Nexperia USA Inc. 74AHC30BQ-Q100X

Overview

74AHC30BQ-Q100 from Nexperia is an automotive-grade 8-input NAND gate in DHVQFN14 package, operating from -40 °C to +125 °C with CMOS-level inputs, 3.6 ns typical propagation delay at 5 V/15 pF, and AEC-Q100 Grade 1 qualification. It performs logic-level signal combination in powertrain control units, ADAS sensor fusion modules, and body electronics where high noise immunity and rail-to-rail input tolerance are required.

For engineers reviewing the 74AHC30BQ-Q100 datasheet, 74AHC30BQ-Q100 pinout, 74AHC30BQ-Q100 application, or 74AHC30BQ-Q100 equivalent, key selection criteria include input voltage compatibility (up to V_CC + 0.5 V), Schmitt-trigger input hysteresis, side-wettable flank package for AOI, and guaranteed operation across full automotive temperature range.

Technical Context

This device implements a single 8-input NAND logic function with balanced t_PLH/t_PHL propagation delays and input thresholds referenced to 0.5×V_CC. All eight inputs feature Schmitt-trigger action, enabling robust noise rejection on slow or noisy signals.

It operates under JEDEC standard No. 7-A and supports dual supply domains: 2.0–5.5 V for 74AHC30 variants and 4.5–5.5 V for TTL-compatible 74AHCT30 variants. The DHVQFN14 package provides thermal enhancement via exposed die pad while maintaining pin compatibility with SO14 and TSSOP14 footprints.

Key Specifications

Pinout & Package

DHVQFN14 (SOT762-1) package: 2.5 × 3.0 × 0.85 mm body, no leads, side-wettable flanks for automated optical inspection, thermally enhanced exposed pad (non-electrical unless connected to GND).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-input NAND gate applications.

Compared with 74AHC30BQ-Q100, the 74AHCT30BQ-Q100 offers TTL compatibility at the cost of reduced voltage flexibility, while SN74LVC10APWRE4 trades automotive qualification and wide-VCC support for lower power and smaller size-making the original the sole choice for production automotive logic interfacing.

Availability

74AHC30BQ-Q100 is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, body control modules, and electric power steering systems requiring stable component supply across long production lifecycles and stringent automotive quality standards.

Supply support for 74AHC30BQ-Q100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance logic, analog, and MOSFET solutions optimized for efficiency, reliability, and miniaturization in automotive, industrial, and mobile markets.

The 74AHC/AHCT-Q100 series was developed specifically to meet AEC-Q100 Grade 1 requirements for automotive logic functions, emphasizing robustness, wide temperature operation, and seamless integration into safety-critical electronic control units.

FAQ

Is the exposed thermal pad on the DHVQFN14 package electrically connected?

No-the exposed pad (terminal 1 index area) has no electrical connection to internal circuitry. Per datasheet note, it may remain floating or be soldered to GND solely for thermal conduction; if connected, it must not introduce noise coupling into sensitive analog sections of the PCB.

Can 74AHC30BQ-Q100 safely interface with 5 V TTL outputs without level shifters?

No-74AHC30BQ-Q100 requires CMOS-level inputs (VIH ≥ 0.7×VCC). With VCC = 3.3 V, VIH min = 2.31 V, which is insufficient for reliable recognition of 5 V TTL high (2.0 V min). Use 74AHCT30BQ-Q100 instead, whose TTL-compatible inputs accept 2.0 V as valid HIGH at 5 V supply.

What is the maximum capacitive load this device can drive while maintaining specified propagation delay?

The datasheet specifies t_pd values up to 50 pF (e.g., 8.0 ns max at 5 V/50 pF). Driving loads >50 pF increases delay nonlinearly and may cause output rise/fall time degradation; for >50 pF, add a buffer stage or reduce trace length and parallel stubs to stay within 15–50 pF design window.

Are pins 2, 9, 10, and 13 internally connected or truly unconnected?

All four pins (2, 9, 10, 13) are confirmed as no-connect (n.c.) terminals-no bond wires, no internal routing, and no electrical function. They serve mechanical stabilization and package symmetry; leaving them unconnected poses no risk, but grounding improves thermal dissipation in high-power-density layouts.