NXP Semiconductors 74AHC2G00GD,125

Overview

74AHC2G00GD,125 from Nexperia is a dual 2-input NAND gate in XSON8 (SOT996-2) package, operating across 2 V–5.5 V supply with CMOS input thresholds. It delivers symmetrical output impedance, balanced propagation delays (typ. 3.5 ns at 5 V, CL = 15 pF), and high noise immunity. Used in level-shifting logic interfaces, bus buffering, and control signal conditioning in industrial microcontroller peripherals.

For engineers reviewing the 74AHC2G00GD,125 datasheet, 74AHC2G00GD,125 pinout, 74AHC2G00GD,125 application, or 74AHC2G00GD,125 equivalent, this device supports low-power, high-speed combinational logic in space-constrained PCBs where TSSOP8/VSSOP8 footprints are unsuitable - especially where thermal performance and board area efficiency are critical.

Technical Context

The 74AHC2G00GD,125 implements two independent NAND gates using high-speed Si-gate CMOS technology. Its input switching levels conform to CMOS thresholds (VIH ≥ 3.85 V at VCC = 5.5 V; VIL ≤ 1.65 V), enabling interoperability with 3.3 V and 5 V logic families without level shifters.

It operates over -40 °C to +125 °C ambient temperature, with static output drive capability of ±8 mA at VCC = 4.5 V and dynamic power dissipation capacitance of 17 pF per gate - directly determining dynamic power consumption under switching loads.

Key Specifications

Pinout & Package

XSON8 (SOT996-2) plastic ultra-thin small outline no-lead package; 8 terminals; body size 2.0 mm × 1.25 mm × 0.5 mm; exposed thermal pad; lead pitch 0.5 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual NAND gate applications.

Compared with 74LVC2G00GW,125 and SN74LVC2G00DCKR, the 74AHC2G00GD,125 uniquely combines extended temperature operation, lowest ICC, and thermally enhanced XSON8 packaging - making it optimal for industrial and automotive-adjacent control logic where reliability and power efficiency are co-prioritized.

Availability

74AHC2G00GD,125 is available at Aetrix Electronics and suitable for industrial PLC I/O conditioning, USB hub power control, and automotive body control module designs requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74AHC2G00GD,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies - delivering high-performance, reliable logic, discrete, and MOSFET solutions for automotive, industrial, and mobile markets.

The 74AHC2G00GD,125 belongs to Nexperia's AHC logic family, engineered for high-speed, low-power CMOS compatibility across wide supply and temperature ranges - specifically targeting space- and power-constrained embedded control applications.

FAQ

What is the maximum recommended operating frequency for 74AHC2G00GD,125?

The device has no specified maximum clock frequency since it is a combinational logic gate, not a sequential element. However, its typical propagation delay of 3.5 ns at 5 V and 15 pF load implies reliable operation up to ~100 MHz in feedback-free logic paths. System-level timing depends on trace capacitance, fan-out, and driving source strength - verified via SPICE simulation or board-level measurement.

Can 74AHC2G00GD,125 interface directly with 3.3 V microcontrollers and 5 V peripherals?

Yes. With a 3.3 V supply, its VOH exceeds 2.9 V (min at IO = –4 mA) and VOL stays below 0.36 V (max at IO = 4 mA), satisfying both 3.3 V CMOS input thresholds and 5 V TTL input requirements. At 5 V supply, VIH = 3.85 V and VIL = 1.65 V ensure compatibility with 3.3 V outputs when used with appropriate pull-ups or level-aware design.

Is the exposed pad (EP) electrically connected, and how should it be handled on the PCB?

Yes, the EP is internally connected to GND. It must be soldered to a dedicated GND copper pour with ≥4 thermal vias (0.3 mm diameter) to an inner or bottom-layer ground plane. Leaving it unconnected degrades thermal performance by ~30% and increases junction temperature - risking parametric shift above 85 °C ambient. No isolation or floating connection is permitted.

Does 74AHC2G00GD,125 support partial power-down or I/O isolation when VCC = 0 V?

No. The device lacks Ioff protection or power-down mode. When VCC = 0 V, input/output pins exhibit undefined leakage behavior (II ≤ 2.0 μA per pin), and applying signals to inputs or outputs may cause unintended current flow through internal ESD diodes. Always power VCC before asserting signals - use external series resistors if hot-insertion is required.