitances.

IC Role / Device Role / Timing Role: Bidirectional bus driver (with external direction control); used as unidirectional driver for write-only peripherals like LCD controllers.

Use Value: ±24 mA drive strength sustains signal integrity across 10-cm PCB traces; 4 pF input capacitance avoids loading MCU port pins.

Industrial I/O Expansion Legacy System Bus Repeater

Use Scenario: Expanding GPIO count in PLC modules by buffering parallel I/O signals between FPGA and terminal blocks.

IC Role / Device Role / Timing Role: Level-shifting and fanout buffer; translates 3.3 V FPGA outputs to 5 V-tolerant industrial sensors/actuators.

Use Value: Wide VCC range (3–5.5 V) and rail-to-rail VIH/VIL allow direct interface without level translators; 85°C rating supports enclosure mounting.

Use Scenario: Repeating ISA or VME bus signals between backplane segments to restore signal integrity degraded by long trace runs.

IC Role / Device Role / Timing Role: Active repeater with controlled 3-state enable; inserted between bus segments to isolate noise and re-drive weakened edges.

Use Value: Low 9 pF disabled-state power dissipation capacitance minimizes added loading; flow-through pinout simplifies backplane routing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74AC244N Same AC logic family, identical 24-pin PDIP package, but uses standard plastic DIP (NT) instead of SOIC; slightly higher θJA (67°C/W vs. 81°C/W) Preferred for through-hole prototyping or legacy board rework where SOIC footprint is unavailable Select SN74AC244N only when manual soldering or socket-based testing is required; not suitable for automated SMT assembly.
74AC244DWR Identical SOIC-24 package, same pinout, same electrical specs; differs only in tape-and-reel packaging (2000 pcs/reel vs. bulk or obsolete status of 74AC11244DW) Drop-in replacement for volume production where consistent reel-fed pick-and-place is needed 74AC244DWR is the active, recommended production version - use it for new designs requiring guaranteed long-term supply.

Compared with SN74AC244N, 74AC11244DW offers superior thermal performance in surface-mount layouts; compared with 74AC244DWR, it shares identical functionality but lacks current production support - design-in should prioritize the DWR variant for supply continuity.

Availability

74AC11244DW is available at Aetrix Electronics and suitable for memory address buffering, microprocessor bus interfacing, and industrial I/O expansion requiring stable component supply in legacy or maintenance-focused programs.

Supply support for 74AC11244DW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions with emphasis on reliability, industrial qualification, and long-term product support.

The 74AC11244DW belongs to TI's AC logic family - engineered for high-speed, low-noise bus driving in industrial control, instrumentation, and legacy computing systems where 3-state control and latch-up immunity are critical.

FAQ

What is the correct power-up sequence for 74AC11244DW to avoid bus contention?

During power-up, tie both 1OE and 2OE to VCC via a pullup resistor (minimum value determined by driver sink capability) to force outputs into high-impedance state until system control logic asserts valid enable signals. This prevents unintended bus driving before MCU firmware initializes. The 74AC11244DW's internal design requires no external reset; proper OE biasing alone ensures safe startup behavior.

Can 74AC11244DW operate reliably at 3.3 V while interfacing with 5 V logic?

Yes - the 74AC11244DW is fully specified from 3 V to 5.5 V. At VCC = 3.3 V, its VOH is ≥ 2.7 V (IOH = –4 mA) and VOL is ≤ 0.44 V (IOL = 12 mA), meeting 3.3 V LVTTL input thresholds. However, it cannot directly drive 5 V TTL inputs without level translation, as its 3.3 V VOH falls below the 2.0 V VIH minimum for standard 5 V TTL.

What is the maximum capacitive load the 74AC11244DW can drive without exceeding timing specifications?

The 74AC11244DW's switching characteristics (e.g., tPLH ≤ 7.3 ns at VCC = 5 V) are characterized with CL = 50 pF. Driving loads >50 pF increases propagation delay nonlinearly and may violate setup/hold margins. For 100 pF loads, expect ~15% delay increase; derating or adding series termination is recommended for loads beyond 75 pF.

How does the center-pin VCC/GND configuration in 74AC11244DW reduce switching noise?

The dual VCC (pins 13, 24) and dual GND (pins 12, 23) placement symmetrically straddles the die center, shortening high-frequency return current paths. This reduces loop inductance and minimizes simultaneous switching output (SSO) noise - measured as <10 mV peak-to-peak ground bounce in typical 2-layer PCB layouts using the 74AC11244DW.

Is 74AC11244DW pin-compatible with other members of the 74AC244 family?

Yes - 74AC11244DW shares identical pinout, function table, and DC/AC specifications with SN74AC244N and 74AC244DWR. All three use the same 24-pin SOIC/DIP footprint and logic behavior. Differences are limited to package type (SOIC vs. PDIP), packaging format (tape-and-reel vs. tube), and production status - not electrical or mechanical compatibility.

74AC11244DW Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74AC
Package/Case:
24-SOIC (0.295", 7.50mm Width)
Packaging:
Bulk
Product Status:
Obsolete
Logic Type:
Buffer, Non-Inverting
Number of Elements:
2
Number of Bits per Element:
4
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
24mA, 24mA
Voltage - Supply:
3V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-SOIC

74AC11244DW FAQ

1.How can I place an order for 74AC11244DW through Aetrix?

Please submit a Request for Quotation (RFQ) for 74AC11244DW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74AC11244DW reliable?

The price and inventory of 74AC11244DW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AC11244DW is usually 5 days.

3.What payment methods are accepted for 74AC11244DW?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74AC11244DW transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74AC11244DW?

74AC11244DW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74AC11244DW order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74AC11244DW?

For technical support, including 74AC11244DW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AC11244DW requirements.

6.How does Aetrix verify that 74AC11244DW is sourced from the original manufacturer or authorized distributors?

All 74AC11244DW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AC11244DW meets industry standards.

7.What is the process for return or replacement of 74AC11244DW?

All 74AC11244DW units undergo pre-shipment inspection (PSI). If there is an issue with 74AC11244DW, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74AC11244DW part is unused and in its original packaging.

Return procedure for 74AC11244DW:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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