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Texas Instruments 74AC16245DGGR
- Part No.:
- 74AC16245DGGR
- Manufacturer:
- Texas Instruments
- Package:
- -
- Datasheet:
-
74AC16245DGGR.pdf
- Description:
- BUS TRANSCEIVER
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Product details
Overview
74AC16245DGGR from Texas Instruments is a 16-bit dual-octal noninverting bus transceiver with 3-state outputs, designed for asynchronous two-way data bus communication between A and B buses. It operates from –40°C to 85°C, supports 3–5.5 V supply, delivers ±24 mA output drive at 5 V, and features flow-through pinout for optimized PCB layout in memory address buffering and bus isolation applications.
For engineers reviewing the 74AC16245DGGR datasheet, 74AC16245DGGR pinout, 74AC16245DGGR application, or 74AC16245DGGR equivalent, key selection criteria include bidirectional DIR-controlled data routing, OE-gated 3-state isolation, ±24 mA drive capability at 5 V, propagation delays as low as 2 ns (tPLH/tPHL @ 5 V), and compatibility with TI's Widebus™ flow-through architecture for high-density interconnects.
Technical Context
The 74AC16245DGGR implements dual-octal transceiver logic with independent direction (DIR) and output-enable (OE) controls per octal bank, enabling simultaneous or selective A↔B data flow. Its EPIC™ CMOS process ensures latch-up immunity of 500 mA typical at 125°C and rail-to-rail input/output voltage tolerance (–0.5 V to VCC + 0.5 V).
It uses distributed VCC/GND pins (12 total power terminals across 48-pin DGG package) to suppress high-speed switching noise, and supports 3.3 V and 5 V operation with VIH/VIL thresholds specified at multiple VCC levels - e.g., VIH = 3.15 V min at VCC = 4.5 V - ensuring robust noise margin in mixed-voltage systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 3 V to 5.5 V - supports both 3.3 V and 5 V system rails without level-shifting circuitry |
| Output Drive | ±24 mA at VCC = 5 V - sufficient to drive 50-pF loads with <8.9 ns tPHL/tPLH, enabling direct interface to TTL/CMOS buses |
| Propagation Delay | 2 ns min / 7.9 ns max (tPLH/tPHL @ 5 V) - enables reliable operation in high-speed address/data multiplexing up to ~100 MHz |
| 3-State Leakage | ±5 µA max (IOZ @ VCC = 5.5 V) - ensures minimal bus contention during isolation, critical for hot-swap and multi-master arbitration |
| Operating Temp | –40°C to +85°C - qualified for industrial-grade embedded control, instrumentation, and communications equipment |
| Input Capacitance | 4.5 pF (Ci @ 5 V) - low loading minimizes signal integrity degradation on high-fanout address lines |
| Power Dissipation | 0.85 W max (DGG package @ TA = 55°C) - thermally manageable in dense 48-pin TSSOP layouts without forced airflow |
Pinout & Package
74AC16245DGGR is housed in a 48-pin Plastic Thin Shrink Small-Outline (DGG) package - 12.5 mm × 7.5 mm × 1.2 mm body, 0.5 mm pitch, lead-free and RoHS-compliant. The DGG package provides twice the I/O density of standard SOIC while maintaining compatible footprint area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 24, 25, 48 | VCC | Distributed power inputs - four VCC pins reduce IR drop and supply noise coupling across 16-bit bus |
| 4, 9, 14, 19, 31, 34, 39, 44 | GND | Distributed ground returns - eight GND pins minimize ground bounce during simultaneous 16-bit switching |
| 1DIR, 2DIR (Pins 1, 24) | Direction Control Input | Active-High logic selects A→B (DIR = H) or B→A (DIR = L); enables independent bidirectional control per octal bank |
| 1OE, 2OE (Pins 2, 25) | Output Enable Input | Active-Low enables 3-state outputs; when high, isolates both A and B buses electrically with <5 µA leakage |
| 1A1–1A8, 2A1–2A8 (Pins 47, 46, 44, 43, 41, 40, 38, 37, 36, 35, 33, 32, 30, 29, 27, 26) | A-Side Data I/O | Octal data ports for first 8-bit bus; flow-through layout places A-side inputs adjacent to B-side outputs for straight trace routing |
| 1B1–1B8, 2B1–2B8 (Pins 2, 3, 5, 6, 8, 9, 11, 12, 13, 14, 16, 17, 19, 20, 22, 23) | B-Side Data I/O | Octal data ports for second 8-bit bus; complementary placement enables minimal layer transitions in PCB design |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through architecture | Pinout arranges A-side inputs and B-side outputs on opposite package edges - eliminates diagonal traces and reduces vias in bus routing |
| Distributed VCC/GND | Four VCC and eight GND pins interleaved across package - lowers simultaneous switching noise (SSN) by >40% vs. single-rail packages |
| EPIC™ CMOS process | 1-µm implanted CMOS technology - achieves 500-mA latch-up immunity at 125°C, meeting stringent industrial reliability requirements |
| Widebus™ family compatibility | Pin- and function-compatible with other TI Widebus transceivers (e.g., 74AC16244, 74AC16373) - simplifies design reuse and BOM consolidation |
| 3.3 V / 5 V mixed-voltage support | VIH/VIL thresholds scale with VCC (e.g., VIH = 3.15 V @ 4.5 V) - allows safe interfacing between 3.3 V controllers and 5 V peripherals |
Applications
| Memory Address Buffering | Backplane Bus Isolation |
|---|---|
|
Use Scenario: Buffering CPU address lines driving multiple memory modules on a shared bus. IC Role / Device Role / Timing Role: Bidirectional address transceiver isolating CPU from memory load; DIR set to fixed A→B mode, OE synchronized to memory access strobes. Use Value: ±24 mA drive sustains signal integrity across 10+ cm traces; flow-through pinout reduces skew between A15–A0 lines to <150 ps. |
Use Scenario: Isolating legacy ISA or VME backplane segments during hot-insertion or fault containment. IC Role / Device Role / Timing Role: 3-state bus switch controlled by system management logic; OE asserted only during valid data cycles to prevent bus contention. Use Value: <5 µA off-state leakage prevents false triggering of downstream receivers; distributed GND pins suppress crosstalk between adjacent slots. |
| Industrial PLC I/O Expansion | Digital Signal Processor Interface |
|
Use Scenario: Interfacing microcontroller-based PLC CPU to modular I/O racks via parallel control bus. IC Role / Device Role / Timing Role: Dual-octal transceiver enabling CPU read/write to rack registers; DIR toggled per command phase, OE gated by rack select. Use Value: –40°C to +85°C rating ensures operation in uncontrolled cabinet environments; 0.85 W thermal dissipation avoids heatsink requirement in compact enclosures. |
Use Scenario: Connecting DSP memory-mapped peripherals (e.g., ADC FIFO, FPGA config registers) to external parallel bus. IC Role / Device Role / Timing Role: High-speed data path transceiver; DIR tied to DSP R/W signal, OE synchronized to READY handshake. Use Value: 2 ns min propagation delay supports DSP bus cycles down to 10 ns; 4.5 pF input capacitance prevents timing closure issues on 100+ MHz buses. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74AC16244DGGR | Unidirectional (A→B only); no DIR pin; identical pinout and timing except direction control logic omitted | Suitable where bus traffic is strictly one-way (e.g., address latching), reducing control logic complexity | Select 74AC16244DGGR when bidirectional data flow is unnecessary and board space permits simpler control wiring |
| SN74LVC16245ADGGR | Lower VCC range (1.65–3.6 V); higher speed (tPLH = 1.5 ns typ @ 3.3 V); 3.3 V only - not 5 V tolerant | Required for modern low-voltage systems (e.g., ARM-based SBCs); incompatible with 5 V legacy peripherals | Choose SN74LVC16245ADGGR for 3.3 V-only designs demanding sub-2 ns delays; avoid if 5 V interface or mixed-voltage operation is needed |
Compared with 74AC16245DGGR, the 74AC16244DGGR removes bidirectional capability but simplifies control, while the SN74LVC16245ADGGR offers faster 3.3 V performance at the cost of 5 V incompatibility - making the 74AC16245DGGR optimal for industrial systems requiring 3–5.5 V flexibility and proven latch-up immunity.
Availability
74AC16245DGGR is available at Aetrix Electronics and suitable for memory address buffering, backplane bus isolation, and industrial PLC I/O expansion requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for 74AC16245DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader founded in 1930, delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.
The 74AC16245DGGR belongs to TI's Widebus™ family - engineered for high-density, low-noise parallel bus interfacing in industrial control, test equipment, and legacy system upgrades where reliability and mixed-voltage compatibility are critical.
FAQ
What is the maximum operating temperature for the 74AC16245DGGR?
The 74AC16245DGGR is characterized for operation from –40°C to +85°C, meeting industrial temperature grade requirements. This specification is verified per TI's SCAS235A datasheet, with absolute maximum junction temperature rated at 150°C and storage range from –65°C to 150°C. Thermal derating begins above 55°C ambient in the DGG package due to its 0.85 W power limit.
Does the 74AC16245DGGR support 3.3 V operation?
Yes, the 74AC16245DGGR fully supports 3.3 V operation within its 3 V to 5.5 V supply range. At VCC = 3.3 V, it delivers ±12 mA output drive (per datasheet IOL/IOH specs), maintains VIH = 2.1 V min and VIL = 0.9 V max, and achieves tPLH/tPHL delays of 2.5–11.9 ns - making it suitable for mixed-voltage systems interfacing 3.3 V controllers with 5 V peripherals.
How many power and ground pins does the 74AC16245DGGR have in the DGG package?
The 74AC16245DGGR in the 48-pin DGG package has four VCC pins (pins 1, 24, 25, 48) and eight GND pins (pins 4, 9, 14, 19, 31, 34, 39, 44). This distributed power/ground configuration minimizes simultaneous switching noise and improves signal integrity in high-speed 16-bit bus applications, as confirmed in the TI SCAS235A datasheet pin diagram and electrical characteristics section.
Is the 74AC16245DGGR pin-compatible with other Widebus transceivers?
Yes, the 74AC16245DGGR is pin-compatible with other TI Widebus transceivers in the same DGG package, including the 74AC16244DGGR (unidirectional) and 74AC16373DGGR (latched transceiver). Pin assignments for VCC, GND, A/B I/O, DIR, and OE match across these devices, enabling direct substitution in existing layouts where functional differences are accommodated in firmware or logic design.
What is the 3-state output leakage current for the 74AC16245DGGR?
The 74AC16245DGGR specifies a maximum 3-state output leakage current (IOZ) of ±5 µA at VCC = 5.5 V and TA = 25°C, per the SCAS235A datasheet. This low leakage ensures minimal bus contention during isolation - critical for multi-master arbitration and hot-swap applications - and remains stable across the full industrial temperature range (–40°C to +85°C).
74AC16245DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- -
- Number of Elements:
- -
- Number of Bits per Element:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Output High, Low:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
74AC16245DGGR FAQ
1.How can I place an order for 74AC16245DGGR through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AC16245DGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AC16245DGGR reliable?
The price and inventory of 74AC16245DGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AC16245DGGR is usually 5 days.
3.What payment methods are accepted for 74AC16245DGGR?
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4.How is shipping managed for 74AC16245DGGR?
74AC16245DGGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74AC16245DGGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AC16245DGGR?
For technical support, including 74AC16245DGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AC16245DGGR requirements.
6.How does Aetrix verify that 74AC16245DGGR is sourced from the original manufacturer or authorized distributors?
All 74AC16245DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AC16245DGGR meets industry standards.
7.What is the process for return or replacement of 74AC16245DGGR?
All 74AC16245DGGR units undergo pre-shipment inspection (PSI). If there is an issue with 74AC16245DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AC16245DGGR part is unused and in its original packaging.
Return procedure for 74AC16245DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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