Nexperia USA Inc. 74AHCT00PW,112

Overview

74AHCT00PW,112 from Nexperia is a quad 2-input NAND gate IC with TTL-compatible input thresholds, operating from 4.5 V to 5.5 V supply, featuring overvoltage-tolerant inputs up to 5.5 V, balanced propagation delays (typ. 3.3 ns at 5 V/15 pF), and Schmitt-trigger inputs for noise immunity - deployed in level translation and logic interfacing within industrial control backplanes.

For engineers reviewing the 74AHCT00PW,112 datasheet, 74AHCT00PW,112 pinout, 74AHCT00PW,112 application, or 74AHCT00PW,112 equivalent, key selection criteria include TTL-level input compatibility, -40 °C to +125 °C operation, TSSOP14 package thermal performance, and verified overvoltage tolerance for mixed-voltage board interconnects.

Technical Context

The 74AHCT00PW,112 implements four independent NAND gates with identical input/output characteristics across all channels. Its TTL-level input thresholds (VIH = 2.0 V min, VIL = 0.8 V max at VCC = 4.5–5.5 V) ensure direct compatibility with legacy 5 V TTL logic families while maintaining CMOS output drive capability (VOH ≥ 3.7 V at IO = –8 mA, VOL ≤ 0.55 V at IO = 8 mA).

Each gate exhibits matched propagation delay symmetry (tPLH ≈ tPHL), with typical values of 3.3 ns (15 pF load, 5 V) and 4.5 ns (50 pF load, 5 V). Input clamping and ESD protection (HBM > 2000 V, CDM > 1000 V) are integrated, and all inputs support Schmitt-trigger hysteresis for robust signal conditioning in noisy environments.

Key Specifications

Pinout & Package

TSSOP14 plastic thin shrink small outline package (SOT402-1); 14 leads; body width 4.4 mm; 0.65 mm lead pitch; exposed pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad NAND gate applications.

Compared with 74AHCT00D,112, the 74AHCT00PW,112 offers 30 % smaller footprint and improved thermal dissipation in surface-mount production; versus SN74AHCT00PWR, it provides superior CDM robustness for high-volume automated assembly with aggressive ESD control requirements.

Availability

74AHCT00PW,112 is available at Aetrix Electronics and suitable for industrial PLC I/O modules, legacy system bus interfaces, and power sequencing control requiring stable component supply across extended temperature ranges and high-reliability manufacturing cycles.

Supply support for 74AHCT00PW,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency-enhancing components, delivering high-performance logic, discrete, and MOSFET solutions with emphasis on reliability and manufacturability.

The 74AHCT series targets industrial and consumer applications requiring TTL-compatible logic with CMOS power efficiency and extended temperature resilience - designed specifically for robust interoperability in mixed-voltage digital systems.

FAQ

Is 74AHCT00PW,112 pin-compatible with 74AHC00PW,112?

Yes - both share identical TSSOP14 pinout and logic function, but differ in input threshold levels: 74AHCT00PW,112 uses TTL-compatible inputs (VIH ≥ 2.0 V), while 74AHC00PW,112 uses CMOS thresholds (VIH ≥ 3.85 V at VCC = 5.5 V). Swapping requires verifying source driver compatibility.

Can 74AHCT00PW,112 operate at 3.3 V supply?

No - the 74AHCT00 variant is specified only for 4.5 V to 5.5 V operation. At 3.3 V, input thresholds become undefined and output drive degrades significantly. For 3.3 V systems, use 74AHC00PW,112 instead, which supports 2.0 V to 5.5 V with CMOS input levels.

What is the maximum capacitive load this device can drive reliably?

The device is characterized up to 50 pF load capacitance, with propagation delay increasing from 3.3 ns (15 pF) to 4.5 ns (50 pF) at 5 V. Driving >50 pF risks timing violations and increased dynamic power; for heavier loads, add a buffer stage or reduce trace length and parasitic capacitance.

Does the TSSOP14 package require thermal pad soldering?

No - the SOT402-1 package has no exposed thermal pad. Unlike QFN variants (e.g., SOT762-1), the TSSOP14 relies on lead-frame conduction; standard reflow profile and 0.65 mm pitch stencil design are sufficient for reliable assembly without thermal land requirements.